New Equipment | Rework & Repair Equipment
Allgood Technology is equipped with a range of tools to rework and repair printed circuit assemblies to IPC-A-610 or your own company standards. Major Plant List: Metcal MFR-1351 Desoldering Station for through hole desoldering. Le
Electronics Forum | Tue Apr 06 11:17:01 EDT 2004 | ccl
hi, i encounter gold surface contam issue on wire bonding ring after prebake at 150 C for 3 hrs, tis cause wire bonding non stick issue. the contam seem begin at the solder mask area toward center of the bonding ring, but is not consistance.
Electronics Forum | Tue Apr 06 17:01:24 EDT 2004 | davef
It doesn't make sense that contamination would form on your gold pads after prebake of 150C for 3 hrs. The contamination must have been there prior to the bake. Your description makes us think of solder mask bleed. Tell us about: * Solder mask * S
