Industry Directory | Manufacturer
Manufacturer of automated production systems;PCB magazine loader,PCB separator,PCB cutting machine,PCB unloaders, PCB conveyors,PCB depaneling machines,PCB turn conveyors,PCB conformal coaters,PCB solder paste printer,PCB buffer
Industry Directory | Other / Consultant / Service Provider / Manufacturer
ScanCAD is an industry leader in inspection, measurement, process control and reverse engineering. Our solutions support OEM's, manufacturers, stencil fabricators, repair depots, and others in optimizing quality and yield.
Full-featured and compact benchtop dispense system robot offering accurate and repeatable dispense results! A benchtop dispense system does not mean "no features". The Catalina benchtop dispense system is a full-featured platform with these standard
High Precision Dispensers - MAX Series (Non-Heated) Max Series is capable of a wide variety of dispense applications including MicroVolume, Solder Paste and Conductive Adhesive, Underfill, Surface Mount Adhesive, Dam and Fill, Encapsulations, LED En
Used SMT Equipment | Screen Printers
DEK Horizon 03iX Fully Automatic Screen Solder Paste Printer Model Horizon 03iX Operating System Win XP+09sp13 or up PCB support Tooling&n
Used SMT Equipment | Screen Printers
DEK Horizon 03i automatic stencil printer Specification ： DEK Horizon 03i High Precision Automatic Solder Paste Printer designed for high precision steel mesh printing or stencil printing in SMT industry. Printing PCB size: 50x50mm to 508x510mm;
Industry News | 2013-05-21 22:12:09.0
Based on its recent analysis of the surface mount technology (SMT) reflow soldering equipment market, Frost & Sullivan recognizes Heller Industries, Inc. with the 2013 Global Frost & Sullivan Award for Market Share Leadership.
Industry News | 2016-02-27 22:07:08.0
GPD Global will exhibit in Booth#1818 at the upcoming IPC APEX EXPO 2016 Conference and Exhibition. See a live demonstration of 01005 dispensing on the MAX series high precision dispenser, the intuitively programmed Island series benchtop dispenser, and a full range of dispense pumps used on GPD dispense systems.
Technical Library | 2019-05-29 23:10:30.0
There are times when a PCB prototype needs to be built quickly to test out a design. In such cases where it is known early on that there will be multiple iterations or that a "one and done" assembly will be made that there will be some SMT assemblers who choose to hand print solder paste onto the board using a "frameless" stencil. In such cases where hand printing is used, the consistency of the printing technique has typically been in question. Furthermore, the effectiveness of both the nanocoatings as well as the higher end stainless steel materials, which have been heretofore studied in controlled printing environments, will be evaluated for their impact on the hand printing process.The purpose of the study was to determine the effectiveness of select nanocoating materials as well as certain high end stainless steel stencil materials as they relate to the manual SMT printing process. A variety of nanocoatings were applied to SMT metal stencils and solder paste volume measurements were taken to compare the effectiveness.
Technical Library | 2018-05-17 11:14:52.0
Intermetallic compound (IMC) growth is being studied in earnest in this past decade because of its significant effect the solder joint reliability. It appears that from numerous investigations conducted, excessive growth of IMC could lead to solder joint failure. Leading to this, many attempts has been made to determine the actual IMC thickness. However, precise and true representation of the growth in the actual 3D phenomenon from 2D cross-section investigations has remained unclear. This paper will focus on the measuring the IMC thickness using 3D surface profilometer (Alicona Focus G4). Lead free solder, Sn3.0Ag0.5Cu (SAC305) was soldered onto copper printed circuit board (Cu PCB). The samples were then subjected to thermal cycle (TC) storage process with temperature range from 0 °C to 100 °C for 200 cycles and up to 1000 cycles were completed.
High Precision Dispensers - MAX Series (Non-Heated) Max Series is capable of a wide variety of dispense applications including MicroVolume, Solder Paste and Conductive Adhesive, Underfill, Surface Mount Adhesive, Dam and Fill, Encapsulations, LED En
StencilQuik demonstration video. This breakthrough method allows you to simplify placement/replacement saving 50% or more of time required to rework BGAs or CSPs.This is a well developed BGA rework method. More on the StencilQuik(TM) process here:
Events Calendar | Sun Sep 13 18:30:00 UTC 2020 - Sun Sep 13 18:30:00 UTC 2020 | ,
Printed Circuit Board (PCB) Inspection & Quality Control
Events Calendar | Tue Mar 17 18:30:00 UTC 2020 - Tue Mar 17 18:30:00 UTC 2020 | College Park, Maryland USA
CALCE Reliability Science Symposium - Spring 2020
Career Center | Fremont, California USA | Production,Quality Control
Local industry leading EMS Company seeking SMT operators. Will be doing SMT line Change overs, SMT machine operation for solder printing, placement, reflow. Solder paste height measurement and record. Solder printing quality check after solder paste
Career Center | Lumberton, New Jersey USA | Engineering
Reports to: Cad/Laser Manager Department: Cad Location: Lumberton Phone: 609-261-2670 Ask for Greg Starrett Email: Send resume as a word document or PDF to greg@metassocs.com Job Summary: Under the general supervision of the Cad Manager
Career Center | rawalpindi, Pakistan | Production
Handling the production line including two SWISS pick and place machines cobra and paraquda ,tucano printer reflow oven ,samsung loader and unloader.Hand on experience with 3D camera inspection system and solder paste height measuring instrument and
Career Center | Chennai, Tamil Nadu India | Engineering,Maintenance,Production,Research and Development,Technical Support
Over 5.5 years exp in Customer service on SMT Roles and Responsibilities Identify, improve, recommend, and implement measures to improve production methods, equipment performance, process capability, and product quality. Streamline manufac
SMTnet Express May 30, 2013, Subscribers: 26133, Members: Companies: 13389, Users: 34754 Coating Thickness Measurement of Thin Gold and Palladium Coatings on Printed Circuit Boards using X-Ray Fluorescence by: Michael Haller, Volker Rößiger
SMT Express, Volume 3, Issue No. 5 - from SMTnet.com Volume 3, Issue No. 5 Thursday, May 17, 2001 Featured Article Return to Front Page Solder Paste Measurement: A Yield Improvement Strategy That Helps Improve Profits by Mike Riddle , ASC
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SMT Multifunctional 5M Pixel Camera 3D True Color Solder Paste Inspection Machine SMT Solder Paste Inspection3D SPI Sy Leave a Message We will call you back soon
Lewis & Clark | http://www.lewis-clark.com/product-tag/solder-paste-inspection/
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