Industry Directory | Manufacturer's Representative
Camtech Circuits is ISO9001:2008 and UL certificated. We strictly implement ISO9001 quality management system. Each equipment, every process has its own Manual of Engineering Instructions. No matter p
New Equipment | Cleaning Equipment
Automatic SMT Stencil Cleaning Machine BMP-1000X Feature ▶The cleaning tank, the original tank, and the spray tank are designed with a liquid level sensor overflow alarm. ▶The opening of the front door is designed with photoelectric sensor protectio
Technic Releases CU128 - New Versatile Acid Copper for High-Speed PCB Plating Cranston RI: Technic is pleased to announce the release of Technic CU128, a newly developed acid copper plating process for both flexible and rigid PCB applications. CU1
Electronics Forum | Tue Jan 26 12:25:44 EST 2010 | blnorman
You can try a 5% solution of sulfuric acid. It's used to clean copper foils to IPC-TM-650 method 2.3.15 prior to testing for purity.
Electronics Forum | Tue Feb 02 16:57:33 EST 2010 | flipit
Like Dave said, you need to use an acid solution. This is what is used prior to HASL. You will think I am crazy but you can use vinegar or even catsup/ketchup. The acetic acid will clean the oxidation. Just rinse the board off before using.
Industry News | 2021-12-13 12:52:59.0
MacDermid Alpha Electronics Solutions will be exhibiting at the Taiwan Printed Circuit Association (TPCA) exhibition and will present at the IMPACT Conference, co-located with TPCA at the Nangang Exhibition Center Taipei, Taiwan, December 21-23, 2021.
Industry News | 2021-03-31 17:56:27.0
MacDermid Alpha Electronics Solutions will be a Supporting Partner at the upcoming IMAPS Device Packaging Conference being held virtually from April 12-15, 2021. MacDermid Alpha will highlight their entire portfolio of technologies from their MacDermid Enthone, Alpha, Kester, and Compugraphics brands essential to advanced semiconductor packaging and the markets it enables.
Technical Library | 2015-11-12 19:04:51.0
In order to provide the functionality in today’s electronics, printed circuit boards are approaching the complexity of semiconductors. For flexible circuits with 1 mil lines and spaces, this means no nodules, no pits, and excellent ductility with thinner deposits. One of the areas that has to change to get to this plateau of technology is acid copper plating. Acid copper systems have changed in minor increments since their introduction decades ago. However, the basic cell design using soluble anodes in slabs or baskets has for the most part remained the same. Soluble, phosphorized, copper anodes introduce particulate and limits the ability to control plating distribution.
Technical Library | 2019-06-26 23:21:49.0
Copper-filled micro-vias are a key technology in high density interconnect (HDI) designs that have enabled increasing miniaturization and densification of printed circuit boards for the next generation of electronic products. Compared with standard plated through holes (PTHs) copper filled vias provide greater design flexibility, improved signal performance, and can potentially help reduce layer count, thus reducing cost. Considering these advantages, there are strong incentives to optimize the via filling process. This paper presents an innovative DC acid copper via fill formulation, for VCP (Vertical Continues Plating) applications which rapidly fills vias while minimizing surface plating.
Nano-copper sintering in formic acid vapor.
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
SMTnet Express, November 12, 2015, Subscribers: 23,731, Members: Companies: 14,745, Users: 39,326 The Perfect Copper Surface Eric Stafstrom; Technic Inc. , Garo Chehirian; Tech-Etch In order to provide the functionality in today's electronics
Imagineering, Inc. | https://www.pcbnet.com/blog/what-is-the-pcb-fabrication-process/
. Electroplating, Stripping, and Etching With the conductive pattern and drilled holes exposed, the panel is placed into a copper plating bath containing sulfuric acid and copper sulfate
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_pcb-design-in-the-1970s_topic2333.xml
;The pad master was over-exposed to create the solder mask swell. The PCB’swhere created using the negatives to apply a temporary mask that protects partsof the copper laminate from acid and leaves the desired pattern
