Industry Directory | Distributor
EasySpheres is the exclusive worldwide provider of high quality, Kester solder spheres. We maintain a large inventory of sphere alloys and sizes, and since we specialize in the fulfillment of small orders, we are able to guarantee
Dealing in solder spheres material. Leaded and Lead-free. Also specialise in resale equipments for PCBA and semicon industries.
New Equipment | Solder Materials
WE HAVE BGA SOLDER BALLS, SOLDER SPHERES. Sizes from 0.20mm and up. Quantities from one to one million or more. Available in Lead & Lead Free Solder. One price for Lead, (Sn63Pb37) or Lead Free, (Sn96.5Ag3Cu0.5) in any of these listed solder ball
solder paste Sn63/Pb37 solder paste Sn63/Pb37 Tin solder paste Sn63/Pb37 Tin solder paste Sn63/Pb37 Product description: solder paste Sn63/Pb37 INQUIRY solder paste Sn63/Pb37 Machine Details: Brands QiSMT
Electronics Forum | Thu Dec 23 11:46:38 EST 1999 | g cronin
I am looking for a vendor for solder spheres and tack flux for BGA reballing. Preferibly on the east coast or new england area. My current distributors have them but require a min purchase of 200,000 that's a lot of balls!!!! thanks greg
Electronics Forum | Thu Dec 23 16:42:52 EST 1999 | Wayne Bracy
Check out Aeroquip there website is www.aeroquip.com/spheres/default2.htm or contact MSD in New Hampshire at (603) 774-5894 Regards, Wayne Bracy
Industry News | 2009-02-02 18:48:47.0
Henkel today announced the appointment of Mr. Luc Godefroid as the company's Global Sales Director for its Semiconductor Group. A key member of Henkel's electronics sales team since 2001, Godefroid's new role sees him building on his previous success and directing the global sales efforts of Henkel's worldwide team and expanded product portfolio.
Industry News | 2015-03-11 18:05:46.0
The SMTA Capital Chapter is pleased to announce Donald Tyler, Managing Director, Corfin Industries, will present “Elimination of Pb-Free Risk by Robotic Hot Solder Dip (RHSD)” at its first meeting of 2015 on March 17th, scheduled from 5:30 pm to 8:00 pm at EIT (Main Building Lunchroom), 108 Carpenter Drive, Sterling, VA 20164.
Technical Library | 2014-03-06 19:04:07.0
Over the last few years, there has been an increase in the rate of Head-in-Pillow component soldering defects which interrupts the merger of the BGA/CSP component solder spheres with the molten solder paste during reflow. The issue has occurred across a broad segment of industries including consumer, telecom and military. There are many reasons for this issue such as warpage issues of the component or board, ball co-planarity issues for BGA/CSP components and non-wetting of the component based on contamination or excessive oxidation of the component coating. The issue has been found to occur not only on lead-free soldered assemblies where the increased soldering temperatures may give rise to increase component/board warpage but also on tin-lead soldered assemblies.
Technical Library | 2008-04-08 17:42:27.0
Concern about the failure of lead-free BGA packages when portable devices such as cell phones are accidentally dropped and a general concern about the resistance of these packages under shock loading has prompted an interest in the impact strength of the soldered BGA connection. This paper reports the results of the measurement of the impact strength of lead-free 0.5±0.01mm diameter BGA spheres on 0.42mm solder mask defined pads on copper/OSP and ENIG substrates using recently developed equipment that can load individual BGA spheres at high strain rates in shear and tension.
ALPHA® Preforms with solder paste adds solder volume.
SN100C P810 D4????????? ???????????? ??????????????????????????????????? ?????????????? ???http://www.nihonsuperior.co.jp/
Career Center | Research Triangle Park, North Carolina USA | Sales/Marketing
Worldwide supplier of solderpaste, flux, adhesives and solder sphere's seeking Independant Manfacturers' Representatives for select protected territories in Illinois, Ohio, Pennsylvania, New York, New Jersey and the Provinces of Canada. Experience in
Strength of Lead-free BGA Spheres in High Speed Loading Strength of Lead-free BGA Spheres in High Speed Loading Concern about the failure of lead-free BGA packages when portable devices such as cell phones are accidentally dropped and a general
Featured Article Return to Front Page Soldering Technolo
| https://www.eptac.com/soldertips/solder-paste-shelf-life-and-testing/
. Since the flux is in constant contact with the solder powder, it is continually acting on the oxides on the surfaces of the solder powder or spheres, and this action reduces the activity levels of the fluxes
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/Vacuum-Void-Reduction-Reflow.pdf
. A populated printed circuit board test vehicle. The test boards were populated with daisy-chained 192CABGA and 84CTBGA packages fabricated with Pb- free solder spheres
