New SMT Equipment: to reduce solder bridging (20)

Click here to view the SlimKIC 2000 datasheet/KIC Thermal Profiling KIC2000

Click here to view the SlimKIC 2000 datasheet/KIC Thermal Profiling KIC2000

New Equipment | Reflow

Click here to view the SlimKIC 2000 datasheet Profiling So Easy, Anyone Can Do It By automating the complex task of process set up the SlimKIC® 2000™ makes profiling so easy that any operator can quickly achieve the optimal process. Simply select fro

T-KING Technology Co., Ltd.

USD4000/Click here to view the SlimKIC 2000 datasheet/KIC Thermal Profiling KIC2000

USD4000/Click here to view the SlimKIC 2000 datasheet/KIC Thermal Profiling KIC2000

New Equipment | Reflow

Click here to view the SlimKIC 2000 datasheet Profiling So Easy, Anyone Can Do It By automating the complex task of process set up the SlimKIC® 2000™ makes profiling so easy that any operator can quickly achieve the optimal process. Simply select fro

T-KING Technology Co., Ltd.

Electronics Forum: to reduce solder bridging (208)

Best pratice to reduce bridging on wave

Electronics Forum | Tue Jan 16 16:59:39 EST 2007 | realchunks

Pallet angle is usually pretty good. Lead length is also another good thing to keep as short as possible. Air Knives don't work that well. Also check your board. Make sure you have solder resist between each and every thru-hole pad. If the board

Best pratice to reduce bridging on wave

Electronics Forum | Tue Jan 16 20:44:07 EST 2007 | davef

Bridging Causes: Insufficient flux, Excessive pre-heat, High conveyor speed, Solder contamination Look here: * http://www.smtnet.com/library/files/upload/Reflow%20Wave%20Poster.pdf * http://smt.pennnet.com/Articles/Article_Display.cfm?Section=Archi

Used SMT Equipment: to reduce solder bridging (2)

Vitronics 6622CC  Wave soldering machine (2001)(Pb Free)

Vitronics 6622CC Wave soldering machine (2001)(Pb Free)

Used SMT Equipment | Soldering - Reflow

Vitronics 6622CC (Pb Free) Wave Soldering Machine Brand: Vitronics Model: 6622CC Vintage: 2001 Serial Number: 0103652201 LEADFREE unit Configured with Main Wave and Chip Wave Basic system according to General Specification (GS 235) CONTRO

Tekmart International Inc.

Speedprint SP710avi

Speedprint SP710avi

Used SMT Equipment | Screen Printers

Speedprint SP700 avi Specs: WATCH the performance of this system NOW on our website under VIDEOS Description: This machine is as new so we will provide Installation, training and full FIVE YEAR warranty. * High Precision Axes Linear rail & bel

4 Tech Electronics Inc.

Industry News: to reduce solder bridging (760)

MIRTEC to Preview the MP-520 Advanced System in Package (SiP) Inspection and Measurement System at SEMICON West 2015

Industry News | 2015-06-11 16:02:18.0

MIRTEC, "The Global Leader in Inspection Technology," will exhibit its most recent solutions for System in Package (SiP) inspection and measurement at SEMICON WEST 2015; July 14-16, 2015, at the Moscone Center in San Francisco, CA. Visitors are invited to booth # 2343 for a detailed demonstration of this exciting new technology.

MIRTEC Corp

Parts & Supplies: to reduce solder bridging (4)

DEK BOOM  BOARD CLAMPS 500MM

DEK BOOM BOARD CLAMPS 500MM

Parts & Supplies | Pick and Place/Feeders

101004 TRANSISTOR BC108 NPN 101020 POWER SUPPLY – UPRATED CURRENT 101047 SQUEEGEE MATERIAL 9.5 X 9.5 85-90 101081 CONNECTOR CIRCULAR 14WAY 97-3102A 101142 FRONT SQUEEGEE CARRIAGE 101143 OUTER MTG SQUEEGEE BLOCK 101145 COVER (TXT) 101146

Qinyi Electronics Co.,Ltd

DEK BOOM 500MM BOARD CLAMPS

DEK BOOM 500MM BOARD CLAMPS

Parts & Supplies | Pick and Place/Feeders

101004 TRANSISTOR BC108 NPN 101020 POWER SUPPLY – UPRATED CURRENT 101047 SQUEEGEE MATERIAL 9.5 X 9.5 85-90 101081 CONNECTOR CIRCULAR 14WAY 97-3102A 101142 FRONT SQUEEGEE CARRIAGE 101143 OUTER MTG SQUEEGEE BLOCK 101145 COVER (TXT) 101146

