Fancort's Hot Bar Bonding and Soldering machines are easy to use, robust and economical for bonding flex to rigid assemblies such as Flex to PCB, LCD-Flex to PCB, Flex to LCD, HSC to LCD, HSC to PCB. Microprocessor based controller provides precis
IC'S, Hybrids SMT Silver glass curing BGA reflow Gold/tin reflow Package sealing with N2H2
Electronics Forum | Mon May 07 15:13:03 EDT 2001 | jdtpfacreate
Singh, The equipment varies in price. We make a wire bonder called the HW27U-H Wire Bonder. This is a gold to gold wire ball bonder. The substrate size you mention is within the area we can take into the machine. The key is the bonding area.
Electronics Forum | Mon Jul 11 12:42:46 EDT 2005 | machine designer
I need a good digital photo or two of the turret of a Siplace (or equiv) style SMD pick and place head preferably laden with die or SMD parts to explain a bulk handling concept to some machine neophytes here. I could alternatively use an image of any
Used SMT Equipment | Pick and Place/Feeders
Fuji AIm P&P Pacakge with 400+ Feeders, Vitronics Soltec XPM3-1030 Reflow Oven, Asys Conveyors! Make: Fuji Model: AIM Quantity: Three SW: V5.BZA Single lane Machine 1 Vintage: 2006 Heads: 4 @ H12’s, (4) Feeder Trollies Hours: 32
Industry News | 2003-02-27 08:41:52.0
Elec & Eltek International Co. Ltd. (
Industry News | 2023-11-27 12:51:49.0
The German DIE Bonder specialist Tresky GmbH is excited to introduce its latest product, the highly precise photonics bonder. The recently developed bonder is based on a new machine concept. The stable granite base, makes it one of the most precise placement systems on the market. This level of precision is indispensable, especially for use in nano- and optoelectronics.
Parts & Supplies | SMT Equipment
Smt nozzles Casio H06 H2 H32 HS1 nozzles used in pick and place machine Smt 8800 machine:HS1/HIM/H2/H2M/H06/H7/H07/H21/H22/H23/H24/H31/H32/H33/H34/H35 Smt nozzle Models: M1 7000 PICK UP NOZZLEφ1.5/φ0.45 M2 7000 PICK UPNOZZLEφ1.0/φ0.4 M7 7000 PI
Parts & Supplies | SMT Equipment
Smt nozzles Casio H06 H2 H32 HS1 nozzles used in pick and place machine Smt 8800 machine:HS1/HIM/H2/H2M/H06/H7/H07/H21/H22/H23/H24/H31/H32/H33/H34/H35 Smt nozzle Models: M1 7000 PICK UP NOZZLEφ1.5/φ0.45 M2 7000 PICK UPNOZZLEφ1.0/φ0.4 M7 7000 PI
The FINEPLACER® Lambda, a modularly designed bonder, provides a full range of process capabilities and multiple bonding technologies. Read more: http://eu.finetech.de/micro-assembly/products/fineplacerr-lambda.html
VP-2800HP-CL62-2H 2 heads 3x Analog cameras / HD camera upgrade possible 6 slot nozzle changer Optional dispenser head 62x 8mm CL Feeder slots in 2 bays 35x 8mm push feeder on West side included Optional paste / glue dispenser module Option
Are Separate Solder Flip-Chip Bonders Still Required? Are Separate Solder Flip-Chip Bonders Still Required? Increasing miniaturization is now encouraging manufacturers of handheld devices to stack bare dies or packages. As the process
| https://www.smtfactory.com/Samsung-Pick-And-Place-Machine-Development-History-id40845177.html
: Launched the SCM-120 high-speed pick and place machine 1992: Received the IR52 Chiang Young-sil Award (SCM-130) 1993: Started the development of wire bonders and was designated as the main developer of the "G7 project", and the high-speed pick and place
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$ 20.89 Purchase this product now and earn 2 Points! Divider, 15"W x 4-1/2"H, for use with hanging baskets, chrome plated finish quantity — OR — Add to cart Brand
