50051 | http://www.kundasmt.com/a/PRODUCTS/2271.html
KD Electronics Ltd.
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/2271-underfill-voids
- Application Note 2271 Sample & Method Flip chip imaged on C-SAM at 300 MHz frequency. Ultrasound was gated on the chip-to-bump interface, a depth that also includes the cured underfill material