Our company was founded in 2007, and is situated in the beautiful coastal port city - Qingdao, China. Our company has developed from a PCO service supplier to a modern enterprise engaged in the produc
RCM-H1000D series Desktop automatic centrifugal mixer-temperature recovery type One.piece use clause H1000D desktop automatic centrifugal mixer is based on current technology and safety standards: GB4793.1-2007 "Safety requirements for electrical eq
Honeywell International Honeywell International , headquartered in Morristown, New Jersey, is an American multinational company mainly engaged in the production of consumer electronics, engineering technology services and aerospace systems.Fortune 1
Electronics Forum | Wed Dec 03 16:38:33 EST 2008 | bandjwet
Estinates put the number of QFNs placed in 2007 at 17B devices
Electronics Forum | Tue Dec 09 11:51:51 EST 2008 | stepheniii
2007 too many 2008 way too many
Industry News | 2007-11-01 20:00:20.0
October 31, 2007, Florham Park, New Jersey � In continuation with its overall growth strategy, Heller Industries is pleased to announce the appointment of Mr. Wojtek Antoniak as Regional Sales Manager, Southeast Asia. Mr. Antoniak will be based in Singapore and will be responsible for sales management throughout Malaysia, Thailand, Vietnam as well as Singapore and the Philippines.
Industry News | 2015-05-18 10:27:49.0
Heller Industries has been awarded a 2015 SMT China Vision Award in the category of Reflow Soldering for its 1936 Mark 5 Reflow Oven. The award was presented during April 21, 2015 ceremony at the Shanghai World Expo Exhibition & Convention Center during NEPCON China 2015.
Device description: Machine Model: NXT-M3 Machine year: 2007 PCB Size: Minimum: 48mm X 48mm Max: 510mm X 534mm(dual track) Patch speed: H12HS: 22,500; H08:10,500; H04:6,500; H01:4,200 Paste accuracy: H12S/H08 / H04 :0.05 mm(3sigma) cpk ≥ 1.00 T
YV100II 1 KM5-M4510-10X MOTHER,KM5 2 KM5-M5880-01X D.POWER ASSY. 3 KM5-M4200-02X SYSTEM UNIT ASSY. 5 KL0-M53E2-00X TRANS1 ASSY KL0 8 KJ1-M5303-00X SW POWER MMR270 11 KM5-M5840-02X SERVO BOARD ASSY 12 KM5-M441H-02X VISION BOARD ASSY 13 KJ0-M58
Technical Library | 2012-12-17 22:05:22.0
Package on Package (PoP) has become a relatively common component being used in mobile electronics as it allows for saving space in the board layout due to the 3D package layout. To insure device reliability through drop tests and thermal cycling as well as for protecting proprietary programming of the device either one or both interconnect layers are typically underfilled. When underfill is applied to a PoP, or any component for that matter, there is a requirement that the board layout is such that there is room for an underfill reservoir so that the underfill material does not come in contact with surrounding components. The preferred method to dispensing the underfill material is through a jetting process that minimizes the wet out area of the fluid reservoir compared to traditional needle dispensing. To further minimize the wet out area multiple passes are used so that the material required to underfill the component is not dispensed at once requiring a greater wet out area. Dispensing the underfill material in multiple passes is an effective way to reduce the wet out area and decrease the distance that surrounding components can be placed, however, this comes with a process compromise of additional processing time in the underfill dispenser. The purpose of this paper is to provide insight to the inverse relationship that exists between the wet out area of the underfill reservoir and the production time for the underfill process.
Technical Library | 2020-11-04 17:49:45.0
OEMs and CMs designing and building electronic assemblies for high reliability applications are typically faced with a decision to clean or not to clean the assembly. If ionic residues remain on the substrate surface, potential failure mechanisms, including dendritic growth by electrochemical migration reaction and leakage current, may result. These failures have been well documented. If a decision to clean substrates is made, there are numerous cleaning process options available. For defluxing applications, the most common systems are spray-in-air, employing either batch or inline cleaning equipment and an engineered aqueous based cleaning agent. Regardless of the type of cleaning process adopted, effective cleaning of post solder residue requires chemical, thermal and mechanical energies. The chemical energy is derived from the engineered cleaning agent; the thermal energy from the increased temperature of the cleaning agent, and the mechanical energy from the pump system employed within the cleaning equipment. The pump system, which includes spray pressure, spray bar configuration and nozzle selection, is optimized for the specific process to create an efficient cleaning system. As board density has increased and component standoff heights have decreased, cleaning processes are steadily challenged. Over time, cleaning agent formulations have advanced to match new solder paste developments, spray system configurations have improved, and wash temperatures (thermal energy) have been limited to a maximum of 160ºF. In most cases, this is due to thermal limitations of the materials used to build the polymer-based cleaning equipment. Building equipment out of stainless steel is an option, but one that may be cost prohibitive. Given the maximum allowable wash temperature, difficult cleaning applications are met by increasing the wash exposure time; including reducing the conveyor speed of inline cleaners or extending wash time in batch cleaners. Although this yields effective cleaning results, process productivity may be compromised. However, high temperature resistant polymer materials, capable of withstanding a 180°F wash temperature, are now available and can be used in cleaning equipment builds. For this study, the authors explored the potential for increasing cleaning process efficiency as a result of an increase in thermal energy due to the use of higher wash temperature. The cleaning equipment selected was an inline cleaner built with high temperature resistant polymer material. For the analysis, standard substrates were used. These were populated with numerous low standoff chip cap components and soldered with both no-clean tin-lead and lead-free solder pastes. Two aqueous based cleaning agents were selected, and multiple wash temperatures and wash exposure times were evaluated. Cleanliness assessments were made through visual analysis of under-component inspection, as well as localized extraction and Ion Chromatography in accordance with current IPC standards.
03012522-02 DISTANCE SENSOR 03012539-01 Retrof.kit Discharge Choke Coil 03012564-03 SERVO AMPLIFIER TBS/3S1 03012565S01 SERVO AMPLIFIER TDS120A3Z-01 03012658-01 WASTE CONTAINER /COMPONENTSCARRIAGE 03012823-01 SLOTTED HOLE STRIP 03012985S01 DEFL
Training Courses | ON DEMAND | | IPC J-STD-001 Specialist (CIS)
The Certified IPC J-STD-001 Specialist (CIS) training focuses on the knowledge and hand skills employees need to produce high-quality soldered interconnections.
Training Courses | | | ESD Control Training Courses
Browse training and certification programs for electrostatic discharge (ESD) control in electronics assembly.
Career Center | Timisoara, timis Romania | Engineering,Maintenance,Technical Support
Working as a service engineer at ICCO EMT for more than 10 years experience in service activities in Eastern Europe for pick and place systems from Assembleon starting 2000 in all major EMS sites, beginning 2006 involved in evaluation (first system o
SIEMENS NOZZLE 2007 03057850-03 QYSMT Home About US ABOUT US FAQ SMT spare parts SMT Surplus equipments SMT peripheral equipments News Contact US My Cart Sign in Products NOZZLE 2007 Public Pricelist Public Pricelist NOZZLE 2007
Dage XD7500VR Xray System- 2007 - Lewis and Clark Skip to content My Cart: 0 View Cart Checkout No products in the cart. Subtotal: View Cart Checkout Lewis and Clark We Discover Equipment Opportunities NH