Electronics Forum | Wed Aug 27 08:25:24 EDT 2008 | davef
We'd expect to see: * Solder starved connections at pads with large trace/pad areas. * Less reliable solder connections at pads that do not match the shape and size of the corresponding pads on the component.
Electronics Forum | Wed Aug 27 00:20:38 EDT 2008 | rameshr
Dear davef, Will u pls advice what are all the possible defects caused while soldering ( assembling ) this type of boards.
Electronics Forum | Wed Jul 14 16:59:52 EDT 2010 | swag
Solder paste on the pads will keep part aligned. If you do not use paste, you will need to apply tacky flux. You should not run without one or the other.
Electronics Forum | Fri Aug 22 00:20:29 EDT 2008 | rameshr
Hai, In our process we are using the micro bga of size 13X13mm of pitch 0.45mm,after soldering process the bga found collapsed, we absorbed that the PCB land pattern of the BGA was not in array, uneven distribution of pads (area) & most of the pads
Electronics Forum | Wed Oct 07 15:46:36 EDT 2020 | tamasmagyar
Hi Hearse, I currently use a MY600, with a AG Ejector which can place dots between 0.33 and 0.52 mm. The differences for a MY600 with placing small dots is down to ejector and paste. To be able to place dots as small as 0.25 mm, you would need an
Electronics Forum | Thu Mar 22 13:48:23 EDT 2007 | Gary
Sorry. I ment to send you to http://www.smttools.com/ Look at the BGA-100 scope.
Electronics Forum | Thu Dec 23 11:46:38 EST 1999 | g cronin
I am looking for a vendor for solder spheres and tack flux for BGA reballing. Preferibly on the east coast or new england area. My current distributors have them but require a min purchase of 200,000 that's a lot of balls!!!! thanks greg
Electronics Forum | Mon Dec 16 17:38:56 EST 2002 | davef
Baking boards in a nonvalue added activity. Quit doing it!!! As a routine production activity, it is either: * Totally unnecessary ... OR * Band-aid to cover for problems in fabrication, purchasing, or storage methods. Search the fine SMTnet Archi
Electronics Forum | Wed Jan 13 11:21:22 EST 1999 | Patrick O' Herlihy
Can anyone recommend ways of reducing damage to solder masks ... a new wick perhaps. I find that using standard wicks the imposed damage is un-acceptable. Also any good links on the subject of bga rework would be really appreciated in earnest ...
Electronics Forum | Mon Jan 18 20:51:29 EST 1999 | Dave F
| Can anyone recommend ways of reducing damage to solder masks ... a new wick perhaps. I find that using standard wicks the imposed damage is un-acceptable. | | Also any good links on the subject of bga rework would be really appreciated | | in ear