Qinyi Electronics Co.,Ltd

Technical Library: to reduce solder bridging (9)

NanoClear Coated Stencils

Technical Library | 2023-05-22 16:49:42.0

Our customers' issues • Apertures are getting smaller • Paste does not release as well • Contaminates the bottom of the stencil • Increases defects / reduces yield  Insufficient solder  Bridging  Solder balls on surface of PCB  Flux residue • Requires more frequent cleaning • Reduced efficiency (wasted time) • Increased use of consumables (cost)  USC fabric (use "cheap" fabric to reduce cost)  Lint creates more defects  Cleaning chemistries (use IPA to reduce cost)  IPA breaks down flux and can create more defects

ASM Assembly Systems (DEK)

Can Nano-Coatings Really Improve Stencil Performance?

Technical Library | 2017-10-26 01:18:49.0

Nano-coatings have been introduced by various manufacturers, with the promise of addressing some of the challenges relative to solder paste printing. Stated benefits include: Reduced underside cleaning, reduced bridging, improved solder paste release and improvements in yield. With several nano technologies already on the market and more likely to be introduced, how can the performance be quantified? How robust are these coatings? How can an assembler approach the ROI of these coatings? What hidden benefits or negative impacts should be considered? This paper will present a rigorous method for evaluating the performance and economic benefits of solder paste stencil nano-coatings.

FCT ASSEMBLY, INC.

Videos: to reduce solder bridging (36)

auto pcb screen printer , auto PCB stencil printer , PCB solder paste printer ,  PCB screen printer, SMT stencil printer

auto pcb screen printer , auto PCB stencil printer , PCB solder paste printer , PCB screen printer, SMT stencil printer

Videos

https://www.ascen.ltd/Products/Solder_paste_printer/513.html full auto PCB screen printer and SMT solder paste printing machine with Image and optical system,It is a very accurate fully automatic SMT stencil printer.automatic PCB screen printer main

ASCEN Technology

I.C.T | AOI Optical Inspection Machine For SMT Components and DIP Solder Joint

I.C.T | AOI Optical Inspection Machine For SMT Components and DIP Solder Joint

Videos

I.C.T Provide SMT Production Line solutions with Automated Optical Inspection (AOI) AOI is short for Automated Optical Inspection, which is widely used in the electronics industry to check the appearance of PCBA assembly at the back end of the cir

Dongguan Intercontinental Technology Co., Ltd.

Events Calendar: to reduce solder bridging (3)

Virtual Course: Cost Modeling Your Assembly Line or Factory to Reduce Costs & Improve Profitability

Events Calendar | Wed May 04 00:00:00 EDT 2022 - Wed May 04 00:00:00 EDT 2022 | ,

Virtual Course: Cost Modeling Your Assembly Line or Factory to Reduce Costs & Improve Profitability

Surface Mount Technology Association (SMTA)

SMTA International 2020 Conference & Exhibition

Events Calendar | Sun Sep 27 00:00:00 EDT 2020 - Thu Oct 01 00:00:00 EDT 2020 | Rosemont, Illinois USA

SMTA International 2020 Conference & Exhibition

Surface Mount Technology Association (SMTA)

Career Center - Resumes: to reduce solder bridging (2)

SMT QUALITY ENGINEER

Career Center | INDIA, India | Engineering,Quality Control

BACHELOR OF ENGINEERING IN ELECTRICAL AND ELECTRONICS ENGINEERING EXPERIENCE IN SURFACE MOUNT MANUFACTURING TECHNOLOGY.

Project Manager - Electronics Products

Career Center | , | Engineering,Production

Project Management, SMT Process Engineering

Express Newsletter: to reduce solder bridging (1007)

Partner Websites: to reduce solder bridging (8826)

PCB Bridging Defects - Heller

Heller Industries Inc. | https://hellerindustries.com/bridging-defects/

. Process and design-related causes of PCB Bridging Defects: Excessive volume of solder due to improper pad dimension Excessive volume of solder due to improper stencil aperture Improper application of solder mask Excessive slump of solder paste Reflow-related causes

Heller Industries Inc.

Vacuum Reflow Processing of Ball Grid Array Packages to Reduce Solder Joint Voiding and Improve Atta

Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5476

Vacuum Reflow Processing of Ball Grid Array Packages to Reduce Solder Joint Voiding and Improve Attachment Reliability 中文 MEMBERS LOGIN Membership Become a Member

Surface Mount Technology Association (SMTA)


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