Industry Directory | Manufacturer
Designer and Manufacturer of Acoustic Microscopes for Non-destructive Ultrasonic Immersion Inspection and Semiconductor Package Failure Analysis.
Industry Directory | Manufacturer
PVA TePla Analytical Systems, a company that designs and manufactures advanced Scanning Acoustic Microscopes for both laboratory and production environments
New Equipment | Test Equipment
The REVETEST® Scratch Testing instrument has become the industry standard for measuring hard-coated materials, with a typical coating thickness of several microns. Coatings may be organic or inorganic, covering Tribological, magnetic and decorative
New Equipment | Test Equipment
THE NEW GENERATION OF NANOINDENTER CSM Instruments has introduced a new nano range high resolution nanoindenter with ultra low thermal drift. When used per ISO 14577 test methods the Ultra Nano Hardness Tester will provide the most accurate data of
Electronics Forum | Wed Mar 01 07:45:56 EST 2006 | davef
Consider: * Equipment Inspection acoustic microscope [Scanning Acoustic Microscopy (SAM)] MicroPhotonics 4949 Liberty Lane, Suite 160, PO Box 3129 Allentown PA 18106 610.366.7103 fax 7105 http://www.microphotonics.com * Equipment Inspection acoustic
Electronics Forum | Wed Apr 14 14:48:48 EDT 2010 | davef
It won't work. An acoustic signal can't punch through a BGA. The signals reflect at every interface. So, it works for flip chip, but there are too many interfaces in CSP and BGA. Equipment, Inspection, Acoustic microscope * MicroPhotonics * Sonos
Industry News | 2020-09-17 12:23:10.0
Talk to the experts and see demonstrations of the latest equipment for test and inspection, fluid dispensing, and plasma treatment in one booth, #I2716
Industry News | 2017-04-23 11:52:40.0
Microtronic GmbH today announced plans to show the Sonix ECHO™ scanning acoustic microscope in Stand 221j in Hall 5 at SMT Hybrid Packaging, scheduled to take place May 16-18, 2017 in Nuremburg, Germany. The ECHO™ enables package inspection of stacked dies, complex flip chips and more traditional plastic packages.
Sonix Acoustic Microscope C-SAM #3 UHR2001 Price: $4,500.00 Model Number : C-SAM #3 Serial Number : UHR2001 Manufacturer: Sonix Dimensions: 440x40x50 Condition: Used - Unit powers up and appears to be functional. - Possibly missing transduc
Events Calendar | Fri Sep 18 00:00:00 EDT 2020 - Fri Sep 18 00:00:00 EDT 2020 | ,
Defect Detection for Advanced Wafer and Package Devices
Career Center | Milpitas, California USA | Engineering,Production,Quality Control,Research and Development,Technical Support
Winslow Automation, Inc. (aka Six Sigma), an industry leader in electronic component interconnect technology & related test and failure analysis services, is seeking individuals specializing in materials lab testing to join our team. We have openin
Career Center | Rochester, New York USA | Engineering
I have done my undergraduate studies in Mechanical Engineering. I am pursuing my Master's Program in Electronics Packaging. I am currently working as a Research Assistant for RIT-CEMA (Center for Electronics Manufacturing and Assembly). My research
Chip Underfill For many years Acoustic Micro Imaging
Chip Underfill For many years Acoustic Micro Imaging
PCB Libraries, Inc. | http://www.pcblibraries.com/pod/
& Webinars Footprints & 3D Models with Customizable Preferences Manufacturer: Select a Manufacturer: 2J Antennas 3D Plus 3M 4D ABLIC Abracon Aces Active-Semi Adafruit Adam Technologies Adesto Technologies Advanced Advanced Acoustic Technology Advanced Crystal Technology Advanced Linear Devices AEL
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