Industry Directory | Association / Non-Profit / Events Organizer / Training Provider
The SMTA membership is a network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies and related business operations.
Industry Directory | Manufacturer
Shenzhen Honreal Technology Co., focus on global Surface Mount electronic assembly field for 15 years. Specializing in providing various brands of SMT pick and place machines and spare parts. Fuji, Panasonic, Juki, Hitachi, Yahama
1809 MK5 - Heller Advanced In-Line Vacuum Reflow Oven Nitrogen System with Balanced Flow Technology 9 Top And Bottom Heated Zones - highest zone count per linear foot in the industry! 100" Heated Length - for super throughput! 2 Internal C
When Applications Require Large Board Processing &/or Versatility The DS Series of dispensers is a robust, large format platform designed to handle all types of applications with ease. Ideal for dispense applications utilizing adhesive, solder paste
Electronics Forum | Thu Oct 07 14:40:31 EDT 1999 | Carol Zhang
I have a board, 4 spacers needed to be soldered on the board first with the normal 62Sn37Pb alloy. Then, capacitors are manually soldered on the boards. The density of the board is quite high. If we wave soldered capacitors first, there will be no p
Electronics Forum | Thu Oct 07 15:39:59 EDT 1999 | Carol Zhang
| I have a board, 4 spacers needed to be soldered on the board | first with the normal 62Sn37Pb alloy. Then, capacitors are manually soldered on the boards. The density of the board is quite high. If we wave soldered capacitors first, there will b
Used SMT Equipment | Soldering - Reflow
HEXI, Lead-Free reflow soldering machine, type RFN1020/N, s.n. 0611018, Left to Right, with 10 heating heads plus cooling head, lenght of heating zones 3365mm,max width of PCB 450 mm, width of conveyor 50 to 450 mm, height of conveyor 920 +/_ 20 mm,
Used SMT Equipment | Soldering - Wave
Operating System: Windows based Details: • Dual pot-Lead and Lead Free • Includes full pot of Lead Free –SN100C solder and Lead SN63/PB37 solder • Carbon Steel Solder pots with high temperature protective coating • A
Industry News | 2017-04-11 21:19:32.0
GPD Global offers versatile large format inline dispensing systems and stand-alone liquid dispense technologies for maximizing product yield. This is the largest standard PCB dispensing system platform in the industry.
Industry News | 2003-03-26 08:25:40.0
The QVE00033 transmissive switch's small size, surface mount package and performance make it ideal for noncontact switching applications in disk drives, card detectors, mise and trackballs.
Parts & Supplies | Assembly Accessories
46564804 Universal AI Parts 46442717 Universal AI Parts 46364706 Universal AI Parts 46364705 Universal AI Parts 46191601 Universal AI Parts 46191501 Universal AI Parts 45989301 Universal AI Parts 45987901 Universal AI Parts 45711604 Universal
Parts & Supplies | Assembly Accessories
FUJI Nozzle in stock FUJI CP3 / CP4 Bore diameter 0.7 / 1.0 / 1.3 FUJI CP6 / CP7 Bore diameter 0.7 / 1.0 / 1.3 / 1.8 FUJI CP6 / CP7 Bore diameter 2.5 / 3.7 / 5.0 FUJI XP141 / 142 Bore diameter 2.5 / 3.7 / 5.0 FUJI XP141 / 142 0.7 / 1.0 / 1.3 / 1
Technical Library | 2023-01-17 17:27:13.0
Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The degree of wetting, the microstructure (in particular the intermetallic layer), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305) solder joint shear force. Specifically, the effect of the reflow peak temperature and time above solder liquidus temperature are studied. Nine reflow profiles for SAC 305 and nine reflow profiles for SnPb have been developed with three levels of peak temperature (230 o C, 240 o C, and 250 o C for SAC 305; and 195 o C, 205 o C, and 215 o C for SnPb) and three levels of time above solder liquidus temperature (30 sec., 60 sec., and 90 sec.). The shear force data of four different sizes of chip resistors (1206, 0805, 0603, and 0402) are compared across the different profiles. The shear force of the resistors is measured at time 0 (right after assembly). The fracture surfaces have been studied using a scanning electron microscopy (SEM) with energy dispersive spectroscopy (EDS)
Technical Library | 2023-01-17 17:22:28.0
The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion. Detailed industry investigations have shown that voids have little effect on solder joint integrity unless they fall into specific location/geometry configurations. These investigations have focused on thermal cycle testing at 0°C-100°C, which is typically used to evaluate commercial electronic products. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis.
1809 MK5 - Heller Advanced In-Line Vacuum Reflow Oven Nitrogen System with Balanced Flow Technology 9 Top And Bottom Heated Zones - highest zone count per linear foot in the industry! 100" Heated Length - for super throughput! 2 Internal C
When Applications Require Large Board Processing &/or Versatility The DS Series of dispensers is a robust, large format platform designed to handle all types of applications with ease. Ideal for dispense applications utilizing adhesive, solder paste
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Events Calendar | Tue Apr 21 00:00:00 EDT 2020 - Thu Apr 23 00:00:00 EDT 2020 | Amsterdam, Netherlands
Electronics in Harsh Environments Conference
Events Calendar | Mon Nov 19 00:00:00 EST 2018 - Mon Nov 19 00:00:00 EST 2018 | ,
Hand Soldering & De-Soldering with Lead-Free Solder - Webinar
Career Center | New Castle, Pennsylvania USA | Production
Surface Mount Tech - Printed Circuit Board (PCB) Summary: **All applicants must be familiar with: Quad 4C equipment*** Will be responsible for Surface Mount Parts and Screen Printing Other responsibilities may include: Moves controls to activate
Career Center | Norcross, Georgia USA | Production
Solder Technician Reports to: Supervisor Responsibilities: 1) Melts and applies solder along adjoining edges of workpieces to solder joints, using soldering iron, gas torch, or electric-ultrasonic equipment. 2) Grinds, cuts, buffs, or bends edge
Career Center | , Israel | Engineering,Maintenance,Technical Support
I was born on June , 1972 in Khmelnitsky city , Ukraine . I am male. From 1979 to 1987 I was studying at secondary school #7, having finished which I entered the Technical College of Khmelnitsky in specialty Machine Tools with Computer Numeric Contr
Career Center | Brookfield, ALL USA | Management,Production
Training and Qualifications Mil standards 464 Mil Standards 2000 ESD Training Cellular Manufacturing TQM Totally Quality Manufacturing ISO 9000 and 9001 IPC Standards, IPCA-610 IPC-J-STD-001E OSHA training LEAN Manufacturing, JIT (Just In T
SMTnet Express, August 26, 2021, Subscribers: 26,759, Companies: 11,431, Users: 26,816 Low Melting Temperature Sn-Bi Solder: Effect of Alloying and Nanoparticle Addition on the Microstructural, Thermal, Interfacial Bonding
| https://www.eptac.com/faqs/ask-helena-leo/ask/dip-tinning-conductors-with-low-temperature-insulation-and-solder-pot-contamination
Dip Tinning Conductors with Low Temperature Insulation and Solder Pot Contamination - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
Blackfox Training Institute, LLC | https://www.blackfox.com/blackfox-courses/high-temp-soldering/
. Soldering iron and solder tip maintenance guidelines. Methods for choosing the correct Tip-Temperature and Size. HMP Solder and Flux chemistry and why they are used
