Our systems are available as stand-alone workcells for laser marking, dot peen marking, engraving to special process applications such as laser stencil cutting, welding along with turnkey operations such as automated parts loading, packaging and asse
UV Laser Marking Machine for Glass and Ceramics LM-102 Power 3W/5W Optical maser wavelength 355nm Marking range 150mm×150mm Laser module life 20000 h Product description: UV Laser Marking Machine for Glass and Ceramics LM-102, Power 3W/
Electronics Forum | Tue Sep 18 16:48:55 EDT 2001 | jschake
Why do you think that assembling the BGA, QFP, and fine pitch parts will solve your bridging problem? I would think doing this may cause you more grief by having these more massive components being reflowed upside down fall off during the second pas
Electronics Forum | Fri Jul 10 14:23:23 EDT 1998 | Bob Willis
You can get a report and CD ROM on pin in hole reflow assembly from the SMTA main office in the USA. They also have a new report on Double Sided Reflow Design and Assembly. | Hi all . | Thanks to Ryan, Brian , Justin and Dave for the timely help ear
Industry News | 2009-12-17 18:14:12.0
Minneapolis, MN - The SMTA and Chip Scale Review magazine are pleased to announce the Best of Conference Paper from the 6th Annual International Wafer-Level Packaging Conference and Exhibition, which was held October 27-30, 2009 at the Marriott Hotel in Santa Clara, California. After review by members of the 2009 IWLPC Technical Committee, In-Soo Kang (NEPES Corporation) has been selected as the Best of Conference award winner for his technical paper on "Development of Wafer Level Package of Normal and High Pin Count Devices for Mobile Applications."
Industry News | 2008-03-07 11:47:13.0
Minneapolis**, MN*� The Annual Pan Pacific Microelectronics Symposium and Tabletop Exhibition that took place January 22-24, 2008 in Kauai, Hawaii was a great success. Speakers at the Pan Pacific Symposium promoted international technical exchange and joined in a diverse forum for extensive networking among microelectronics professionals from around the world.
Technical Library | 2013-07-03 10:31:54.0
It has been demonstrated in numerous pieces of work that stencil printing, one of the most complex PCB assembly processes, is one of the largest contributors to defects (Revelino et el). This complexity extends to prototype builds where a small number of boards need to be assembled quickly and reliably. Stencil printing is becoming increasingly challenging as packages shrink in size, increase in lead count and require closer lead spacing (finer pitch). Prototype SMT assembly can be further divided between industrial and commercial work and the DIYer, hobbyist or researcher groups. This second group is highly price sensitive when it comes to the materials used for the board assembly as their funds are sourced from personal or research monies as opposed to company funds. This has led to development of a lower cost SMT printing stencil made from plastic film as opposed to the more traditional stainless steel stencil used by industrial and commercial users.This study compares the performance of these two traditional materials and their respective impact on solder paste printing including efficiency and print quality.
Technical Library | 2009-01-21 23:01:49.0
Over the last 10 years, the adoption of wafer-level packaging (WLP) has expanded to a wide range of semiconductor devices applied in a crosssection of industries from Automotive to Mobile Phone, Sensors to Medical Technology.
Wafer-Level Packaged MEMS Switch With TSV Wafer-Level Packaged MEMS Switch With TSV by: Nicolas Lietaer, Thor Bakke, Anand Summanwar; SINTEF , Per Dalsjø, Jakob Gakkestad; Norwegian Defence Research Establishment (FFI), Frank Niklaus; KTH - Royal
A New Stencil Rulebook for Wafer Level Solder Ball Placement using High Accuracy Screen Printing A New Stencil Rulebook for Wafer Level Solder Ball Placement using High Accuracy Screen Printing Printer-hosted processes for solder ball placement
| https://www.smtfactory.com/How-to-clean-the-bottom-of-a-Full-auto-SMT-Stencil-Printer-stencil-automatically-online-id3873969.html
. For different printing machines, the cleaning of the Full-auto SMT Stencil Printer stencil can be divided into online automatic cleaning and offline manual cleaning at the bottom of the screen
| http://www.feedersupplier.com/sale-26799259-177055-dek-smt-parts-stencil-rope-dek-bom-cable-crimped-assembly-rais.html
Printer Parts 177055 DEK SMT PARTS Stencil Rope DEK BOM CABLE CRIMPED ASSEMBLY RAIS Basic Information Place of Origin: Germany Brand Name: DEK Model Number: 177055 Minimum Order Quantity
Golden State is a contract manufacturer that makes wire harnesses, electromechanical assemblies (box builds, subassemblies, PCBAs, kits, etc.) and services (sorting, rework, value additive manufacturing engineering)
18220 Butterfield Blvd
Morgan Hill, CA USA
Phone: 5102268155
