Electronics Forum | Wed Jun 27 21:05:48 EDT 2001 | davef
BGA Cycle 1: solder ball attach. BGA Cycle 2: BGA attach to board. BGA Cycle 3: BGA removal from board. BGA Cycle 4: BGA pad dress. BGA Cycle 5: BGA ball replacement. BGA Cycle 6: BGA re-attach to board. Board Cycle 1: BGA attach to board. Boar
Electronics Forum | Wed Jan 17 11:21:29 EST 2007 | BillW
I have been using overall combined DPMO of SMT PCBAs as a performance metric. All defects are recorded down to component location and defect category. The resultant defect data table is analyzed with detailed pivot tables, defect type and defect loca
Electronics Forum | Mon Aug 24 21:16:57 EDT 2020 | smith88
I am trying to teach a class and the question came up about loss of metalization of the Earth pad on a chip filter. This pad is on the side of the component. I can not find a IPC call out for this type of side termination other than 3 or 5 sided 9.1.
Electronics Forum | Mon Oct 09 17:49:29 EDT 2000 | sean
Hello John, The biggest stumbling block is going to be taking these responses and applying them to your assembly process much the same as trying to make other manufacturers' defect levels apply to your process. Ultimately, the overall quality of yo
Electronics Forum | Mon Oct 13 12:28:11 EDT 2003 | Andrea
Up until this point, my company has been hand soldering all of our assemblies. We are a high reliability manufacturer and work to the IPC-610 Class three/ target. We just received a Reflow Solder Batch Oven. It is a small oven, a Gold-Flow GF-B. I ha
Electronics Forum | Wed Nov 17 11:20:23 EST 1999 | Dave F
Hey Gyver: If you don�t mind (which you don�t have any choice about, because I�m going to do it anyhow, cause it�s MY word processor), I�m going to respond genericly, but still be directed to your question. Much of the following is paraphrased from
Electronics Forum | Mon Jan 12 21:31:26 EST 2015 | warwolf
The closer your inspection the more defects you will find, the more rework you do the possible cost you will add and the potential increase of damage you could do to your products if rework is not up to a machine copyable standard. "Is there any in
Electronics Forum | Thu Apr 12 01:11:12 EDT 2007 | Haris
Gull wing components are name on the pin/lead shape of the ICs like sop, qfp, pqf etc while plcc IC package is named on J-lead componets. Flat ribbon is of cable/wiring type and it is not a component,see this website. http://directory.jimtrade.com/2
Electronics Forum | Wed Nov 07 12:52:25 EST 2001 | burg5566
I am currently doing a research project for a College class and was curious if anyone had seen or is currently not using silkscreens on their PWB\PCBs. If so, what type of a repair process do you use?
Electronics Forum | Wed Jul 24 22:45:54 EDT 2002 | davef
WS609 is a wonderful paste. J-STD-001, 4.2 states words to the effect that for Class 3 products Type H or M fluxes should only be used for tinning operatins. Most water soluable fluxes are either H or M. I believe that you can use Type H or M flux
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