Electronics Forum | Thu Oct 19 16:10:44 EDT 2000 | John Thorup
Much has been said on this subject. Try a search of the archives for the terms "Phil Zarrow" and "surface tension". You'll likely find what you need.
Electronics Forum | Thu Oct 19 16:10:48 EDT 2000 | John Thorup
Much has been said on this subject. Try a search of the archives for the terms "Phil Zarrow" and "surface tension". You'll likely find what you need.
Industry News | 2012-02-28 14:26:18.0
Since the "wild west" days of a relatively young printed circuit board industry when rules and infrastructure were not yet well established, Dennis “Denny” Fritz has been actively involved in IPC activities to help add structure, strength and vision to the industry. Today, he was honored with the IPC Raymond E. Pritchard Hall of Fame Award for his dedication and service to IPC and the industry. Presented at IPC APEX EXPO® in San Diego, the Hall of Fame Award represents IPC's highest level of volunteer recognition.
Industry News | 2020-01-23 17:30:46.0
ASYMTEK brings its latest fluid dispensing and conformal coating solutions to IPC APEX EXPO, San Diego, CA, in booth 1611. New at IPC APEX is the ASYMTEK Vortik™ family of progressive cavity pumps (PCP), with the smallest depositions possible on the market today. The VPs, VPm, and VPg pumps rely on positive displacement to provide continuous needle dispensing of one- and two-component fluids with high-volumetric accuracy, increased reliability, and reduced cycle time. At 0.2 microliters per second, the Vortik VPs offers the lowest flowrate and smallest depositions possible across all PCP pumps available in the market today - delivering precise control of narrow lines and small shots for two-component mixed fluids.
Technical Library | 2017-09-28 16:36:33.0
These nano-coatings also refine the solder paste brick shape giving improved print definition. These two benefits combine to help the solder paste printing process produce an adequate amount of solder paste in the correct position on the circuit board pads. Today, stencil aperture area ratios from 0.66 down to 0.40 are commonly used and make paste printing a challenge. This paper presents data on small area ratio printing for component designs including 01005 Imperial (0402 metric) and smaller 03015 metric and 0201 metric chip components and 0.3 mm and 0.4 mm pitch micro BGAs.
Technical Library | 2018-06-13 11:42:00.0
The art of screen printing solder paste for the surface mount community has been discussed and presented for several decades. However, the impending introduction of passive Metric 0201 devices has reopened the need to re-evaluate the printing process and the influence of stencil architecture. The impact of introducing apertures with architectural dimensions’ sub 150um whilst accommodating the requirements of the standard suite of surface mount connectors, passives and integrated circuits will require a greater knowledge of the solder paste printing process.The dilemma of including the next generation of surface mount devices into this new heterogeneous environment will create area ratio challenges that fall below todays 0.5 threshold. Within this paper the issues of printing challenging area ratio and their associated aspect ratio will be investigated. The findings will be considered against the next generation of surface mount devices.
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The Fundamentals of Solder Joint Design – Part 2 – Surface Mount Technology (SMT) | EPTAC Skip to content Scroll Toll Free: 800.643.7822 Toggle navigation Training All Classes
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-glossary-of-terms
temperature joints. T Tackiness Ability of solder paste to hold surface-mount components in place after placement. Tensile Strength Characteristic of a material that describes its resistance to fracture when the material is under tension. Through hole A
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