New Equipment | Selective Soldering
Setting the standard! All-in-one inline selective soldering machine for increased productivity, reliability, and ultimate flexibility. High quality, flexibility and reliabilty offered in a complete all-in-one package is what you get with the inline
PRO 1600 is a full forced air / nitrogen convection reflow oven that covers only 31" x 31" of floor space. It has been designed for reflow soldering of even the most challenging applications including, high thermal mass and lead free assemblies. PRO
Electronics Forum | Tue Nov 09 10:35:02 EST 1999 | WilDaly
Tim, I try to get 2-3 degrees C/sec (bottomside) rise on my boards through wavesolder. I like to get the topside to about 90-95 degrees C, but this is the optimum temp for the flux that I am using. To fast of a slope and you will burn your flux of
Electronics Forum | Tue Dec 16 15:43:50 EST 2003 | patrickbruneel
Kev, I looked up records of various hollis machines with 3 preheat zones. and with progressive preheat temp. of 300 400 and 500 with a speed of 3.5ft/min the topside board temp was 120C before entering the wave. the preheat elements were infrared. W
Used SMT Equipment | Soldering - Selective
Make: Nordson Model: Select Novo 102 Vintage: 2020 Description: Selective Solder Details: Lead-Free Titanium Solder Pot & Pump Assembly Solder Pot Capacity: 30 lbs Software: SWAK-OS 4.0 (Includes Automated Fiducial Alignment, Board Warp Compensa
Used SMT Equipment | Soldering - Reflow
7 top-side preheating zones, 3 top and bottom-side peak zones Cooling step 1, basic cooling from the top and bottom side Working width of 720mm Adjustable fan speed (cooling and peak zone) Temperature monitoring of the cooling zone Top and bottom-sid
Industry News | 2020-04-14 18:28:48.0
ITW EAE is introducing a patent pending option for the Camalot Prodigy dispenser that was developed to ensure process stability and increase yields for underfill applications. In applications where board heat is required, a constant product temperature through the dispense process is critical to ensure process stability and repeatability. Underfill materials vary in viscosity and filler types, therefore the heat requirement for the board also varies.
Industry News | 2020-04-14 18:49:39.0
EAE, the Electronic Assembly Equipment division of ITW is the proud recipient of an IPC APEX 2020 New Product Innovation (NPI) Award. The award recognizes the Electrovert DwellFlex 4.0 wave solder nozzle.
Technical Library | 2017-02-16 16:53:49.0
This experiment considers the reliability of a variety of different electronic components and evaluates them on 0.200” power computing printed circuit boards with OSP. Single-sided assemblies were built separately for the Top-side and Bottom-side of the boards. This data is for boards on the FR4-06 substrate.This paper was originally published by SMTA in the Proceedings of SMTA International.
46969 | https://hellerindustries.com/wp-content/uploads/2018/07/fluxwp.pdf
Heller Industries Inc.
| http://etasmt.com/cc?ID=te_news_bulletin,23761&url=_print
. The system does not require cooling water, water pumps, or disposable filters. The system works as follows: Flux laden gas is drawn out of the oven through a power exhaust positioned between topside reflow and cooling
