Electronics Forum | Fri Aug 17 08:37:47 EDT 2001 | jbieber
Gregory, I think that the profile is too radical, i.e. zone 6 to zone 7 temperatures are too far apart. I would guess that the solderjoints have not all reached 183C in zone 6 which is why the uBGA's do not have a symmetrical ball collapse. You may
Electronics Forum | Thu Jul 12 21:41:35 EDT 2001 | mugen
A) Questions: 1) What sort of pallet materials used? 2) what PCB thickness & LxW size? 3) what stencil type & thickness used? 4) what profile type used (peak deg-C)? 5) any peak Deg-C contraints for the components SMT onto the PCB? B) We use pallet
Industry News | 2018-10-18 10:18:58.0
Case study: How to Create a Reflow Profile for a 16-layer, 2mm Thickness PCB with a High Density SMT Connector?
Technical Library | 2021-04-21 19:28:30.0
Voids affect the thermal characteristics and mechanical properties of a solder joint, thereby affecting the reliability of the solder interconnect. The automotive sector in particular is requiring the mitigation of solder voids in various electronic control modules to the minimum possible level. Earlier research efforts performed to decrease voids involved varying the reflow profile, paste deposit, paste alloy composition, stencil aperture, and thickness.
Demonstrates installation of a BGA component using the AT-707 BGA Rework Station. Features include split vision optics, software process control, and lead free reflow capable.
INSERT INTO tracking_express (userid, username, page_id, ts) VALUES ('#Quser_profile.id#', '#Quser_profile.username#', 36, (#ts#)) SMT Express, Volume 2, Issue No. 12 - from SMTnet.com Volume 2, Issue No. 12 Friday, December 15, 2000
| http://etasmt.com/cc?ID=te_news_bulletin,24761&url=_print
>> News Reflow machine FLUX CONDENSER / COOLING MODULE FLUX CONDENSER / COOLING MODULE I.C.T is a manufacturer of SMT machines. It mainly provides customers with SMT production lines
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/Vacuum-Void-Reduction-Reflow-1.pdf
. Various process techniques have been employed to reduce voiding including reflow profile modifications, nitrogen atmosphere reflow, and implementation of special solder paste formulations and stencil designs [17
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