Industry Directory | Manufacturer
Aoki Laboratories Ltd. is an ISO-9002 certified company specializes in manufacturing of Sn/Pb Bar Solder, Cored Wire and Paste.Environmental friendly products, such as: lead-free solder, no-clean non-halide solder flux, no-clean cored wire and Non-CFC cleaner, are compliance with ISO-14001 requirements.
Industry Directory | Distributor / Equipment Dealer / Broker / Auctions / Manufacturer
Our company is a global supplier of ready solutions for each process of electronics productions.We supply SMT equipment, PCB cleaning equipment and full range of materials. We make also qualified customer support and spare parts.
New Equipment | Solder Materials
Bars / Solid Wires Proposal Pro Contra Wave and selective soldering SN100C® Favourable price
New Equipment | Solder Materials
NC Paste Flux is a no clean tacky/rework flux designed to wet virtually all solderable electronic surfaces, components, assemblies, and substrates. AIM NC Paste Flux may be used for general touch up or rework of printed circuit boards, and for attach
Electronics Forum | Thu Mar 10 14:31:57 EST 2005 | russ
Patrick told you why, But here is some more info for ya, I would absolutely not recommend that wires be tinned with OA. The residue will never get cleaned underneath the insulation and all of your strands will strt to break in the near/far future.
Electronics Forum | Thu Mar 10 13:05:41 EST 2005 | patrickbruneel
This phenomenon is caused by a high amount of halogens (Cl, Br etc.) used in the flux activators or in the flux surfactants. We've seen effects creating all colors of the rainbow. Changing to No-Clean (halide-free) will eliminate this color effect.
Industry News | 2010-01-22 21:46:55.0
Minneapolis, MN - The SMTA is pleased to announce several new online presentations coming up in February. In response to industry-wide budget cuts and travel restrictions, SMTA has committed to increasing its online programming to better accommodate member needs for technical exchange.
Industry News | 2011-09-14 12:04:43.0
The SMTA announced a session on QFN Assembly and Reliability will take place on Tuesday, October 18 during their annual conference, SMTA International, in Ft. Worth, Texas. Andrew Mawer of Freescale Semiconductor will chair the session and Viswam Puligandla, Ph.D., Nokia (Retired) will co-chair.
Technical Library | 2023-04-17 21:17:59.0
The purpose of this paper is to evaluate and compare the effectiveness and sensitivity of different cleanliness verification tests for post soldered printed circuit board assemblies (PCBAs) to provide an understanding of current industry practice for ionic contamination detection limits. Design/methodology/approach – PCBAs were subjected to different flux residue cleaning dwell times and cleanliness levels were verified with resistivity of solvent extract, critical cleanliness control (C3) test, and ion chromatography analyses to provide results capable of differentiating different sensitivity levels for each test. Findings – This study provides an understanding of current industry practice for ionic contamination detection using verification tests with different detection sensitivity levels. Some of the available cleanliness monitoring systems, particularly at critical areas of circuitry that are prone to product failure and residue entrapment, may have been overlooked. Research limitations/implications – Only Sn/Pb, clean type flux residue was evaluated. Thus, the current study was not an all encompassing project that is representative of other chemistry-based flux residues. Practical implications – The paper provides a reference that can be used to determine the most suitable and effective verification test for the detection of ionic contamination on PCBAs. Originality/value – Flux residue-related problems have long existed in the industry. The findings presented in this paper give a basic understanding to PCBA manufacturers when they are trying to choose the most suitable and effective verification test for the detection of ionic contamination on their products. Hence, the negative impact of flux residue on the respective product's long-term reliability and performance can be minimized and monitored effectively.
VIGON® SC 200, based on the MPC® Technology (Micro Phase Cleaning), is a water-based cleaning agent designed to clean SMT stencils at room temperature. The cleaning agent reliably removes solder pastes and SMT adhesives in one single process and can
ATRON® SP 200 is a water-alkaline surfactant cleaner, specifically developed to remove baked-on fluxes from solder pallets and condensation traps. ATRON® SP 200 can be used for the removal of unsoldered solder pastes from SMT stencils. The cleaner ca
Career Center | Houston, Texas USA | Engineering,Management,Quality Control,Technical Support
Seasoned Process & Quality Engineer. Degreed Chemical Engineer. 20+ years in Electronics Semiconductor manufacturing. Proficient in Quality Statistical tools, Design of Experiments, FMEAs, APQP, PPAP, ISO 9000, ISO/TS 16949 etc.
SMTnet Express, January 8, 2015, Subscribers: 23,708, Members: Companies: 14,158 , Users: 37,476 The Effect of Pb Mixing Levels on Solder Joint Reliability and Failure Mode of Backward Compatible, High Density Ball Grid Array Assemblies Richard
| https://www.eptac.com/faqs/ask-helena-leo/ask/wet-sponge-cleaning-vs-dry-brass-sponge-cleaning
Wet Sponge Cleaning vs. Dry Brass Sponge Cleaning - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
| https://pcbasupplies.com/sn100c-lead-free-bar-solder/
. NT100Ge can be used as a drop-in replacement for any existing 99C or SN100C solder bath, without the need for pot dumps or swaps. There are no videos yet There are no downloads yet More From PCBASupplies A supplier of PCB assembly and final assembly products including unique, hard to find, or new to market supplies. Sn63 Solder Bar
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