Ziptape designs, converts and prints many high temp label/adhesive combination materials. 500F printable labels for PCB's, cable labels for wrapping wires cables, perm, removeable, void, high temp, low temp applications.
Industry Directory | Manufacturer
Vigneshwara Enterprises, An Outstanding Screen Printing And Printer In Chennai, Labels And Sticker Manufacturer And Supplier In Chennai.
Heller 2043 MK7 SMT Reflow Oven Heating Zones: Top 13 / Bottom 13PCB Width: 50 - 560 mmWeight: 3400 kgDimension: W7224 x D1520 x H1440 mmProduct description: Heller 2043 MK7 SMT Reflow Oven, Heating Zones: Top 13 / Bottom 13, PCB Width: 50 - 560 mm,
New Equipment | Solder Paste Stencils
Simplify and Speed Up QFN and LGA device rework. StencilMate™ leadless device rework stencils make the process of reworking leadless devices such as QFNs and LGAs simple and fast. These adhesive-backed poyimide stencils are placed on to the bottom o
Electronics Forum | Wed Feb 20 09:05:38 EST 2008 | tonyamenson
We had a similar problem with lead-free through-hole components. We baked those baords to remove the residual moisture and everything went to 100% pass - defect was gone. Couldnt hurt to try a sample run while you decide if the PCB holes need to be
Electronics Forum | Wed Feb 20 12:22:14 EST 2008 | tonyamenson
iv40, I don't suppose you know/remember what base material you were using that caused the problem and what material you switched to was, do you? We just pre-bake all our lead free PCBs as a precuation but I would like to remove the process if I can
Industry News | 2003-06-10 08:16:44.0
The following text describes the application of NWA Quality Analyst to quality control in the assembly of electronic components.
Industry News | 2015-09-30 10:08:42.0
IPC — Association Connecting Electronics Industries® has released IPC-6012D, Qualification and Performance Specification for Rigid Printed Boards. IPC delivers the most current specifications for rigid printed board requirements to the electronic industry. The newly updated revision D will be release in conjunction with IPC-6012DS, Space and Military Avionics Applications Addendum to IPC-6012D, Qualification and Performance Specification for Rigid Printed Boards, which addresses requirements for space and military avionics.
Technical Library | 1999-05-07 11:28:39.0
There are many things that can go wrong when soldering to gold plate over nickel surfaces. First of all, we know that gold and solder are not good friends, as any time solder comes into contact with gold, something seems to go wrong. Either the solder bonds to the gold and eventually pulls off as the tin and gold cross-migrate, leaving voids; or the solder completely removes the gold and is expected to bond to the metal which was under the gold.
The MPM Momentum II is a proven, highly productive printer platform with a new set of enhanced technologies for further improvement around machine productivity, yield, ease of use, and flexibility.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Voiding Control for QFN Assembly Voiding Control for QFN Assembly Quad Flat No Leads (QFN) package designs receive more and more attention in electronic industry nowadays. This package offers a number of benefits including (1) small size
Heller Industries Inc. | https://hellerindustries.com/award/2001-smt-vision-award/
! The panel of industry experts concluded that the Gen. 5 system met a significant industry challenge for removing flux from the environment by creatively applying new technology
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/march/plasma-applications/semiconductor-packaging
. Many manufacturing challenges can be improved or overcome by using a suitable plasma treatment, including improving die attach, increasing wire bond strength, eliminating flip-chip underfill voids
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