World leader in Load Cells, Torque Sensors, Pressure Sensors, Signal Conditioners, Digital Displays, and Sensor System products. The one stop source for all your sensor needs. Custom design available. Well-known for short lead-time & customer support
Opti Pro 3 optimizes the production planning routine by calculating the order of product production in the most efficient manner possible. Set up times will be dramatically reduced with this tool. Plus Opti Pro 3 will generate all necessary forms of
For placing and reworking mBGA, BGA and QFP devices: 1. Placement and reflow head in one position 2. Motorized Z-movement 3. Repeatable placement 4. Placement pressure control 5. Up to 35X magnification 6. Image splitter for simultaneous four s
Electronics Forum | Sun Nov 07 10:54:21 EST 1999 | Steve Thomas
We're looking at redesigning our stencils to facilitate better (well, it's pretty much non-existant, so any improvement is a big leap) release from fine pitch apertures. Currently we have perpendicular walled laser cut apertures. We'll be having
Electronics Forum | Sat Mar 23 23:07:02 EDT 2013 | dhanish
I have a question on component placement 1)for solder paste ,do we need to press the component into solder paste during placement process? 2)how we define force for Smt component..sometimes we add force for certain BGA?any guideline? Pls advise
Used SMT Equipment | Pick and Place/Feeders
With the SIPLACE SX we have made our most successful placement solution even better: Capacity on Demand: Scale the performance of your SMT lines up or down as needed – quickly and easily The SIPLACE SpeedStar for high-speed and placement of component
Used SMT Equipment | Pick and Place/Feeders
With the SIPLACE SX we have made our most successful placement solution even better: Capacity on Demand: Scale the performance of your SMT lines up or down as needed – quickly and easily The SIPLACE SpeedStar for high-speed and placement of component
Industry News | 2021-09-02 06:10:22.0
MIRTEC announces the release of their comprehensive AI based Smart Factory Automation solution 'INTELLI-PRO'. This Technologically Advanced Software and Algorithm Package is specifically designed for the purpose of improving the performance and convenience of MIRTEC's complete line of AOI machines. INTELLI-PRO consists of a proprietary Deep Learning based Automatic Part Search and Teaching function, and AI based; Automatic Parameter Optimization, Character Recognition (OCR), Foreign Object Detection (FOD), Placement Inspection Algorithms and an Automatic Defect Type Classification function.
Industry News | 2010-05-20 12:47:37.0
GAINESVILLE, GA ― Count On Tools Inc., a leading provider of precision components and SMT spare parts, introduces Universal Instruments’ GSM special low force (spring suspended) nozzle with replaceable tips for delicate components. Count On Tools’ new low force nozzles are ideal for gaas die, gallium arsenide, thin silicone (less than 0.10" in thickness), die with air bridges and flip chips.
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Parts & Supplies | Pick and Place/Feeders
00314164-01 Siemens placement machine parts We also supply following Siemens SMT spare parts: 03026287-01 AIR DISTRIBUTOR Unit S25HM2 cpl. 03026511-01 CAN-BUS:EXTENSION INTERFACE 03027255S03
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Parts & Supplies | Pick and Place/Feeders
AF8X4 Mechanical Feeder Our main products are [second-hand high-speed placement machine, smt second-hand placement machine, second-hand automatic placement machine, reflow, JUKI placement machine] and so on. Our company I is one of the largest supp
Technical Library | 2007-06-27 15:43:06.0
Traditionally most flip chips were designed with large bumps on a coarse pitch. However, as the trend towards smaller, more compact assemblies continues the sizes of semiconductor packages are forced to stay in line. New designs are incorporating smaller bump diameters on increasingly aggressive pitches, and in many cases decreasing the total IO count. With fewer and smaller bumps to distribute the load of the placement force it is becoming increasingly vital for equipment manufacturers to meet the challenge in offering low force placement solutions. One such solution will be presented in the following discussion. Also presented will be ways to minimize the initial impact spike that flip chips experience upon placement.
Technical Library | 2021-09-15 18:58:01.0
Mathematical model for dynamic force analysis of printed circuit boards has been designed to calculate dynamic deformations and stresses in printed circuit boards and assess their dynamic strength and rigidity. The represented model describes a printed circuit board as a separate oscillatory system, which is simulated as prismatic beam set on two oscillating supports. Simulation and assessment of stress and deflection in printed circuit boards and obtaining their amplitude frequency responses provided recommendations, which ensure strength and stiffness of printed circuit boards subjected to dynamic loads..
JUKI feeder calibration---ZK Electronic Technology Co., Limited
Description SIPLACE HS-60 Placement Station Performance Specification ● Placement rate: 60,000 cph ● Placement accuracy: +/- 0.080mm@ 4 sigma ● Component sizes: up to 19.0mm x 19.0mm (0201 chips to PLCC44) ● PCB Dimms (Single conveyor): 50 x 50
Events Calendar | Thu Jun 13 00:00:00 EDT 2024 - Thu Jun 13 00:00:00 EDT 2024 | Melbourne, Florida USA
Space Coast Event: Maximizing Automation Efficiency: Are You Making the Most of Your Investment?
Events Calendar | Wed Mar 07 00:00:00 EST 2018 - Wed Mar 07 00:00:00 EST 2018 | ,
Solder Paste Qualification Testing - SMTA Webinar
Career Center | Houston, Texas USA | Engineering
Our South Houston client is looking to hire a Senior Mechanical Engineer on a direct hire basis. Job Summary: Perform the complete mechanical design required for both proprietary and non-proprietary projects. Assist with technical mechanical suppo
Career Center | melbourne, Australia | Engineering,Maintenance,Management,Production
A long established First Tier supplier to the Australian car industry, this company is now also an emerging force in the design and manufacture of automotive electronics systems to the world automotive market. Electronics production is state of th
Career Center | Lakewood, California USA | Engineering,Management,Production
Previous management / supervisor experience. Quality conscious, detail oriented supervisor / manager, with hands on approach to customer service Motivated with excellent communication skills and a dedicated team player. Qualifications include:
Career Center | Lakewood, California USA | Engineering,Maintenance,Management,Production
Quality conscience, detail oriented, manufacturing engineer, with a hands on approach to overall process improvement and development. Motivated with excellent communication skills and a dedicated team player. Qualifications include: � Safety /Diver
SMT Express, Volume 2, Issue No. 3 - from SMTnet.com Volume 2, Issue No. 3 Thursday, March 16, 2000 Featured Article Return to Front Page Stencil Design for Mixed Technology Through-hole / SMT Placement and Reflow by William E. Coleman, Photo
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/v2020-calculation-in-v2019_topic2579.html
V2020 calculation in V2019 - PCB Libraries Forum Forum Home > PCB Footprint Expert > Questions & Answers New Posts FAQ Search Events Register Login V2020 calculation in V2019
GPD Global | https://www.gpd-global.com/co_website/pdf/pbt/PBFT-VS-SPC-User-Guide-20121110-PBT-002P-FORCEWare-v5-6-0.pdf
Peel Back Force Tester User Guide PBFT VS SPC User Guide for Peel Back Force Tester with SPC Capability Model PBFTVS.USB700 with FORCEWare™ Software, ver
