Electronics Forum | Fri Mar 23 03:41:19 EDT 2012 | grahamcooper22
try Almit Sn62 HM1 RMA V14L ....its the best no clean lead paste for wetting...I sell it and it has solved wetting problems many times when users have used other pastes
Electronics Forum | Thu Mar 22 13:06:50 EDT 2012 | smtmfgeng
Does anyone have any insight on alternatives to Indium NC-SMQ 92J solder paste for minimizing poor wetting on parts with oxidized leads (see datasheet here: http://www.dtsprocess.com/contents/articlefiles/6-SMQ92j.pdf). I am considering setting up a
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Technical Library | 2016-05-26 15:07:36.0
The oxide layers are known as wetting inhibitors in component and PCB metallizations. The oxide acts as barrier that prevent the tin diffusion from happening. Besides, in corrosion studies, the role of salt residues -with Cl ion- on some metals is known as being promoters of oxidation or corrosion. On the other hand, most of corrosion studies with tin metallization are focused mainly on the corrosion resistance of tin alloys, but little has been done respecting to the influence of salts on tin metallization wetting. In this paper, a series of experiments was carried over to know the influence of specifically NaCl on BGA wetting given Head in Pillow (HiP) as result.
Technical Library | 2016-11-30 21:30:50.0
Mid-chip solder balling is a defect typically associated with solder paste exhibiting poor hot slump and/or insufficient wetting during the reflow soldering process, resulting in paste flowing under the component or onto the solder resist. Once molten, this solder is compressed and forced to the side of the component, causing mid-chip solder balling.This paper documents the experimental work performed to further understand the impact on mid-chip solder balling from both the manufacturing process and the flux chemistry.
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SMT Express, Issue No. 3 - from SMTnet.com Volume 1, Issue No. 3 Wednesday, August 18, 1999 Featured Article Return to Front Page BGA REWORK Earl Moon Proof Of Design (POD) COMPARE PART SQUARENESS TO BOARD'S SILK-SCREEN OR TRACES A part
Surface Mount Technology Association (SMTA) | https://www.smta.org/southeast-asia/
. Many of us would agree that we are still facing challenges on one of the common defects – poor barrel fill. The problem is confounded with currently High density/Multilayer thick PCB and applying Lead-free soldering
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