1095 the impact of new generation chemical treatment systems on high frequency signal integrity high density packaging user group (hdp) project results

Technical Library: the impact of new generation chemical treatment systems on high frequency signal integrity high density packaging user group (hdp) project (1)

The Impact of New Generation Chemical Treatment Systems on High Frequency Signal Integrity

Technical Library | 2019-02-20 16:35:24.0

The High Density Packaging (HDP) User Group has completed a project evaluating the high frequency loss impacts of a variety of imaged core surface treatments (bond enhancement treatments, including chemical bonding and newer low etch alternative oxides) applied just prior to press lamination. Initial high frequency Dk/Df electrical test results did not show a strong correlation with any of the methods utilized within this project to measured surface roughness. The more significant factor affecting the measured loss is the choice of pre-lamination surface treatment. Most of the new chemical treatment systems outperform the older existing systems which depend upon surface roughness techniques to promote adhesion.

Sanmina-SCI

Express Newsletter: the impact of new generation chemical treatment systems on high frequency signal integrity high density packaging user group (hdp) project (1094)

SMTnet Express - February 21, 2019

SMTnet Express, February 21, 2019, Subscribers: 31,686, Companies: 10,713, Users: 25,759 The Impact of New Generation Chemical Treatment Systems on High Frequency Signal Integrity Credits: Sanmina-SCI The High Density Packaging (HDP) User Group

SMTnet Express - March 24, 2016

SMTnet Express, March 24, 2016, Subscribers: 24,113, Companies: 14,735, Users: 39,910 High Frequency DK and DF Test Methods Comparison High Density Packaging User Group (HDP) Project Karl Sauter; Oracle Corporation, Joe Smetana; Alcatel


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Whizz Systems
Whizz Systems

Electronic manufacturing services - electronic design, development and manufacturing. Circuit board design, prototyping, FPGA services, signal integrity and simulation, pcb assembly. Factories in California USA and Malaysia.

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