1139 why use sn63% & pb 37 % in leaded solder paste results

Electronics Forum: why use sn63% & pb 37 % in leaded solder paste (2)

solder paste ingredients and their effects

Electronics Forum | Fri Feb 09 02:30:50 EST 2007 | Muhammad Haris

What are Resins, Solvents, Activators, and Thickening Agents in Solder Paste and what are their helpful and harmful effects? AND What are the purposes/properties and effects of Sn(Tin), Pb(Lead), Ag(Silver), Bi(Bismuth), In(Indium), Cu(Copper), Ni(

lead coalescence in solder joint

Electronics Forum | Wed Jan 30 08:30:33 EST 2002 | seto

Hello Dave, Mechanically the conection between the component pad and PCB pad is good (the solder joint is very strong). The problem is associated with poor contact after the use by the customer (vibration, temperature, etc). You can see the pictures

Industry News: why use sn63% & pb 37 % in leaded solder paste (1)

RoHS Guide in Electronics: RoHS, WEEE and Lead-Free FAQ

Industry News | 2018-12-08 03:24:24.0

RoHS Guide in Electronics: RoHS, WEEE and Lead-Free FAQ

Flason Electronic Co.,limited

Express Newsletter: why use sn63% & pb 37 % in leaded solder paste (1136)


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