Electronics Forum: purpose of heel fillet (3)

25 mil QFP soldering issue

Electronics Forum | Thu Aug 05 05:23:13 EDT 2004 | Bryan

Hi All,per my understanding ,the fail mode is the heel fillet of QFP seems no good,right?If yes...I think..we should:1.increase the aperture length on stencil and make sure there's enough solder paste on pad before reflow. or you can increase your t

SOIC FAIL

Electronics Forum | Tue Oct 26 03:12:36 EDT 2004 | Joseph

Dear all, Recently our production encountered high SOIC failure during testing after reflow soldering. All solder fillets (side/heel) are acceptable as per IPC standard.The reject samples (SOIC)being sent to IC manufacturer to verify the failure. Fin

Industry News: purpose of heel fillet (2)

SN100C Celebrates 20 Years of Reliable Service at APEX

Industry News | 2019-01-04 16:38:36.0

Nihon Superior today announced plans to exhibit in Booth #1334 at the 2019 IPC APEX EXPO, scheduled to take place Jan. 29 - 31, 2019 at the San Diego Convention Center in Ca. The company will celebrate the achievements produced by the well-known SN100C® lead-free alloy. SN100C (032) flux-cored solder wire will be introduced and SN100CVTM P608 D4 solder paste will be shown.

Nihon Superior Co., Ltd.

Nihon Superior to Highlight a Complete Suite of SN100C Soldering Materials at SMTA Southeast Asia Technical Conference 2009

Industry News | 2009-11-02 21:58:24.0

OSAKA, JAPAN — November 2009 — Nihon Superior Co. Ltd., a supplier of advanced soldering materials to the global electronics industry announces that it will display a full range of products based on its unique lead-free solder SN100C in its booth at the SMTA Southeast Asia Technical Conference on Electronics Assembly Technologies at the Equatorial Hotel in Penang, Malaysia, November 18-20, 2009.

Nihon Superior Co., Ltd.

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