Industry Directory | Manufacturer
Manufacturer of Vacuum Soldering Systems, Vacuum Reflow Ovens, Sintering Systems, Solder Paste Drying Systems, and Sintering Paste Drying Systems
Industry Directory | Manufacturer
a special manufactory in developing and producing sintered fluxes for submerged-arc welding (SAW)
We manufacture and distribute a complete line of resinoid,metal sintered, and nickel bond diamond dicing blades. Resinoid blades: used on Glass, Ceramic, Sapphire and Quartz. Nickel bond: used to cut Silicon and III-V materials. Metal Sintered stress
SJ101 Sintered Welding Flux Specification:GB/T 12470-2003�� ���������� F48A4-H08MnA; F55A4-H10Mn2 Equal to: AWS A5.17-97; AWS A5.23-97 F7A4-EH14; F8A4-EA2-A2 ����Description: SJ101 flux is a kind of fluorine-basic sin
Electronics Forum | Thu Mar 16 19:12:22 EDT 2017 | pzappella
Hi Rob, Thanks for the LED paper. I like the void area equations but I am puzzled, the paper did not say if the solder was a solder paste that would generate a lot of voids, or a fluxless preform or sinter material. The measured voiding level
Electronics Forum | Thu Jan 28 21:00:26 EST 2021 | charliedci
I use FCT Recovery. During the last 6 months we've been going thru a 6S mission here so we have scrapped old equipment, shelving, anything with the least little metal in it. We sent them some cardboard (by mistake), they sent that back. Now we do sen
Used SMT Equipment | General Purpose Equipment
Package offers preferred: 1.) Protomat S103 Jetstream Dust Extraction System 4 Replacement Bags 3 new Vacuum table backers 1 used tight tolerance vacuum backer with sinter plate Solder Paste Dispensing attachment Upgraded to new Aluminum work
Used SMT Equipment | General Purpose Equipment
Package offers preferred: 1.) Protomat S103 Jetstream Dust Extraction System 4 Replacement Bags 3 new Vacuum table backers 1 used tight tolerance vacuum backer with sinter plate Solder Paste Dispensing attachment Upgraded to new Aluminum work
Industry News | 2003-02-26 09:24:48.0
Accelerated Technologies, a provider of rapid prototyping, tooling and electronic manufacturing services, has announced the acquisition of a new and larger facility in Austin, Texas.
Industry News | 2018-04-09 19:48:04.0
SMTA Europe announces Session 1 Technical Program on Predicting Component Life at the “Electronics in Harsh Environments Conference” to be held in Amsterdam, Netherlands, on April 25th, 2018.
Technical Library | 2016-03-03 17:25:26.0
This paper discusses a nano copper based paste for use in via filling. The company manufactures nano copper and disperses the coated nano copper into a paste in combination with micron copper. The resultant paste is injected or fills a via. The via is subsequently sintered by means of photonic sintering, or by heat in a reducing environment. The process will be accomplished in under an hour and results in filled solid copper vias.
Technical Library | 2021-11-03 17:05:39.0
Additively printed circuits provide advantages in reduced waste, rapid prototyping, and versatile flexible substrate choices relative to conventional circuit printing. Copper (Cu) based inks along with intense pulsed light (IPL) sintering can be used in additive circuit printing. However, IPL sintered Cu typically suffer from poor solderability due to high roughness and porosity. To address this, hybrid Cu ink which consists of Cu precursor/nanoparticle was formulated to seed Cu species and fill voids in the sintered structure. Nickel (Ni) electroplating was utilized to further improve surface solderability. Simulations were performed at various electroplating conditions and Cu cathode surface roughness using the multi-physics finite element method. By utilizing a mask during IPL sintering, conductivity was induced in exposed regions; this was utilized to achieve selective Ni-electroplating. Surface morphology and cross section analysis of the electrodes were observed through scanning electron microscopy and a 3D optical profilometer. Energy dispersive X-ray spectroscopy analysis was conducted to investigate changes in surface compositions. ASTM D3359 adhesion testing was performed to examine the adhesion between the electrode and substrate. Solder-electrode shear tests were investigated with a tensile tester to observe the shear strength between solder and electrodes. By utilizing Cu precursors and novel multifaceted approach of IPL sintering, a robust and solderable Ni electroplated conductive Cu printed electrode was achieved.
Nano-copper sintering in formic acid vapor.
· What is the difference between SMT vacuum reflow soldering machine and ordinary reflow soldering machine? · What problems can be solved by smt vacuum reflow soldering machine? · What is the basic principle of vacuum reflow machine? · Ho
Career Center | South Plainfield, New Jersey USA | Research and Development
Alpha Assembly Solutions, a MacDermid Performance Solutions Business and a world leader in the development, manufacturing, and sales of innovative materials used in the assembly electronics, industrial joining and Photo Voltaic market places, is seek
Career Center | South Plainfield, New Jersey USA | Research and Development
Alpha Assembly Solutions, a MacDermid Performance Solutions Business and a world leader in the development, manufacturing, and sales of innovative materials used in the assembly electronics, industrial joining and Photo Voltaic market places, is seek
SMTnet Express, November 4, 2021, Subscribers: 26,512, Companies: 11,460, Users: 26,912 Fabrication Of Solderable Intense Pulsed Light Sintered Hybrid Copper For Flexible Conductive Electrodes Additively printed circuits provide
| https://www.eptac.com/faqs/ask-helena-leo/ask/problems-with-pcb-micro-voiding
in the boundary region at a bonding interface. Today, the effect has been taken into account in various fields in materials science and technology such as structural materials welding, metals and ceramics powders sintering, thin films, and large-scale integration
