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Industry Directory | Manufacturer
We are world leaders in the Selective Soldering industry, dedicated to developing pioneering technologies, such as our patented 1.5mm Micro Nozzle, to reflect and match the needs of an everchanging manufacturing marketplace.
Industry Directory | Manufacturer
Manufacturer of Fluid Dispensing Equipment for Selective Conformal Coating, Potting, Encasulation & Underfill including Inspection, Conveying and Curing. Total Solution Fluid Dispensing & Conformal Cocating Process Lines.
Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl
ASYMTEK Quantum Q-6800 High-Value Fluid Dispensing System. ASYMTEK Quantum Q-6800 Series. A high-value fluid dispensing solution for demanding applications. Large dispense area (423 x 458 mm) for varied substrate sizes Supports CSP, BGA, and boa
Electronics Forum | Tue Dec 16 09:01:52 EST 2003 | tds
What model is your Hollis? Does it have the coil heater?
Electronics Forum | Tue Dec 16 21:17:48 EST 2003 | Peter
Maybe you fixture is too large for your product. If so, please redesign your fixture
Used SMT Equipment | Soldering Equipment/Fluxes
Model: FlexSolder W620 Vintage: 2012 (demo’ed only, never used!) Description: Inline soldering system. (With servo driven XYZ gantry, and tilt able gripper from 0° to 7° degrees for direct PCB handling) Details: • Spray fluxer •
Used SMT Equipment | Soldering - Selective
Vintage: 2010 Details: • Dual Solder Pot (Lead and Lead-Free) • Windows XP Operating System • Top Side Pre Heat • Bottom Side Pre Heat • Spray Fluxer • Includes Step down transformer • Includes (2) 8MM Nozzles Condition: Complete
Industry News | 2020-03-25 11:55:11.0
The Surface Mount Technology Association (SMTA) announced the recent release of Selective Soldering 101, the latest in a series of online training courses on the fundamentals of electronics assembly. The course will be useful for equipment operators, technicians, and engineers new to the industry that want to understand more about the soldering process and who have a basic familiarity with the equipment.
Industry News | 2018-10-18 08:17:09.0
How to Prevent Solder Joint Voiding and Cold Solder Defects during the SMT Reflow Process
Parts & Supplies | Soldering - Reflow
Manufacturer: Rehm Typer: V8 Nitro 3.8 Vintage: 2002 Serial number: 1009 Condition and equipment We have this unit as backup machine, haven't used for a while. 7 zones (5 pre-heat, 2 peak + cooling zone) Transport rail refurbish
Technical Library | 2016-01-12 11:01:25.0
More and more Land Grid Array (LGA) components are being used in electronic devices such as smartphones, tablets and computers. In order to enhance LGA mechanical strength and reliability, capillary flow underfill is used to improve reliability. However, due to the small gap, it is difficult for capillary underfill to flow into the LGA at SMT level. Due to cost considerations, there are usually no pre-heating underfill or cleaning flux residue processes at the SMT assembly line. YINCAE solder joint encapsulant SMT256 has been successfully used with solder paste for LGA assembly. Solder joint encapsulant is used in in-line LGA soldering process with enhanced reliability. It eliminates the underfilling process and provides excellent reworkability. The shear st rength of solder joint is stronger than that of underfilled components. The thermal cycling performance using solder joint encapsulant is much better than that using underfill. Bottom IC of POP has been studied for further understanding of LGA assembly process parameters. All details such as assembly process, drop test and thermal cycling test will be discussed in this paper.
Technical Library | 2019-09-24 15:41:53.0
This paper focuses on three different coating material groups which were formulated to operate under high thermal stress and are applied at printed circuit board manufacturing level. While used for principally different applications, these coatings have in common that they can be key to a successful thermal management concept especially in e-mobility and lighting applications. The coatings consist of: Specialty (green transparent) liquid photoimageable solder masks (LPiSM) compatible with long-term thermal storage/stress in excess of 150°C. Combined with the appropriate high-temperature base material, and along with a suitable copper pre-treatment, these solder resists are capable of fulfilling higher thermal demands. In this context, long-term storage tests as well as temperature cycling tests were conducted. Moreover, the effect of various Cu pre-treatment methods on the adhesion of the solder masks was examined following 150, 175 and 200°C ageing processes. For this purpose, test panels were conditioned for 2000 hours at the respective temperatures and were submitted to a cross-cut test every 500 h. Within this test set-up, it was found that a multi-level chemical pre-treatment gives significantly better adhesion results, in particular at 175°C and 200°C, compared with a pre-treatment by brush or pumice brush. Also, breakdown voltage as well as tracking resistance were investigated. For an application in LED technology, the light reflectivity and white colour stability of the printed circuit board are of major importance, especially when high-power LEDs are used which can generate larger amounts of heat. For this reason, a very high coverage power and an intense white colour with high reflectivity values are essential for white solder masks. These "ultra-white" and largely non-yellowing LPiSM need to be able to withstand specific thermal loads, especially in combination with high-power LED lighting applications. The topic of thermal performance of coatings for electronics will also be discussed in view of printed heatsink paste (HSP) and thermal interface paste (TIP) coatings which are used for a growing number of applications. They are processed at the printed circuit board manufacturing level for thermal-coupling and heat-spreading purposes in various thermal management-sensitive fields, especially in the automotive and LED lighting industries. Besides giving an overview of the principle functionality, it will be discussed what makes these ceramic-filled epoxy- or silicone-based materials special compared to using "thermal greases" and "thermal pads" for heat dissipation purposes.
Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl
In-line or stand-alone fluxer/pre-heater This compact modular in-line system utilises the same design concept as the new generation Synchrodex soldering cell and offers the user significantly reduced process time when compared to using a single sold
Events Calendar | Thu Apr 08 00:00:00 EDT 2021 - Thu Apr 08 00:00:00 EDT 2021 | ,
Great Lakes Chapter Meeting: Flexible Wave Solder Processes and Optimization
Events Calendar | Tue Mar 06 00:00:00 EST 2018 - Tue Mar 06 00:00:00 EST 2018 | ,
Electronics in Harsh Environments Conference - Free Pre-Conference Webinar
Career Center | karachi, Sind Pakistan | Engineering,Production,Quality Control
For Research and Development Centre: --------------------------------------- -Give Recommendations regarding the functionality & operational security aspects in the ongoing projects by analyzing the detailed operations & functions of the product. -Mo
SMT Express, Issue No. 3 - from SMTnet.com Volume 1, Issue No. 3 Wednesday, August 18, 1999 Featured Article Return to Previous Page BGA REWORK Earl Moon Proof Of Design (POD) PRE OPERATIONAL REQUIREMENTS The following requirements shall
professionals, the APEX pre-show and post-show newslette
ASCEN Technology | https://www.ascen.ltd/face_mask_making_machine/752.html
Ultrasonic welding machine for mask shape cutting|heat sealing -PCB magazine loader,PCB turn conveyor,pcb conformal coating machine,PCB router,PCB depaneling machine,pcb buffer conveyor from ASCEN technology Welcome to visit ASCEN | | | | | | | Cart
| http://etasmt.com/cc?ID=te_news_industry,23964&url=_print
– pre-heat, pre-heat and soak, reflow, and cooling zone. The incorrect setup with zone temperatures and times will cause different soldering defects. Pre-heat zone
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