Industry Directory | Consultant / Service Provider
Smart CAD Service can provide you with solutions to your SMT CAD Designs and economical solutions to cost reduction. We can help you reduce capital costs of infrastructure.
Industry Directory | Consultant / Service Provider / Manufacturer
** Measure machine Cp and Cpk performance indices!! ** This mobile product and service offers an objective and independent test for all brands and models of SMT printer, dispenser and placement equipment. Innovative hardware and software solutions operate the CmController and provide quick statistical results on machine performance and process capability.
Heller 1826 Mark 5 SMT Reflow Oven Reflow Oven SMT Reflow Oven Heller 1826 Mark 5 SMT Reflow Oven Heller 1826 Mark 5 Product description: Heller 1826 Mark 5 SMT Reflow Oven INQUIRY Heller 1826 Mark 5 SMT Reflow Oven Products de
Heller 1936/2043 MARK 5 SMT REFLOW OVEN Heller Reflow Oven Heller SMT Reflow Oven Heller 1936/2043 MARK 5 SMT REFLOW OVEN Heller 1936/2043 MARK 5 Product description: Heller 1936/2043 MARK 5 SMT REFLOW OVEN INQUIRY Heller 193
Used SMT Equipment | Screen Printers
DEK 03iX Specs: • Process alignment capability 2 Cpk @ ± 25µm 6-Sigma • Machine alignment capability 2 Cpk @ ± 12.5µm 6-Sigma • 12 second cycle time • High Throughput Conveyor (option) , enables core cycle time reduction to just 11 seconds • DE
Industry News | 2015-10-21 17:02:27.0
Product lead time reductions and increased capabilities for EMS providers and board shops
Industry News | 2018-10-18 10:13:08.0
The Application of the Pin-in-Paste Reflow Process
Technical Library | 2023-06-12 19:46:10.0
Solder paste printing is understood to be the leading contributor of defects in the electronics assembly process. Because yield accounts for such a large percentage of the margin, the greatest opportunity to improve profitability in the assembly of most electronics can be gained by reducing or eliminating solder defects. This article examines process adjustments made through stencil design that correct a misalignment situation between the PCB and stencil, leading to a 43% reduction in assembly defects. Examples of each are found in Table 1.
Technical Library | 2018-09-26 20:33:26.0
Bottom terminated components, or BTCs, have been rapidly incorporated into PCB designs because of their low cost, small footprint and overall reliability. The combination of leadless terminations with underside ground/thermal pads have presented a multitude of challenges to PCB assemblers, including tilting, poor solder fillet formation, difficult inspection and – most notably – center pad voiding. Voids in large SMT solder joints can be difficult to predict and control due to the variety of input variables that can influence their formation. Solder paste chemistries, PCB final finishes, and reflow profiles and atmospheres have all been scrutinized, and their effects well documented. Additionally, many of the published center pad voiding studies have focused on optimizing center pad footprint and stencil aperture designs. This study focuses on I/O pad stencil modifications rather than center pad modifications. It shows a no-cost, easily implemented I/O design guideline that can be deployed to consistently and repeatedly reduce void formation on BTC-style packages.
NanoSlic™ Gold is our top of the line spray on coating applied to our UltraSlic™ solder paste stencil, which gives previously unseen performance benefits in transfer efficiency. The NanoSlic™ Gold coating also gives the benefits of improved under-ste
The LPKF ZelFlex Z4P is a pneumatic 4-sided high-speed clamping frame for stencils. More information: http://www.lpkf.com/products/rapid-pcb-prototyping/smd-assembly/quick-release-frames/zelflex-z4p.htm?utm_source=youtube&utm_medium=social&utm_term=s
Career Center | Reynosa, Mexico | Engineering
This position is in our Reynosa manufacturing facility, which is across the border from McAllen, Texas. In this critical role, you will be responsible for PCBA, SMT, THT, Wave Solder and secondary operations which will include: =Ensure producti
Career Center | Huntington Beach, California USA | Engineering
Trantronics, Inc. A well-established electronics assembly company who specializes in outstanding customer services and on time delivery is seeking a motivated hardworking individual to john our team at the Hunting Beach location. Responsibilities
Career Center | Bangalore, Karnataka India | Engineering,Production,Research and Development,Technical Support
� Exposure to Siemens Pick & Place M/Cs. � Basic knowledge in POP components, 01005 component package. � Exposure in SIX SIGMA TOOLS � WHITE BELT. � Performing DFM for the new products & running products. � Exposure in scre
Career Center | Nashville, North Carolina USA | Engineering,Maintenance,Management,Sales/Marketing,Technical Support
Screen Printer programming, maintenance, calibration Placment machine programming, mainteanance, calibration SMT Process and Manufacturing engineering Project Management New model introduction Supervision skills Training skills Leadership knowledge S
SMTnet Express, November 9, 2017, Subscribers: 30,999, Companies: 10,789, Users: 24,027 Void Reduction in Reflow Soldering Processes by Sweep Stimulation of PCB Substrate Viktoria Rawinski; kurtz ersa Corporation Due to the ongoing trend towards
SMTnet Express, August 31, 2017, Subscribers: 30,770, Companies: 10,706, Users: 23,739 NSOP Reduction for QFN RFIC Packages Mumtaz Y. Bora; Peregrine Semiconductor Wire bonded packages using conventional copper leadframe have been used in industry
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Heller 公司 | http://hellerindustries.com.cn/Vacuum-Void-Reduction-Reflow.pdf
. Half of the population of test vehicles then were re-processed (reflowed) using vacuum reflow. Transmission x-ray inspection showed a significant reduction in solder voiding after vacuum processing
