Industry Directory | Manufacturer
UWELLPCB.com is the PCB supplier. We offer PCB from single side board, double side PCB to 32layer board,including the Rigid PCB, Flex PCB, Rigid-flex PCB,Quick-turn prototype and PCB assembly
Industry Directory | Manufacturer
A printed circuit board manufacturer producing high quality prototype printed circuit boards.
New Equipment | Curing Equipment
A Pressure Cure Oven (PCO), or Autoclave, is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications. PCO pressurizes air into a rigid vessel and heats & cools with
Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl
Used SMT Equipment | Board Cleaners
Speedline Electrovert Aqueous Cleaning System In-line Cleaner Model: Aquastorm 200 (Torrid Zone) Year: 2004 S/N 480409 Prewash Module: 14" (36cm ) section Vee Jets staggered nozzles, 2 upper and 2 lower spray manifolds Valve switching to div
Used SMT Equipment | Board Cleaners
Speedline Electrovert Aqueous Cleaning System Brand: Speedline Model: Aquastorm 200 (Torrid Zone) Serial #: 480409 Year: 2004 Type: In-line Cleaner Prewash Module: 14" (36cm ) section Vee Jets staggered nozzles, 2 upper and 2 lower spray m
Industry News | 2011-01-12 17:48:44.0
GPD Global will highlight its Positive Cavity Displacement (PCD) Dispensing in Booth #6111 at the upcoming Automation and Technology West Expo (ATX), scheduled to take place February 8-10, 2011 at the Anaheim Convention Center in Anaheim, CA.
Industry News | 2011-02-04 01:47:14.0
GPD Global will highlight its Positive Cavity Displacement (PCD) Dispensing at the upcoming SMTA Dallas Expo & Tech Forum, scheduled to take place Tuesday, March 1, 2011 at the Richardson Civic Center in Richardson, TX.
Technical Library | 2020-07-15 18:49:03.0
Via Filling • Through Hole Vias - IPC-4761 – Plugging – Filling – Filled & Capped • MicroviaFilling and Stacked Vias
Technical Library | 2019-06-26 23:21:49.0
Copper-filled micro-vias are a key technology in high density interconnect (HDI) designs that have enabled increasing miniaturization and densification of printed circuit boards for the next generation of electronic products. Compared with standard plated through holes (PTHs) copper filled vias provide greater design flexibility, improved signal performance, and can potentially help reduce layer count, thus reducing cost. Considering these advantages, there are strong incentives to optimize the via filling process. This paper presents an innovative DC acid copper via fill formulation, for VCP (Vertical Continues Plating) applications which rapidly fills vias while minimizing surface plating.
General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.
Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl
Training Courses | | | IPC-6012 Specialist (CIS)
The Certified IPC-6012 Specialist (CIS) training covers design, fabrication and inspection of rigid printed boards.
Training Courses | | | IPC-6012 Trainer (CIT)
The Certified IPC-6012 Trainer (CIT) courses recognize individuals as qualified trainers in the area of design, fabrication and inspection of rigid printed boards and prepare them to deliver Certified IPC-6012 Specialist (CIS) training.
Events Calendar | Mon Feb 24 18:30:00 UTC 2020 - Mon Feb 24 18:30:00 UTC 2020 | Boxborough, Massachusetts USA
Chapter Technical Meeting: Challenges and Opportunities in Shrinking RDL Features: Microstructure Control of Copper Deposits for Improved Fill and Reliability
International Microelectronics Assembly and Packaging Society (IMAPS)
Career Center | , Florida USA | Sales/Marketing
Multinational Florida-based company seeks dynamic sales professional to fill the position of Regional Sales Manager. The qualified individual will have a strong background in electronic manufacturing services and sound knowledge of the electronic co
Career Center | Phoenix, Arizona USA | Production,Quality Control
Growing contract electronic manufacturer seeking to fill multiple positions: SMT Operator/Programmer Individual will determine and specify, revise and/or review, the most economic methods, operation sequence and tooling for the fabrication of pri
Career Center | Erode, Tamilnadu India | Engineering
Professional Summary 3+ years of experience in the PCB CAM engineering Exposure to FRONTLINE GENESIS 2000 Having exposure in UCAM Exposure to Create, Array & Panelize it for manufacturability Experienced in Creating impedance cou
SMTnet Express, July 16, 2020, Subscribers: 28,512, Companies: 11,045, Users: 25,964 Via In Pad - Conductive Fill or Non-Conductive Fill? Credits: Advanced Circuits In the early 2000s the first fine-pitch ball grid array devices became popular
SMTnet Express, June 27, 2019, Subscribers: 32,092, Companies: 10,819, Users: 24,882 Advanced Cu Electroplating Process for Any Layer Via Fill Applications with Thin Surface Copper Credits: MacDermid Inc. Copper-filled micro-vias are a key
GPD Global | https://www.gpd-global.com/co_website/heatConfigurations-max2.php
Dispensing Heated Underfill, Encapsulation, Glob top, COB, Dam & Fill Home Products Fluid Dispensing Equipment High Precision Dispenser -MAX Series Large Format Board Dispensing -DS Series Table Top Dispensing Equipment Loader
| https://www.eptac.com/webinars/plated-through-hole-fill-understanding-the-process-and-assembly-requirements/
Plated Through Hole Fill: Understanding the Process and Assembly Requirements - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
