Industry Directory | Manufacturer
Selective Soldering Equipment and Solutions for Printed Circuit Board Assembly
Industry Directory | Association / Non-Profit
An independent body of ESD experts with the mission to review the ESD robustness requirements of modern IC products for allowing safe handling and mounting
Time Pressure Liquid Dispensing Pump with Foot switch / Dry contact A great addition to Fully Automatic Dispensing System Time pressure is a versatile method of dispensing that functions across a wide range of viscosities. This dispensing method wo
When Applications Require Large Board Processing &/or Versatility The DS Series of dispensers is a robust, large format platform designed to handle all types of applications with ease. Ideal for dispense applications utilizing adhesive, solder paste
Electronics Forum | Fri Sep 06 16:24:36 EDT 2019 | linux
We use similar switch and the same oven. You need to modify the stencil, increase surface area. Have modified all our stencils to the point where we no longer use inline glue dispensers for any product
Electronics Forum | Wed May 10 12:13:16 EDT 2006 | scombs
We have a 6 up panel with a 1206 part .082" from the board scoreline. After depanelization when we run the board through ICT it fails for a short at that location. We have visually inspected at high magnification for any cracks in the body and at the
Used SMT Equipment | SMT Equipment
Product name: KD - 2077 high-speed dispensing machine Product number: KD - 2077 Products in detail Features: High speed dispensing/adapt to more stable range Equal to KE series of high-performance/operability Attaches great importance to the
Used SMT Equipment | SMT Equipment
Product name: KD - 775 JUKI chip mounter Product number: KD - 775 Products in detail JUKI KD775 high-speed daub glue standard equipped with three dispensing head, achieved 0.1 seconds/launch daub adhesive at a high speed. Stable quality stand
Industry News | 2012-04-06 15:32:39.0
GPD Global, a manufacturer of precision fluid dispensing systems for high-volume 24/7, low-volume/high-mix and R&D production, announces the global release of its PCD4 Dispense Pump after its successful release and testing in the North American market.
Industry News | 2017-04-11 21:19:32.0
GPD Global offers versatile large format inline dispensing systems and stand-alone liquid dispense technologies for maximizing product yield. This is the largest standard PCB dispensing system platform in the industry.
Parts & Supplies | SMT Equipment
YAMAHA dispenser nozzle if need more info about the products , pls don’t hesitate to contact with us at any time.More info pls visit our website:www.ksunsmt.com. Email: alice@ksunsmt.com Skype: alice@ksunsmt.com Whats app: +86 1317047180
Parts & Supplies | Pick and Place/Feeders
JUKI 2050 machine failure solution KE2050M Z-axis fault E620014 error handling method! Suddenly heard the sound of the machine. The machine stopped the fault for the E620014Z axis drive alarm. View the drive. For Z drive 1, the third light is on
Technical Library | 1999-05-06 11:42:16.0
The most reliable and well-designed electronic device can malfunction or fail if it overheats. Considering thermal issues early in the design process results in a thermally conscious system layout and minimizes costs through the use of passive cooling and off-the-shelf components. When thermal issues are left until completion of the design, the only remaining solution may be a costly custom heat sink that requires all the space available. Incorporating a heat sink or a fan into a product after it is fully developed can be expensive, and still may not provide sufficient cooling of the device.
Technical Library | 2023-04-17 17:05:47.0
In an ideal world, manufacturing devices would work all of the time, however, every company receives customer returns for a variety of reasons. If these returned parts contributed to a fail, most companies will perform failure analysis (FA) on the returned parts to determine the root cause of the failure. Failure can occur for a multitude of reasons, for example: wear out, fatigue, design issues, manufacturing flaw or defect. This information is then used to improve the overall quality of the product and prevent reoccurrence. If no defect is found, it is possible that in fact the product has no defect. On the other hand, the defect could be elusive and the FA techniques insufficient to detect said deficiency. No-clean flux residues can cause intermittent or elusive, hard to find defects. In an attempt to understand the effects of no-clean flux residues from the secondary soldering and cleaning processes, a matrix of varying process and cleaning operation was investigated. Of special interest, traveling flux residues and entrapped residues were examined, as well as localized and batch cleaning processes. Various techniques were employed to test the remaining residues in order to assess their propensity to cause a latent failure. These techniques include Surface Insulation Resistance1 (SIR) testing at 40⁰C/90% RH, 5 VDC bias along with C32 testing and Ion Exchange Chromatography (IC). These techniques facilitate the assessment of the capillary effect the tight spacing these component structures have when flux residues are present. It is expected that dendritic shorting and measurable current leakage will occur, indicating a failing SIR test. However, since the residue resides under the discrete components, there will be no visual evidence of dendritic growth or metal migration.
When Applications Require Large Board Processing &/or Versatility The DS Series of dispensers is a robust, large format platform designed to handle all types of applications with ease. Ideal for dispense applications utilizing adhesive, solder paste
Events Calendar | Mon Aug 13 00:00:00 EDT 2018 - Wed Sep 12 00:00:00 EDT 2018 | ,
Improving dispensing yield
Events Calendar | Wed Sep 12 00:00:00 EDT 2018 - Sun Sep 30 00:00:00 EDT 2018 | ,
Improving Material Dispensing Yield in Manufacturing Applications
Career Center | binan city, Laguna Philippines | Engineering,Maintenance,Technical Support
6.5 Years Experience in Semiconductor Industry Specializing in Dispensing process and Equipment. 5.0 Years of Experience in Field Service Engineering. Machine Commissioning / Customer support 24 / 7, Technical Support for Customer machine and process
Career Center | , | Engineering,Maintenance,Technical Support
Dear Sir/Madam, I am having the 10 years exprience in SMT field. Currently I am working in Service industry as Senior Engineer. Specially I am exprience and trained in FUJI and Speedline machines. Earlier I worked with Manufacturing Industry.
| https://www.smtfactory.com/I-C-T-Offers-Overseas-after-sales-service-id40968567.html
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GPD Global | https://www.gpd-global.com/co_website/fluiddispense-appsol-flipchipassembly.php
. In an optimized process, all fill passes are dispensed first, and then after the material flows, a fillet pass is dispensed. Dispensing all the fills first gives the material enough time to flow under the die