Electronics Forum | Thu Jun 17 11:18:03 EDT 1999 | Ian Clelland
| | | | | | Our company is experiencing cracked caps at our pick and place operations. The caps are being placed onto epoxy dots for subsequent wave solder operations. At present, be have set the pressure of the head at 2 in/lbs. This being down fr
Industry News | 2020-11-24 00:32:09.0
Cheersonic has committed to the research and development of various ultrasonic equipment for more than ten years. We will design a suitable plan according to the different needs of customers. CENG-S, CENG-M and CENG-L developed by our company is basic , programmable micro material spray coating system.
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