Industry Directory | Manufacturer
Reflow ovens for automated SMT PCB assembly, specializing in lead free processing and nitrogen reflow. The best convection reflow ovens on the market.
Industry Directory | Manufacturer
A US manufacturer of quality hand tools for those engaged in the repair, rework, R & D, testing, and assembly of electronic components and printed circuit boards from Through Hole to 2Mil Pitch Surface Mount.
New Equipment | Curing Equipment
The mini vertical oven has a cycle time of 25 - 60 seconds per 150mm fixture, 4mm Edge Hold Pins and Guides. PCBs up to 250mm wide can be processed. Dual Feed option for high throughoutput. In-line, vertical automation of the epoxy cure process prod
The World's Best Convection Reflow Oven The ultimate high volume production reflow oven with belt speeds up to 1.4 m/min to accommodate the fastest pick and place systems. Lead Free Certified reflow oven! Maintenance Free! Lowest Nitrogen &
Used SMT Equipment | Pick and Place/Feeders
Supply of FUJI Fuji CP643E high-speed patch machine in online production: FUJI CP643E high-speed patch machine Features: 1, shooting speed is 0.09 seconds. 2, frontal video processing and advanced gray ratio video processing system. 3, a fixer p
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Used SMT Equipment | Assembly Accessories
The standard version of the XPRT 5 comes with stencil-cleaning and stencil inspection functions as well as a 2 1/2D postprint inspection capacity. The integration of closed squeegee systems (Proflow) has also been enabled. The use of an open-can cont
Industry News | 2019-12-09 14:44:26.0
The SMT Reflow Soldering Equipment (Global) award was awarded to Heller Industries by Frost & Sullivan.
Industry News | 2023-10-18 17:43:18.0
HELLER's High UPH Vacuum Reflow Oven clinched the coveted "Step-by-Step Excellence Awards" - Innovation Award owing to its industry-leading product strength and outstanding performance.
Technical Library | 2023-01-17 17:35:07.0
After years of concentration on resolving productivity- related concerns such as increasing speed, consistency and throughput while reducing costs, many of the world's leading electronics manufacturers have added a new mandate to their agendas. They are seeking to minimize the environmental impacts of their assembly processes and final products without sacrificing the high levels of productivity and quality that have been achieved through decades of effort.
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
Increase productivity, improve quality, reduce costs with vertical format curing solutions from Heller Industries. Learn more: http://www.hellerindustries.com/755-Vertical-Oven.php
This elevator format oven utilizes vertical space to accomodate curing applications of up to 4 hours while only occupying 96" (2.5m) of floorspace. Perfect for underfill and encapsulant.
Training Courses | | | IPC J-STD-001 Space Specialist (CIS)
The J-STD-001 Space Addendum is an additional optional module for the Certified IPC J-STD-001 CIS (Specialist) program for organizations that are required to meet these additional requirements.
Training Courses | ON DEMAND | | IPC-7711/7721 Trainer (CIT)
The Certified IPC-7711/7721 Trainer (CIT) courses recognize individuals as qualified trainers in the area of rework and repair of printed boards and electronic assemblies and prepares them to deliver Certified IPC-7711/7721 (CIS) training.
Events Calendar | Wed Jun 12 18:30:00 UTC 2024 - Wed Jun 12 18:30:00 UTC 2024 | Melbourne, Florida USA
Space Coast Event: Maximizing Automation Efficiency: Are You Making the Most of Your Investment?
Events Calendar | Wed Aug 19 18:30:00 UTC 2020 - Wed Aug 19 18:30:00 UTC 2020 | ,
Avoiding the Most Common PCB Failure Modes
Career Center | Westbury, New York USA | Accounting/Finance
Job Location: Tri-State NY Metro Area Suburban location Salary: $90-100K base, plus bonus and stock options Company: A +$1 billion rapidly growing electronics wireless communications manufacturer. Position Description: Are you looking fo
Career Center | Corpus Christi, Texas USA | Engineering,Production,Quality Control
Industrial Engineer will perform tasks/manage projects as directed by IRC AFD Site Manager, Finance Director, and Engineering Manager related to maintaining cost standard integrity and operations improvements. POSITION RESPONSIBILITES: Develop
Career Center | Bangalore, Karnataka India | Maintenance,Management,Production,Purchasing,Technical Support
Having 6+ years of experience in Production Process, Production Assembly,AOI, Reflow profiling and Product costing. At present working for Navsemi Technologies as an Production Lead.
Career Center | , Manila Philippines | Clerical,Engineering,Management,Production,Quality Control,Technical Support
JOB SUMMARY Together with the other Engineers in the Department, develop new products, new processes and drives continuous improvement in yield, quality, cost and delivery. DUTIES AND RESPONSIBILITIES PROCESS SUSTAINING Defines and documents proce
SMTnet Express, Septemeber 29, 2016, Subscribers: 26,486, Companies: 14,974, Users: 41,171 Re-Shoring or Near-Shoring Concepts Should be Strongly Considered when the OEM's Goal is To Deliver Optimum Balance between Landed Cost and Time to Market
Imagineering, Inc. | https://www.pcbnet.com/blog/the-cost-of-pcb-fabrication-pricing-factors/
The Cost of PCB Fabrication: Pricing Factors Skip to main content Resources Support Contact Us FAQs Live Chat My Account 847-806-0003 Menu PCB Capabilities Fabrication Technology Roadmap Materials Available HDI Tolerances
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