supplier of clad & pure nickel powders and conductive fillers; additives used in the formulation of thermally & electrically conductive polymers, elastomers (emi gaskets and seals) & plastics with rf emi shielding properties.
A500, A600, A800 - 5, 6 or 8 top/bottom cooling zones. Heating System: Up to eight groups of top and bottom forced hot air convection heating zones. Patented heating plates in each zone uniformly transfer heat to the PCBs using forced hot air co
Model 310H adapts the Mainframe 6040 to amplitude requirements of up to 800 V for 50 ohm loads. The operating capabilities of the 6040/310H provide outputs in the form of 1 ns resolution digital delays and gates and PRFs from .01 Hz to 100 kHz (or on
Electronics Forum | Fri Sep 08 12:03:24 EDT 2017 | rameshraja
Hi, I need the RF 800 Flux Acid titration procedure and also require EPT of the same to add thinner ( RF 800 additive), i.e we are using the flux rf 800 for our wave soldering process having foam fluxer , after 2 hours we are taking sample from the
Electronics Forum | Mon Oct 24 11:39:54 EDT 2016 | jrrt_williams
We are currently running FUJI XPF lines and receive all of our RF shields in T/R format. The large shields we use come on a reel of 500, the small shields come on a reel of 800. both much more efficient than using trays.
Used SMT Equipment | Pick and Place/Feeders
FUJI SMT machine AIMEX IIIC-Flexible High-Mix Production Freeing up more floor space with its compact design and reduced lengthThis is an all-in-on machine with scalability and the ultimate level of versatility necessary for increasing productivity f
Used SMT Equipment | Pick and Place/Feeders
FUJI SMT machine AIMEX IIIC-Flexible High-Mix Production Freeing up more floor space with its compact design and reduced lengthThis is an all-in-on machine with scalability and the ultimate level of versatility necessary for increasing productivity f
Industry News | 2003-03-04 08:31:59.0
Ian Suttie To Drive Company's Expansion in Professional Printed Circuit Board Design Market
Industry News | 2003-04-15 08:57:18.0
First Implementation of the Package Platform Delivers 50-percent Cost, 60-percent Height, and 75-percent Area Reductions over Conventional RF Module Technologies
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Parts & Supplies | SMT Equipment
00377151-03 PULL RELIEF Y-GANTRYCABLE F5HM CF 00377152-01 RF Scanner - power cradle kit - 433MHz 00377154-01 RF Scanner Power Supply (230V) 00377155-01 RF Scanner RS232 Cable 00377156-01 RF Scanner - cordless laser gun 433MHz 00377168-01 RF Scan
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Parts & Supplies | Pick and Place/Feeders
JUKI RS-1 RF feeder storage cart for all electronic feeders Specification Dimension: 800 x 700 x 1070 mm, L x W x H Material: stainless steel Structure: 2 layers, 40pieces per layer, with four metal flexible castors Features 1.The fee
Technical Library | 2021-10-20 18:21:06.0
The solderability of the SAC305 alloy in contact with printed circuit boards (PCB) having different surface finishes was examined using the wetting balance method. The study was performed at a temperature of 260 _C on three types of PCBs covered with (1) hot air solder leveling (HASL LF), (2) electroless nickel immersion gold (ENIG), and (3) organic surface protectant (OSP), organic finish, all on Cu substrates and two types of fluxes (EF2202 and RF800). The results showed that the PCB substrate surface finish has a strong effect on the value of both the wetting time t0 and the contact angle h. The shortest wetting time was noted for the OSP finish (t0 = 0.6 s with EF2202 flux and t0 = 0.98 s with RF800 flux), while the ENIG finish showed the longest wetting time (t0 = 1.36 s with EF2202 flux and t0 = 1.55 s with RF800 flux). The h values calculated from the wetting balance tests were as follows: the lowest h of 45_ was formed on HASL LF (EF2202 flux), the highest h of 63_ was noted on the OSP finish, while on the ENIG finish, it was 58_ (EF2202 flux). After the solderability tests, the interface characterization of cross-sectional samples was performed by means of scanning electron microscopy coupled with energy dispersive spectroscopy.
Technical Library | 2022-02-09 17:52:47.0
This article presents the first time that an millimeter-wave (mm-wave) multichip module (MCM) with on-demand "smart" encapsulation has been fabricated utilizing additive manufacturing technologies. RF and dc interconnects were fabricated using inkjet printing, while the encapsulation was realized using 3-D printing. Inkjet-printed interconnects feature superior RF performance, better mechanical reliability, and on-demand, low-cost fabrication process.
00377151-03 PULL RELIEF Y-GANTRYCABLE F5HM CF 00377152-01 RF Scanner - power cradle kit - 433MHz 00377154-01 RF Scanner Power Supply (230V) 00377155-01 RF Scanner RS232 Cable 00377156-01 RF Scanner - cordless laser gun 433MHz 00377168-01 RF Scan
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
Training Courses | | | PCB Inspection Courses
The PCB inspection courses focus on improving PCB yield and reliability through validation and detection of defects on electronics assemblies.
Events Calendar | Wed Apr 20 00:00:00 EDT 2022 - Wed Apr 20 00:00:00 EDT 2022 | ,
Virtual Course: Selection Criteria of Surface Finish for Next Generation PCB Technologies
Events Calendar | Fri Feb 24 00:00:00 EST 2023 - Fri Feb 24 00:00:00 EST 2023 | Viera, Florida USA
Space Coast Chapter Winter Golf Classic 2023
Career Center | Dallas, Texas USA | Engineering
Job description: Engineer is responsible for the design of RF, Microwave and support circuitry for miniaturized Rf/Wireless modules utilizing highlt integrated semiconductors and an array of substrate and packaging technologies. Will design, simula
Career Center | Westbury, New York USA | Accounting/Finance
Job Location: Tri-State NY Metro Area Suburban location Salary: $90-100K base, plus bonus and stock options Company: A +$1 billion rapidly growing electronics wireless communications manufacturer. Position Description: Are you looking fo
Career Center | Fort Mill, South Carolina USA | Engineering,Maintenance,Research and Development
Have serviced AMF pinspotters both mechanical and electrical sides; included repair of chassis pc boards to component level. 20 years in this field. Have worked in PCB manufacture with old style board populators and Panasert robots Worked in H
Career Center | nagercoil, India | Maintenance,Production
3.5 year's experience in smt. Am looking for a growth orinted organization .
| https://ipcapexexpo.org/education/call-for-technical-paper-form
Manufacturing Microminiaturization Nanotechnology Optoelectronics Photovoltaics Sensors and Haptics Wearables Other… Enter other… Factory of the Future Implementation Topics 3D Printing/Additive Manufacturing in Electronics 4D Smart Material Printing AI-Enabled Inspection Artificial Intelligence (AI
| https://www.eptac.com/3d-printing-creates-new-possibilities-for-pcb-manufacturing-methods/
: Additive Manufacturing 3D printing is a form of additive manufacturing. Objects are created by adding materials, layer by layer, throughout the 3D printing process
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