Electronics Forum: thermally induced cracks in capacitors (19)

Rework induced thermal shock of SMD capacitors

Electronics Forum | Tue Dec 30 20:48:31 EST 1997 | Tom Gervascio

Has anyone had any experience with thermal shocking and cracking of SMD capacitors during the rework process? My company was advised to preheat capacitors to 125 C at a rate of 2 C/sec before replacing them onto boards. Would this maybe degrade c

Re: Rework induced thermal shock of SMD capacitors

Electronics Forum | Thu Jan 01 13:04:42 EST 1998 | scott cook

| Has anyone had any experience with thermal shocking | and cracking of SMD capacitors during the rework process? | My company was advised to preheat capacitors to 125 C | at a rate of 2 C/sec before replacing them onto boards. | Would this maybe

Industry News: thermally induced cracks in capacitors (3)

Updates in IPC-6018B Help Engineers Design High-reliability Boards Specification addresses growing field of microwave technology

Industry News | 2012-05-04 09:21:15.0

As printed boards evolve and chip speeds increase, the use of microwave technology in commercial applications, such as cell phone towers and in military products, is expanding.

Association Connecting Electronics Industries (IPC)

AI Technology, Inc (AIT) Develops Conformal Coatings to Protect Electronics in Extreme Environments

Industry News | 2014-10-14 11:36:35.0

AI Technology, Inc (AIT) Develops Conformal Coatings to Protect Electronics in Extreme Environments. AI Technology (AIT) is proud to present its improved Prima Protectâ„¢ coating line for moisture and salt fog protection.

AI Technology, Inc. (AIT)

Technical Library: thermally induced cracks in capacitors (1)

Reliability and Failure Mechanisms of Laminate Substrates in a Pb-free World

Technical Library | 2009-04-30 18:06:24.0

This presentation surveys the most significant via and via-related laminate failure mechanisms from past to present using data from current induced thermal cycling (CITC) testing, failure analysis, and other sources. The relative life and failure modes of thru vias, buried vias, and microvias (stacked vs. non-stacked) are compared, along with the affect of structure, materials, and peak temperatures on the above. The origin of via-induced laminate failures such as "eyebrow cracks" and Pb free related internal delamination is also explored.

i3 Electronics

Express Newsletter: thermally induced cracks in capacitors (393)

SMTnet Express - October 28, 2021

SMTnet Express, October 28, 2021, Subscribers: 26,544, Companies: 11,461, Users: 26,907 Cracks: The Hidden Defect Cracks in ceramic chip capacitors can be introduced at any process step during surface mount assembly. Thermal shock


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