Industry Directory | Manufacturer
Golden State is a contract manufacturer that makes wire harnesses, electromechanical assemblies (box builds, subassemblies, PCBAs, kits, etc.) and services (sorting, rework, value additive manufacturing engineering)
Industry Directory | Manufacturer
LCL Electronics is a UK-based contract electronics manufacturer (CEM), offering customers a full turnkey manufacturing solution, including prototype, pre-production and medium volumes of PCBs, product build and cable harnessing.
The world-class precision and quality Spectrum® II system for assembly of mobile electronics, semiconductors, MEMS, and PCBs High Speed, High Accuracy, Precision Dispensing System. Higher consistency leads to higher yield and maximum profitability
New Equipment | Board Handling - Storage
The basic unit for these PCB racks holds 32 boards up to 6.7" (170mm) long. Modules can be assembled side by side to hold longer Printed Circuit Cards. Standard extrusions allow card width of 0 to 10.25". For wider cards, extrusions can be cut to cus
Electronics Forum | Thu May 18 20:47:14 EDT 2000 | Dave F
Ed: It might be possible, never tried tho, but if an engineer wandered in, talking about it ... Printing: Makes me pretty nervous, because punched boards are not planar, don�t stay planar, and are inconsistently not planar. If I could work-out th
Electronics Forum | Wed Nov 06 13:01:54 EST 2002 | cvrgirl
Hi, Has anyone experience BGA caps/plugs popped off after assembly on a double sided board? Only the caps on the primary side popped off and exposing copper. thanks! Michelle
Used SMT Equipment | Turnkey Lines
Functional Pre-Owned Complete SMT Assembly Line - Still Operational (Subject to prior sell, I am listing this on other venues) Up for sale is a full turnkey SMT line and all of it's accessories, of which there are a lot, fe
Industry News | 2012-07-12 10:34:27.0
The SMTA announced that it will have a Package-on-Package (PoP) Design and Assembly Center during their annual conference, SMTA International, taking place October 14-18, 2012 in Orlando, Florida.
Industry News | 2012-07-12 10:34:54.0
The SMTA announced that it will have a Package-on-Package (PoP) Design and Assembly Center during their annual conference, SMTA International, taking place October 14-18, 2012 in Orlando, Florida.
Parts & Supplies | Board Cleaners
engine accessory ai rubber hose silicone rubber hose combusition engines Specifications high quality custom cnc machining aluminum metal part products Item high quality custom cnc machining aluminum metal part products Material Stainless Steel
Parts & Supplies | Assembly Accessories
FUJI NXT NOZZLE H01 PLACING HEAD Part Number Description fuji AA0AS00 Nozzle 1.0 fuji AA06800 Nozzle 1.3 fuji AA0HL00 Nozzle 1.8 fuji AA0HM00 Nozzle 2.5 fuji AA0HN00 Nozzle 3.7 fuji AA0HR01 Nozzle 5.0 fuji AA08000 Nozzle 7.0 fuji AA
Technical Library | 2014-05-12 09:24:11.0
With the advancement of the electronic industry, Package on package (POP) has become increasingly popular IC package for electronic devices, particularly in mobile devices due to its benefits of miniaturization, design flexibility and cost efficiency. However, there are some issues that have been reported such as SIR drop due to small gap between top and bottom components, difficulty underfilling and rework due to stacked IC components and process yield issues. Some suppliers have reported using some methods such as dipping epoxy paste or epoxy flux to address these issues, but so far, no customer has reported using these methods or materials in their mass production. In order to address these issues for POP assembly, YINCAE has successfully developed a first individual solder joint encapsulant adhesive.
Technical Library | 2021-12-16 01:52:32.0
Package on Packages (PoP) find use in applications that require high performance with increased memory density. One of the greatest benefits of PoP technology is the elimination of the expensive and challenging task of routing high-speed memory lines from under the processor chip out to memory chip in separate packages. Instead, the memory sits on top of the processor and the connections are automatically made during assembly. For this reason PoP technology has gained wide acceptance in cell phones and other mobile applications. PoP technology can be assembled using one-pass and two-pass assembly processes. In the one-pass technique the processor is first mounted to the board, the memory is mounted to the processor and the finished board is then run through the reflow oven in a single pass. The two-pass technique has an intermediate step in which the memory is first mounted onto the processor.
With the Spectrum II's new Precision Z-axis, smaller dots and thinner solder paste lines can be achieved. This capability is standard on all Spectrum II systems and replaces the Precision Z option on the older Axiom products. In order to achieve su
Career Center | BANGALORE, India | Engineering,Maintenance,Production
Hi, I have 8 years experience in electronics manufacturing company. I have good knowledge in SMT process and equipment maintenance.i successfully completed more than 200 NPI's. I have good knowledge in SMT machine programming and maintenance
Career Center | Rochester, New York USA | Engineering
I have done my undergraduate studies in Mechanical Engineering. I am pursuing my Master's Program in Electronics Packaging. I am currently working as a Research Assistant for RIT-CEMA (Center for Electronics Manufacturing and Assembly). My research
SMTnet Express, December 16, 2021, Subscribers: 26,148, Companies: 11,476, Users: 26,983 Assembly and Rework of Lead Free Package on Package Technology Miniaturization continues to be a driving force in both integrated circuit
SMTnet Express, December 13, 2018, Subscribers: 31,514, Companies: 10,659, Users: 25,503 Assembly Reliability of TSOP/DFN PoP Stack Package Credits: Jet Propulsion Laboratory Numerous 3D stack packaging technologies have been implemented
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/industries/electronics-assembly-and-packaging?con=t&page=7
Electronics - Assembly & Packaging | Nordson DAGE X-Ray Inspection and Test Products Corporate | Global Directory | Languages Division Only All of Nordson Home Products Bondtesting Systems Micro Materials Testing Wafer Inspection and Metrology X-ray Inspection Systems X-ray Counting Systems Applications Battery
| https://www.eptac.com/faqs/soldertips/soldertip/soldertips-printed-circuit-board-bow-and-twist-showing-up
. This assembly has a 40mm PoP BGA component on it with an integrated heat sink. Question: We have recently started to see board flexing in one of our circuit board assemblies
Golden State is a contract manufacturer that makes wire harnesses, electromechanical assemblies (box builds, subassemblies, PCBAs, kits, etc.) and services (sorting, rework, value additive manufacturing engineering)
18220 Butterfield Blvd
Morgan Hill, CA USA
Phone: 5102268155
