Industry Directory | Manufacturer
A Manufacturer of High Quality, Precision, Automated Fluid Dispensing and Conformal Coating Systems, SMT Cover Tape Peel Tester and Lead Forming machines for through-hole component preparation.
Industry Directory | Manufacturer
A US manufacturer of quality hand tools for those engaged in the repair, rework, R & D, testing, and assembly of electronic components and printed circuit boards from Through Hole to 2Mil Pitch Surface Mount.
Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl
Volumetric Dispense Pump - PCD Technology revolutionizes how you dispense and how you perceive dispensing. PCD - Progressive Cavity Displacement PCD is a continuously volumetric dispense pump based on the Progressive Cavity principle. PCD technolog
Electronics Forum | Sun Nov 23 20:37:36 EST 2014 | gregp
Hi J_Dub, thanks for the continued info...Of course selective soldering would be very time consuming for such a through hole assembly...but 18 minutes, wow...didn't realize selective soldering could take that long. I would like to know the approxima
Electronics Forum | Wed Sep 11 15:12:02 EDT 2013 | rway
"Do you think these machines are less appropriate for smaller lot sizes and PCB's with just a few through hole parts?" That depends. It will still save time if your lot sizes are small, as opposed to hand placement. I would not recommend buying an
Used SMT Equipment | Chipshooters / Chip Mounters
YAMAHA YG200 Refurbished High Speed SMT Machine Model YG200 Applicable PCB L330×W250 mm to L50×W50 mm Through-put (Optimum)
Used SMT Equipment | Pick and Place/Feeders
YAMAHA YG200 Refurbished High Speed SMT Pick And Place Machine Applicable PCB L330×W250 mm to L50×W50 mm Through-put (Optimum) 45,000 CPH, 0.08 sec/CHIP equivalent Mounting accuracy Yamaha's standard components Absolute accurac
Industry News | 2019-12-09 14:44:26.0
The SMT Reflow Soldering Equipment (Global) award was awarded to Heller Industries by Frost & Sullivan.
Industry News | 2014-09-06 19:18:17.0
Briefing Co-hosted by IPC as Part of Continuing Effort to Connect IPC Members with Policymakers.
Parts & Supplies | Assembly Accessories
Product name: YV100XG YAMAHAmulti-functional chip mounter Product number: YV100XG Products in detail YAMAHA multi-function chip mounter YAMAHAYV100XG High speed and high precisionmulti-function modular placement machine 0.18 seconds/CHIP ul
Parts & Supplies | Pick and Place/Feeders
YAMAHA NOZZLE SERIES Brand Model Specification Material of nozzle tip YAMAHA YV100II 31#NOZZLE 0402 / 0603 / 0805 (X) Tungsten steel YAMAHA YV100II 31#NOZZLE 0402 / 0603 / 0805 (X) Diamond steel YAMAHA YV100II 32#NOZZLE For IC of tiny size Tu
Technical Library | 2023-08-16 18:09:06.0
One of our customers involved with Electronics and Aerostructures requested a test to dispense Techspray Wondermask 2204 solder mask. The dispensing locations include large and small screw holes, single through-hole vias, and connector locations consisting of multiple through-hole vias. The process needed to run quickly and reliably.
Technical Library | 2012-12-17 22:05:22.0
Package on Package (PoP) has become a relatively common component being used in mobile electronics as it allows for saving space in the board layout due to the 3D package layout. To insure device reliability through drop tests and thermal cycling as well as for protecting proprietary programming of the device either one or both interconnect layers are typically underfilled. When underfill is applied to a PoP, or any component for that matter, there is a requirement that the board layout is such that there is room for an underfill reservoir so that the underfill material does not come in contact with surrounding components. The preferred method to dispensing the underfill material is through a jetting process that minimizes the wet out area of the fluid reservoir compared to traditional needle dispensing. To further minimize the wet out area multiple passes are used so that the material required to underfill the component is not dispensed at once requiring a greater wet out area. Dispensing the underfill material in multiple passes is an effective way to reduce the wet out area and decrease the distance that surrounding components can be placed, however, this comes with a process compromise of additional processing time in the underfill dispenser. The purpose of this paper is to provide insight to the inverse relationship that exists between the wet out area of the underfill reservoir and the production time for the underfill process.
This elevator format oven utilizes vertical space to accomodate curing applications of up to 4 hours while only occupying 96" (2.5m) of floorspace. Perfect for underfill and encapsulant.
Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Training Courses | | | IPC-6012 Specialist (CIS)
The Certified IPC-6012 Specialist (CIS) training covers design, fabrication and inspection of rigid printed boards.
Events Calendar | Wed Dec 01 00:00:00 EST 2021 - Wed Dec 01 00:00:00 EST 2021 | ,
Wine Down Wednesday: Driving Innovation through Intrapreneurship
Events Calendar | Mon Mar 18 00:00:00 EDT 2019 - Mon Mar 18 00:00:00 EDT 2019 | ,
Webinar: Stencil Design for Solder Paste, In Process Inspection & Process Defects
Career Center | Dorval, Quebec Canada | Production
Full time position 40 hrs week hourly wages to be discussed Manual solderer surface mount and through hole leaded and Rohs. 3 to 5 years experience Interview and test required ONLY QUALIFIED NEED APPLY
Career Center | Madison, Alabama USA | Engineering,Production
Performs electronic assembly functions on an as needed basis. Performs rework/replacement/placement operations on BGAs using various rework systems without doing damage to the assemblies. Performs X-ray inspection of BGAs using CRX-2000 real time
Career Center | Bangalore, India | Engineering,Maintenance,Production,Technical Support
SMT Stencil designing & Knowledge of full SMT process software known CAD/CAM -circuit CAM Pro 7.3,GC Power station, GCCAM Edit,Auto CAD, Fault finding of Electronic Boards & Servicing electronic machines.
Career Center | King, North Carolina | Management,Production,Quality Control
Production Supervisor Responsible for all aspects of department operations Directly supervised up to 80 team members Kaizen team leader 5S, Lean Manufacturing, working with Six Sigma tools Built team that continually produced 98% yields and Won
ATTENDANT WET CHEMICAL PROCESSES) Hole wall preparatio
Blackfox Training Institute, LLC | https://www.blackfox.com/tag/through-hole-soldering-training/
Through Hole Soldering training Archives - Blackfox Skip to content Blackfox Premier Training & Certification +1 (888) 837-9959 Search: Course Calendar Course Calendar 2024 IPC Certification IPC Courses IPC-A-600 IPC 7711/7721 IPC-A-6012 IPC 7711/7721 Recert IPC-A-610 IPC/WHMA-A-620 IPC-A-610 Recert IPC/WHMA-A-620 Recert J-STD-001
Lewis & Clark | https://www.lewis-clark.com/product-tag/through-hole-selective-solder/
Through Hole Selective Solder Archives - Lewis and Clark, Inc. Skip to content My Cart: $ 0.00 0 View Cart Checkout No products in the cart. Subtotal
