Industry Directory | Training Provider / Manufacturer's Representative / Equipment Dealer / Broker / Auctions / Consultant / Service Provider
Products, services, training & consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep, Distributor & Service Provider for Seamark/Zhuomao and Shuttle Star BGA Rework Stations.
Industry Directory | Manufacturer
Semiconductor mfg. services. Precision dicing of hard brittle materials.
The Laser Microjet is a technology that couples a laser beam into a thin water jet. The water jet is then used as a fiber optic wave guide to direct the beam to the wafer to be cut. The wafer is moved in the X and Y axis under computer control with p
APD DEVELOPS creative solutions to challenging micro machining problems, using precision diamond dicing blades and lasers to cut and machine a variety of hard brittle materials.
Electronics Forum | Wed Oct 21 08:16:40 EDT 1998 | Andy
| Hello everybody | | This is kind of urgent for me. I would appreciate if anyone of you could tell me where could i find information about the different dicing techniques and operations used in the industry. | | I need information about the fol
Electronics Forum | Mon Oct 19 15:37:12 EDT 1998 | Manish
Hello everybody This is kind of urgent for me. I would appreciate if anyone of you could tell me where could i find information about the different dicing techniques and operations used in the industry. I need information about the following: 1
Used SMT Equipment | Pick and Place/Feeders
Highlights of the SIPLACE CA: With the four SIPLACE SpeedStar heads for high-precision placements you can process up to 126,000 SMT components, 46,000 flip-chips, or 30,000 die-attach components per hour Component supplied from changeov
Used SMT Equipment | Pick and Place/Feeders
Make: ASMModel:ASM SIPLACE CA Details:1. High-Speed Placement CapabilitySMT component placement speed up to 76,000 components per hour (Cph).Flip chip placement from wafer up to 40,000 Cph.Die attach placement from wafer up to 50,000 Cph. 2. Placemen
Industry News | 2003-07-09 09:00:46.0
He will have responsibility for all aspects of Photronics� manufacturing and sales activities in China, Singapore and Taiwan.
Industry News | 2023-07-22 07:29:05.0
Seamless Success: The Triumph of Semiconductor Production Line Delivery. Experience the pinnacle of efficiency and innovation as our expert team ensures the flawless delivery of a cutting-edge semiconductor production line. Elevate your manufacturing capabilities, boost productivity, and achieve unparalleled results in the semiconductor industry with our successful solutions.
Parts & Supplies | Repair/Rework
We are providing below ceramic chuck table products/services · New, and refurbished, porous ceramic chucks for Disco ,ADT, K&S ,Applied materials saws. · 4",6",8,",12" regular size available in round , square ,oval shape or irregular shapes and si
Parts & Supplies | Repair/Rework
We are providing below ceramic chuck table products/services · New, and refurbished, porous ceramic chucks for Disco ,ADT, K&S ,Applied materials saws. · 4",6",8,",12" regular size available in round , square ,oval shape or irregular shapes and si
Technical Library | 2009-05-28 18:15:46.0
Considerable effort is ongoing to improve the efficiency and to move towards high-volume manufacturing of photovoltaic cells. Much attention has been focused on developing in-line processes to replace the current batch processes. A critical process to improve the performance of solar wafers is the application of Dopants. The basic requirement for this process is an automated method for applying a very thin, uniform film of Dopant to the silicon wafer as part of an in-line manufacturing process.
Technical Library | 2021-06-15 15:11:43.0
Today's automated dispensing for electronics manufacturing is a complex and precise process in order to meet the challenges posed by ever more demanding assembly and component technology requirements. Dedicated dispenser technology is key to success in meeting challenging applications in a production environment with precision and repeatability. The major components that comprise a dispenser will be described, with a view toward understanding the importance of each; the result will illustrate how these sub-systems combine to create high-volume dispensing platforms. Real world examples with data substantiating the speed and accuracy obtained for some of the most common advanced dispensing applications in the market will be demonstrated such as high speed surface mount adhesive, wafer level Underfill and shield edge interconnects.
Nano-copper sintering in formic acid vapor.
The first technology to use centrifugal energy to clean electronic circuit assemblies, precision parts, and semiconductor packages. The system offers unparalleled penetration, solubilization, and contaminant removal The MicroCel Centrifugal Cleanin
Career Center | San Jose, California USA | Engineering,Research and Development
Advanced Packaging Engineer � Develop advanced packaging technologies and processes, including: wafer thinning and dicing; die attach; wire bonding; overmolding; singulation � Perform Design of Experiments to establish optimized process windows for
Career Center | Boulder, Colorado USA | Engineering,Production,Quality Control
Senior-level micro-electronic technician capable of independent manufacture of custom hybrids, focal plane assemblies, and prototype detector assemblies in cleanroom environment (in Advanced Packaging and Detector Laboratory). MINIMUM QUALIFICATIONS
Career Center | Melbourne, Florida USA | Management,Production,Quality Control
Technical Skills/Abilities: � Management � Quality Assurance � Strong Troubleshooting Skills � Strategic Planning � Employee Training � Quality Assurance � Problem Resolution � Mechanical/Technical Aptitude
Career Center | Stoneham, Massachusetts | Engineering,Production,Research and Development,Technical Support
Warren P. Pumyea 8 Beacon Street Stoneham, Massachusetts 02180 Cell #: 978-821-7335 * E-mail: warren@pumyea.com http://www.pumyea.com/Process_Manufacturing_Engineer.doc Objective: Seeking a position as an engineer or related discipline whic
Screen and Stencil Printing Processes for Wafer Backside Coating News Forums SMT Equipment Company Directory Calendar Career Center Advertising About FREE Company Listing! Screen and Stencil Printing Processes for Wafer Backside
A New Stencil Rulebook for Wafer Level Solder Ball Placement using High Accuracy Screen Printing A New Stencil Rulebook for Wafer Level Solder Ball Placement using High Accuracy Screen Printing Printer-hosted processes for solder ball placement
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/products/wafer-x-ray-metrology?con=t&page=11
Wafer X-ray Metrology | Nordson DAGE X-Ray Inspection and Test Products Corporate | Global Directory | Languages Division Only All of Nordson Home Products Bondtesting Systems Micro Materials Testing Wafer Inspection and Metrology X-ray Inspection Systems X-ray Counting Systems Applications Battery
Baja Bid | https://bajabid.com/precision-circuit-solutions/
Precision Circuit Solutions - Baja Bid LLC Skip to content Your EMS Asset Management Partner Careers | Current Auctions Linkedin page opens in new window Baja Bid LLC Your EMS Asset Management Partner Home About Services Managed Online Auctions Asset Analysis Consignment Program Cash Buyout Program
Products, services, training & consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep, Distributor & Service Provider for Seamark/Zhuomao and Shuttle Star BGA Rework Stations.
Training Provider / Manufacturer's Representative / Equipment Dealer / Broker / Auctions / Consultant / Service Provider
1750 Mitchell Ave.
Oroville, CA USA
Phone: (888) 406-2830
