Electronics Forum | Tue Dec 12 17:54:04 EST 2000 | ralph
I've had this problem myself, though in using water soluables. But the process to eliminate it is still the same. There are three possible causes for this to occure. Too much humidity, to much solder, and too much heat. Are you leaving the paste
Electronics Forum | Thu Feb 04 12:01:07 EST 2016 | g2garyg2
Hi Luis A white mask typically helps in the marking process since you are not reliant upon the PCB layers to create the contrast. Laser marking is really an etching process, so if your laser is set properly (power and focus) the goal with mask is to
Industry News | 2010-09-13 15:36:15.0
IPC — Association Connecting Electronics Industries® has released IPC-1601, Printed Board Handling and Storage Guidelines. The industry's sole standard on the handling, packaging and storage of printed boards, IPC-1601 provides users with guidance on how to protect printed boards from contamination, physical damage, solderability degradation, electrostatic discharge and moisture uptake.
Industry News | 2018-10-18 10:49:25.0
Panelizing PCBs with Tab Routing
Parts & Supplies | Pick and Place/Feeders
Many companies first applied SMT second-hand placement machines, and the selected placement machines were relatively stable, with low failure rate, easy maintenance, and important maintenance costs. Therefore, there are still many concerns about buyi
Parts & Supplies | Pick and Place/Feeders
Many companies first applied SMT second-hand placement machines, and the selected placement machines were relatively stable, with low failure rate, easy maintenance, and important maintenance costs. Therefore, there are still many concerns about buyi
SMTnet Express, February 24, 2022, Subscribers: 25,884, Companies: 11,526, Users: 27,073 Using X-Ray Systems To Detect Counterfeit And Reworked Electronic Components Much has been said and written about the accuracy of visual
Process optimization -Lead free wave soldering of simple to highly complex boards Process optimization Lead free wave soldering of simple to highly complex boards This research takes an in-depth look at the challenges encountered
Imagineering, Inc. | https://www.pcbnet.com/blog/identifying-and-correcting-solder-bridge-defects/
: No solder mask is present between adjacent pads Spacing of pads is too close Residue accumulation on the surface of a printed circuit board or stencil Misalignment during solder paste printing or
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