Industry Directory | Consultant / Service Provider / Manufacturer
TRC Circuits provides high quality printed circuit boards to a wide range of industries. We have 23 years of experience manufacturing printed circuit boards.
New Equipment | Solder Materials
KappaTinning Compound is a dry mixture of pure powdered Tin and flux specifically designed for pre-tinning cast Iron, Steel, Bronze and Copper bearing shells. A one pound container of KappaTinning Compound contains about twice as much Tin and goes fu
New Equipment | Surface Finish
Increase Yields. Improve Quality. Reduce Rework and Rejects. Enthone provides the world’s most applied and preferred PCB final finishes. Offering the widest selection and deepest knowledge of lead-free compatible finishes, we work with leading OEMs,
Electronics Forum | Fri Feb 28 14:53:08 EST 2020 | rlising
Hi, I purchase a leadfree aven solder pot 300w. We are wanting to pre tin power and ground wires prior to soldering onto pcb. I have some anti-erosion flux cored wire solder from koki S03x7Ca-70m 1.6mm. Can this solder be used? If not what is t
Electronics Forum | Wed Jun 21 13:23:45 EDT 2006 | russ
You may want to pre tin wires then dip into flux before soldering Does work!
Used SMT Equipment | Soldering - Wave
New arrival Electrovert EPK Plus Wave Solder Machine, 208VAC 3 phase power, L to R Board Flow, Heavy Duty V and L finger mix, Manual Board Width Adjust , 16" Max Board Width, Finger Cleaner, Originally Configured with an internal Foam Flux
Industry News | 2010-11-19 14:33:06.0
Steve Wozniak, co-founder of Apple Computer, will be trekking out to IPC APEX EXPO to keynote and hang out with “his kind of people.” IPC invites you to join "the Woz" and your colleagues in electronics manufacturing at IPC APEX EXPO 2011
Industry News | 2012-11-13 09:35:09.0
Comprehensive updates on pressing industry concerns, challenges and developments will be addressed in 50 IPC APEX EXPO® professional development courses, February 17–18 and February 21, 2013, at the San Diego Convention Center.
Parts & Supplies | SMT Equipment
Description: SMD Component Counter Features: 1. High precision with zero defects. 2. Ability of counting in bi-direction. 3. Rapid Pre-Set function confirmation. Technical specification: 1. Power Supply: AC110V or AC220V (convertible) 2. Capa
Technical Library | 2020-09-02 22:14:36.0
The demand for miniaturization and higher density electronic products has continued steadily for years, and this trend is expected to continue, according to various semiconductor technology and applications roadmaps. The printed circuit board (PCB) must support this trend as the central interconnection of the system. There are several options for fine line circuitry. A typical fine line circuit PCB product using copper foil technology, such as the modified semi-additive process (mSAP), uses a thin base copper layer made by pre-etching. The ultrathin copper foil process (SAP with ultrathin copper foil) is facing a technology limit for the miniaturization due to copper roughness and thickness control. The SAP process using sputtered copper is a solution, but the sputtering process is expensive and has issues with via plating. SAP using electroless copper deposition is another solution, but the process involved is challenged to achieve adequate adhesion and insulation between fine-pitch circuitries. A novel catalyst system--liquid metal ink (LMI)--has been developed that avoids these concerns and promotes a very controlled copper thickness over the substrate, targeting next generation high density interconnect (HDI) to wafer-level packaging substrates and enabling 5-micron level feature sizes. This novel catalyst has a unique feature, high density, and atomic-level deposition. Whereas conventional tin-palladium catalyst systems provide sporadic coverage over the substrate surface, the deposited catalyst covers the entire substrate surface. As a result, the catalyst enables improved uniformity of the copper deposition starting from the initial stage while providing higher adhesion and higher insulation resistance compared to the traditional catalysts used in SAP processes. This article discusses this new catalyst process, which both proposes a typical SAP process using the new catalyst and demonstrates the reliability improvements through a comparison between a new SAP PCB process and a conventional SAP PCB process.
HR-SD100 is an endeavor in reverting and recycling the oxides which occur during working of a Wave Soldering Machine in order to reduce production cost, create a greener environment and assist the quality process. Use special stirring system to melt
HR-SD100 is an endeavor in reverting and recycling the oxides which occur during working of a Wave Soldering Machine in order to reduce production cost, create a greener environment and assist the quality process. Use special stirring system to melt
Events Calendar | Thu Oct 21 00:00:00 EDT 2021 - Thu Oct 21 00:00:00 EDT 2021 | ,
Great Lakes Chapter Webinar: Low Melting Alloy & Selection of the Right Chemistry for Reliability
Career Center | Danao city, Cebu Philippines | Engineering,Maintenance,Production,Quality Control
JUKI Chip Mounter Maintenance and Troubleshooting JUKI Chip Mounter programming MINAMI Solder Paste Printer Maintenance and Troubleshooting MINAMI Solder Paste Printer programming PWB Loader / Unloader Maintenance and Troubleshooting TAMURA Reflow ma
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/our-company/news-room/news-releases?qs=t&page=20
ASYMTEK Combines Conformal Coating and Inspection into One Automated System 2018-07-24 - Nordson ASYMTEK Ensures accurate and reliable coating process Nordson SELECT Automatic Solder Nozzle Tinning System Ensures Consistent Quality 2018-07-16 - Nordson
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