Helps OEMs develop outsourcing programs for PCBA and final assembly. Services include outsourcing feasibility assessment, identification of appropriate contractors regionally and internationally, price and contract negotiation. Works on a client-pa
Industry Directory | Consultant / Service Provider
Qualitas Compliance LLC helps you address the compliance & regulatory challenges of the medical device industry. We work with you to streamline your quality & regulatory objectives to ensure business & product compliance!
Wouldn't it be nice to see into the future? With Sherlock by DfR Solutions, you can. Sherlock is a new Automated Design Analysis Tool that allows you to predict product failure earlier in the design process, allowing you to design reliability right
PCB New Product Introduction (NPI) Platform with Comprehensive DFM Optimization The New Product Introduction (NPI) process can be a time-consuming and costly exercise during the development of new products. At each consecutive step of the NPI proce
Electronics Forum | Mon May 16 18:03:30 EDT 2005 | davef
Key Issue: Will this machine solder your boards? You never know until you solder one. Any other avenues of analysis involve substantial risk. Flux Selection * High or low solids * VOC or VOC-free Solder Alloy * If using lead-free, avoid stainles
Electronics Forum | Mon Oct 03 10:41:57 EDT 2011 | patrickbruneel
Some of us here attended the 5th CALCE international symposium on tin whiskers http://www.calce.umd.edu/symposiums/ISTW2011.htm where one of my former professors, Dr. Henning Leidecker, talked about the tin whiskers he and the others at NASA Godda
Industry News | 2003-06-09 09:16:38.0
The adoption of AWR EDA software supports REMEC�s continuous efforts to manage the substantial challenges of today�s wireless design technology.
Industry News | 2003-03-12 08:14:19.0
Today announced the addition of two leading electronics sales representative firms designed to increase CirTran's domestic sales volume.
Technical Library | 2019-01-02 21:51:49.0
Failed solder joints remain a constant source of printed circuit board failure. Soldering is the bonding of metallic surfaces via an intermetallic compound (IMC). The interaction between thermal energy delivery, flux chemistry, and solder chemistry creates the solder bond or joint. Today, reliability relies on visual inspection; operator experience and skill, control of influencers e.g. tip geometry, tip temperature, and collection and analysis of process data. Each factor involved with the formation of the solder joint is an element of risk and can affect either throughput or repeatability. Mitigating this risk in hand soldering requires the identification of these factors and a means to address them.
Technical Library | 2023-03-27 19:18:38.0
Electronic waste (e-waste) is currently the fastest growing hazardous waste stream that continues to be a challenging concern for the global environment and public health. The average useful life of electronic products has continued to decline, and obsolete products are being stored or discarded with increasing frequency. E-waste is hazardous, complex and expensive to treat in an environmentally sound manner. As a result, new challenges related to the management of e-waste have become apparent. Most electronic products contain a combination of hazardous materials, toxic materials, and valuable elements such as precious metals and rare earth elements. There are risks to human health associated with the disposal of E-waste in landfills, or treatment by incineration. Americans discard 400+ million electronic items per year recycling less than 20 percent in safe and sustainable manner. E-waste is exported from developed countries and processed informally using unsafe conditions in many regions of developing countries. A mixture of pollutants is released from these informal rudimentary operations. Exposure to e-waste recycling includes the dismantling of used electronics and the use of hydrometallurgical and pyrometallurgical processes, which emit toxic chemicals, to retrieve valuable components. Thermal analysis integrated with chromatographic and spectroscopic techniques are used to determine dangerous chemicals emitted during the burning of e-waste. The information is used to assess the risk of exposure of workers at these semi-formal recycling centers.
By Pat McGoff, Market Development Manager During New Product Introduction (NPI), one of the priorities of both designers and manufacturers is quality. However, quality means something different to the designers and the manufacturers. Designers eq
This video shows how to use a mouse in CAM350. The GUI is also discussed as well as how to customize it. Custom toolbars and hot keys are demonstrated
Events Calendar | Tue Sep 22 00:00:00 EDT 2020 - Tue Sep 22 00:00:00 EDT 2020 | Eden Prairie, Minnesota USA
Risk Analysis in Electronic Assemblies
Events Calendar | Thu Apr 15 00:00:00 EDT 2021 - Thu Apr 15 00:00:00 EDT 2021 | ,
LA/OC Chapter Meeting and Technical Presentation: Manufacturing Simulation
Career Center | Brooksville, Florida USA | Engineering,Quality Control
Spartronics develops, manufactures, and manages the full lifecycle of robust electronic and electromechanical devices for commercial aerospace, defense, space, instrumentation and control, life sciences and medical device applications. Our proven exp
Career Center | Williamsport, Pennsylvania USA | Engineering,Quality Control
Corporate Director of Quality- Works on site in Williamsport, PA Reports to VP of Operations Summary The Quality Director is responsible for assuring the program health and operation of the overall quality management systems and the Quality A
Career Center | Phoenix, Arizona | Engineering,Management,Production,Quality Control,Research and Development,Sales/Marketing,Technical Support
• Highly motivated, solution oriented professional with proven record synergizing scientific, engineering, and business administration backgrounds to drive and sustain customer satisfaction and long term improvements. • Articulate communicator that a
Career Center | Nariveles, Philippines | 2019-11-21 13:32:04.0
Failure Analysis Technician Quality-driven and goal-focused with strong research, planning and Problem-solving abilities. Gifted in being a technical knowledge base, Organizing workflow and improving processes.
SMTnet Express, January 3, 2019, Subscribers: 31,567, Companies: 10,676, Users: 25,564 Risk Mitigation in Hand Soldering Credits: Metcal Failed solder joints remain a constant source of printed circuit board failure. Soldering is the bonding
Surface Mount Technology Association (SMTA) | https://www.smta.org/counterfeit/workshops.cfm
. Azarian, Ph.D., CALCE PDC2: Utilizing IPC-1782 - Component Traceability - To Reduce Risk Associated with Ingress of Counterfeit Components Cameron Shearon, Raytheon
Heller 公司 | http://hellerindustries.com.cn/Vacuum-Void-Reduction-Reflow.pdf
]. His analysis, summarized in Figure 1, shows that there are multiple types of voids and multiple void formation mechanisms. Voids can be differentiated with respect to how they are formed, where they reside in the solder joint and how they affect the reliability of the solder joint
