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Electronics Forum | Mon Aug 27 15:06:29 EDT 2001 | davef
This otta push Wolfgang over the top ... Recommended reading G.G. Harman, Wire Bonding in Microelectronics : Materials, Processes, Reliability, and Yield, 2nd edition, McGraw-Hill Electronic Packaging and Interconnection Series, 1997. G.G. Harman, R
Agilent-Keysight 86103A 2.8 GHz optical / 20 GHz electrical module The Agilent 86103A provides the ideal measurement system for testing SDH/SONET signals operating at 155 or 622 Mb/s or Fibre Channel 1063 Mb/s and Gigabit Ethernet 1250 Mb/s rat
JDSU FST-2802 Acterna Ethernet and Fibre Channel Services Module The FST-2802 is a handheld Ethernet, Fibre Channel, and IP services test instrument designed to meet the needs of service providers for turning up and troubleshooting these variou
Industry News | 2019-01-16 09:48:30.0
Nordson DIMA will exhibit its C-TurnFlux system, the automated stand-alone hot bar system that combines flux dispensing with hot bar reflow soldering, at the IPC APEX Expo, San Diego, CA - its first live demonstration in North America. The C-TurnFlux combines both high output and quality, using high-speed product handling and guaranteed position repeatability for mission-critical assembly applications.
P-Tools Key K88-M4926-400 YAMAHA Factory Tools Surface Mounter Module Type Mouting System KV7-M7210-00X CCD CAMERA YV100X MOVE CAM KGA-M7210-00X CCD CAMERA YV100XG MOVE CAM KG9-M7210-10X CCD CAMERA YV100II MOVE CAM KV8-M7310-00X L CAMERA AS
SIEMENS 6ES73401AH008BA CP340 COMM MOD SIEMENS 6ES73401AH008CA CP340 COMM MOD SIEMENS 6ES73401AH008EA CP340 COMM MOD SIEMENS 6ES73401AH010AE CP341 COMM MOD SIEMENS 6ES73401AH017EA CP341 COMM MOD SIEMENS 6ES73401BH000AE CP341 COMM MOD SIEMENS 6E
Technical Library | 2017-11-15 22:49:14.0
While a significant level of voiding can be tolerated in solder joints where electrical conductivity is the main requirement, voiding at any level severely compromises thermal conductivity. For example, in LED lighting modules effective conduction of heat through the 1st level die attach to the substrate and then through the 2nd level attach to the heat sink is critical to performance so that voiding in the solder joints at both levels must be minimized. (...) In this paper, the authors will review the factors that influence the incidence of voids in small and large area solder joints that simulate, respectively, the 1st and 2nd level joints in LED modules and discuss mitigation strategies appropriate to each level. They will also report the results of a study on the effect on the incidence of voids of flux medium formulation and the optimization of the thermal profile to ensure that most of the volatiles are released early in the reflow process.