Industry Directory | Manufacturer
Hitechpcba is a wоrld-lеаding PCB Manufacturing & PCB Assembly company with more than 20 years experience in the electronics manufacturing industry. We focus on Circuit board fabrication, PCB assembly, electronic parts sourcing.
Industry Directory | Manufacturer
Rogers' high performance laminates and bondplies are engineered to meet stringent customer requirements for 5G wireless communication, wired infrastructure, automotive radar sensors, aerospace, satellites and more.
New Equipment | Fabrication Services
HITECH CIRCUITS has been providing RF PCB manufacturing facilities for years. The qualified professionals at HITECH CIRCUITS have expertise in Rogers PCB materials based PCB manufacturing. Fortunately, HITECH CIRCUITS has experienced RF Microwave PCB
New Equipment | Fabrication Services
Choosing the appropriate material for your printed circuit board is a crucial decision that will impact its suitability for specific applications. Through this blog post, we aim to enhance your understanding of Rogers PCBs. If you require further inf
Electronics Forum | Fri Oct 23 03:52:38 EDT 2009 | linseeg
What is the different between Rogers 4403 & Rogers 4350? Can we use two different material to build a PCB? If I use Ro4403 as prepreg and Ro4350 as core what is the advantages?
Industry News | 2003-02-13 07:53:53.0
Belgian Laminate Plant Set to Come Online
Industry News | 2003-06-24 08:14:51.0
R/flex� 3850 laminate is produced in a range of copper and LCP thicknesses, just as the single-clad laminate, and is available in standard panel formats.
Parts & Supplies | Circuit Board Assembly Products
1) Rogers4350B/4003C, Double-sided Layer, 2) 0.5mm thick/0.2mm thick 3) 1/1 oz copper thickness 4) Line space width: 0.15-0.2mm 5) Immersion gold.
Parts & Supplies | Circuit Board Assembly Products
1). FR-4 Tg 170 + Rogers 4350B 2). 290*130mm/1up 3). 6 layers at 1.6mm thick 4). Green solder mask/White ident 5). 35um copper finished, ED copper. 6). Electroless gold. 7). Countersunk slots.
Technical Library | 2019-12-30 02:11:05.0
(ROHS, Halogen Free & Reach Compliance) FR-4 (Tg130-180): ShengYi, ITEQ, KB, Huazheng High Speed FR4, Ceramics & Telflon, Rogers
Technical Library | 2011-06-16 18:59:43.0
Based on tests carried out with commercially available chemistry, this paper discusses the advantages available through the use of NEAP processes for inner layer bonding and soldermask pretreatment. The process is characterized with a view to high volume
A brief demonstration of the ScanCAD Precision Material Removal System for PCB Reverse Engineering
Events Calendar | Tue Aug 22 00:00:00 EDT 2023 - Tue Aug 22 00:00:00 EDT 2023 | Boca Raton, Florida USA
Space Coast Panel Discussion: Microscope Setups, Getting the Best Results From Your Equipment
Career Center | San Jose, California USA | Engineering
www.srqconsultants.com : for all Job Reqs This Analog IC Test Development Engineer position will require senior level ability on at least one of the following machines: Teradyne: Catalyst, A5XX, J750, Tiger Agilent 84000, 94000 Credence Duo, Quarte
Career Center | , California USA | Engineering
www.srqconsultants.com : for all Job Reqs This Lead Analog IC Test Development Engineer position will require senior level ability on at least one of the following machines: Teradyne: Catalyst, A5XX, J750, Tiger Agilent 84000, 94000 Credence Duo, Q
Career Center | North York, | Engineering,Quality Control,Technical Support
GSM/EDGE, CDMA, UMTS cellular networks, WCDMA, Inukshuk networks, SS7, HSPA, TDMoIP, IP, TCP/IP, Ethernet, Messaging and Data Networks, Radio Prop
Career Center | Springdale, Arkansas USA | Production,Research and Development
solder, electronic assembly, pcb repair, wave solder, smt, solder pot, testing unit,dexterity, program IC's,the rest in resume
ORION Industries | http://orionindustries.com/pdfs/Electrically_conductive_poron.pdf
EC-2000 Series Conductive Silicones BISCO is a licensed trademark of Rogers Corporation. 2002, 2003 Rogers Corporation 3057-0503-PDF, Publication
Surface Mount Technology Association (SMTA) | https://www.smta.org/iceet/2019_ICEET_Program.pdf
Brightness LED Application Jie Geng, Ph.D., Indium Corporation Session 1: Solder Materials Chair: Jason Keeping, P.Eng., Celestica, Inc. Co-Chair: Jason Rogers, M.G. Chemicals REGISTRATION OPENS Seika Machinery, Inc
