Torrey S. Crane manufactures a complete line of industrial solders ranging from pure tin and lead with alloys with silver,bismuth,antimony,and cadmium.Crane solders meet and exceed J-STD-006,QQS-571and ASTM B32 standards and are ISO 9002 CERTIFIED
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Lead Conditioning, Lead Scanning, Tape & Reel, Lead Tinning, Bake & Dry-Pack, BGA Reballing Services
New Equipment | Soldering - Other
ASCEN solder dross separator used in the PCB electronic industry,it is designed to recover pure tin and solder dross from working impurities oxides generated from the wave soldering with lead or lead free process.This tin slag recycling machine not o
New Equipment | Solder Materials
Solder dross has gone from being a cost to be considered by large companies to a very high cost that must be tracked for all who assemble electronic devices.As much as 70% of bar solder can be wasted as solder dross and with SAC 305 now at the $25/Lb
Electronics Forum | Wed Aug 04 16:49:24 EDT 2004 | jim_bob
Regarding Lead Free component finishes, vendors are zeroing in on matte tin plating as the finish of choice. What test are performed, to determine if a finish is "matte" type (vs. non-matte)?
Electronics Forum | Wed Jul 29 13:44:45 EDT 1998 | David Spilker
We are investigating alternatives to HASL finishes for more dense PWBs. OSP is not a good choice because of low solid flux and possibly long shelf life. Immersion gold is expensive and so far has been more difficult to wave solder. Has anyone had
Industry News | 2003-04-09 08:25:50.0
A new design guide is available from Genalog detailing Samtec's flex circuit capabilities.
Industry News | 2003-05-28 08:28:54.0
For June 2-4 (Mon. - Wed.)Design Automation Conference 2003
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Technical Library | 2012-08-02 21:05:14.0
First published in the 2012 IPC APEX EXPO technical conference proceedings. Pure tin is a common finish for copper hook up wire, coaxial cable, ground braid and harness assemblies used on electronic assemblies. Historically there have been fewer reports o
Technical Library | 2023-02-13 19:23:18.0
Spontaneously forming tin whiskers, which emerge unpredictably from pure tin surfaces, have regained prevalence as a topic within the electronics research community. This has resulted from the ROHS-driven conversion to "lead-free" solderable finish processes. Intrinsic stresses (and/or gradients) in plated films are considered to be a primary driving force behind the growth of tin whiskers. This paper compares the formation of tin whiskers on nanocrystalline and conventional polycrystalline copper deposits. Nanocrystalline copper under-metal deposits were investigated, in terms of their ability to mitigate whisker formation, because of their fine grain size and reduced film stress. Pure tin films were deposited using matte and bright electroplating, electroless plating, and electron beam evaporation. The samples were then subjected to thermal cycling conditions in order to expedite whisker growth. The resultant surface morphologies and whisker formations were evaluated.
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ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
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The Certified IPC/WHMA-A-620 Specialist (CIS) training focuses on cable and wire harness fabrication and installation.
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Working in GLORYPCB for 10 years.knowing electronic supply chain very well. especially for PCB PCBA assembly and other Electronic Manufacturing Service.Glorypcb is a professional electronic manufacturer located in Shenzhen with three facilities.offe
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JUKI Chip Mounter Maintenance and Troubleshooting JUKI Chip Mounter programming MINAMI Solder Paste Printer Maintenance and Troubleshooting MINAMI Solder Paste Printer programming PWB Loader / Unloader Maintenance and Troubleshooting TAMURA Reflow ma
SMTnet Express, October 12, 2017, Subscribers: 30,913, Companies: 10,757, Users: 23,915 Mitigation of Pure Tin Risk by Tin-Lead SMT Reflow- Results of an Industry Round-Robin David Pinsky, Tom Hester - Raytheon , Dr. Anduin Touw - The Boeing
An Investigation of Whisker Growth on Tin Coated Wire and Braid SMTnet Express August 2, 2012, Subscribers: 25335, Members: Companies: 8941, Users: 33403 An Investigation of Whisker Growth on Tin Coated Wire and Braid First published in the 2012
ASCEN Technology | https://www.ascen.ltd/optical_inspection/1073.html
Product Details solder dross recycling machine tin slag recycle system manual ： PCB assembly equipment, ：2023-12-30 solder dross recycling machine used in the PCB electronic industry,it is designed to recover pure tin and solder dross from working impurities oxides generated from the wave soldering with
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. Some candidates are described below. Pure Tin. Tin has good wettability/solderability over a large range of substrates, making it an excellent choice for lead finish through tin plating
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