Industry Directory: ag plating (4)

Remtec, Inc.

Industry Directory | Manufacturer

US manufacturer of metallized ceramic substrates & packages; specializing in PCTF (plated copper over thick film) & low cost AgENIG (silver with electroless nickel and immersion gold plating).

West-Tech Materials

Industry Directory | Manufacturer's Representative

Specialty materials for SMT Assembly. Solder Paste, Spheres, Tac Fluxes, Flip Chip Fluxes, Solder wi

New SMT Equipment: ag plating (16)

Printed Circuit Boards Fabrication.

Printed Circuit Boards Fabrication.

New Equipment | Fabrication Services

High Layer Count, High Complexity, High Reliability. At i3 Electronics, we offer the total package for your printed circuit board fabrication. We can design, manufacture, assemble, and test your PCB. Our specialty is high layer count, high complexi

i3 Electronics

AccuThermo AW 410  Rapid Thermal Processing (RTA/RTP/RTO/RTN)

AccuThermo AW 410 Rapid Thermal Processing (RTA/RTP/RTO/RTN)

New Equipment |  

The AccuThermo AW410 was derived from the AG Associates 610 production-proven design.  Allwin21 Corp. is the exclusive manufacturer of the AG Associates Heatpulse 610 desktop atmospheric RTP (Rapid Thermal Processing) system.  The system uses high in

Allwin21 Corp.

Electronics Forum: ag plating (127)

pcb plating

Electronics Forum | Sun Sep 15 21:44:41 EDT 2002 | jason

Hi Dave, Immersion Ag has poor surface appearances after reflow or rather tarnished, while Immersion Tin requries higher temp. Probably that's why Immersion Ag is more preferred.

Connector leads plating

Electronics Forum | Tue Dec 10 19:30:49 EST 2002 | Vijay

Hi Dave, The peak temp on the leads is 216-218 Deg C and duration above MP (179 degC) is 55-60 sec. Alloy(solder paste) used 62 Sn,36 Pb 2Ag (Alpha WS 609 Ty 3 Water eash) This is a SMT connector wth Gulwing leads Gold plating on the PCB is 2-5 micr

Used SMT Equipment: ag plating (1)

Ersa Ecoselect 350

Ersa Ecoselect 350

Used SMT Equipment | Soldering Equipment/Fluxes

The following Ersa Ecoselect 350 is a lead free selective solder system with various spares. It is included in the Manroland Online Auction scheduled for August 27-28 on www.xlineassets.com. This system will be sold to the highest bidder and is curre

X-Line Asset Management

Industry News: ag plating (39)

IPC, SOLDERTEC Conference to Address Hot Lead Free Topics

Industry News | 2003-03-03 08:48:54.0

The International Conference on Lead-Free Electronics on June 10-13, 2003, in Brussels, Belgium.

Association Connecting Electronics Industries (IPC)

IPC, SOLDERTEC Conference to Address Hot Lead Free Topics

Industry News | 2003-04-10 10:06:38.0

International Conference on Lead-Free Electronics on June 10-13, 2003, in Brussels, Belgium

Association Connecting Electronics Industries (IPC)

Parts & Supplies: ag plating (92)

Panasonic Glass N414RA101

Panasonic Glass N414RA101

Parts & Supplies | THT Equipment

Panasonic Glass N414RA101 Panasonic smt spare parts smt machine N510039711AA BOLT N510026714AA HANDLE N510017539AA BOLT KXFP6J9XA00 CABLE-SUPPORT N510017536AA BOLT N210130669AA PLATE N210130670AA PLATE N210123491AB BRACKET N210122562AB BR

Qinyi Electronics Co.,Ltd

Panasonic CIRCUIT PROTECTOR

Panasonic CIRCUIT PROTECTOR

Parts & Supplies | Pick and Place/Feeders

N210109230AD BLOCK N210093674AB PLATE N210068033AG COVER N210084787AB PLATE N210089397AC COVER N610072314AF PLATE N510044829AA LINEAR-WAY N510027883AD LINEAR-SCALE N510039150AA MOTOR N510039151AA MOTOR N510030563AA SPACER N986MMS410 PIN N

Qinyi Electronics Co.,Ltd

Technical Library: ag plating (4)

Assembly And Reliability Issues Associated With Leadless Chip Scale Packages

Technical Library | 2006-10-02 14:26:47.0

This paper addresses the assembly and reliability of 0.5 mm pitch leadless Chip Scale Packages (CSP) on .062" immersion Ag plated printed circuit boards (PCB) using Pb-free solder paste. Four different leadless CSP designs were studied and each was evaluated using multiple PCB attachment pad designs.

Universal Instruments Corporation

Effect of Process Variations on Solder Joint Reliability for Nickel-based Surface Finishes

Technical Library | 2014-11-06 16:43:24.0

This paper summarizes the results of recent investigations to examine the effect of electroless nickel process variations with respect to Pb-free (Sn-3.0Ag-0.5Cu) solder connections. These investigations included both ENIG and NiPd as surface finishes intended for second level interconnects in BGA applications. Process variations that are suspected to weaken solder joint reliability, including treatment time and pH, were used to achieve differences in nickel layer composition. Immersion gold deposits were also varied, but were directly dependent upon the plated nickel characteristics. In contrast to gold, different electroless palladium thicknesses were independently achieved by treatment time adjustments.

Atotech

Videos: ag plating (4)

Juki 2060 Vacuum Ejetor PN 40001266 Model V8X-AG-0.3B-JU

Videos

E1330717000  ZST SHUTTER GUIDE E1330721000  COVER FUR E133072100A  COVER FUR (ST) E133072100B  COVER FUR (ZN) E1330725000  COVER FUR E13307250B0  COVER (UPPER) SUB ASM. E1330725FA0  COVER (UPPER) ASM.(STB) E1331706000  FEEDING CAM PLATE E1331

Qinyi Electronics Co.,Ltd

GATE CONVEYOR | ILJIN CONVEYOR

GATE CONVEYOR | ILJIN CONVEYOR

Videos

This conveyor allows for contact with the engineer, for transportation to a work table for inspection. • SMEMA Interface • Durable structure with double base plate • Buzzer • Body: 810mm; Gateway: 600mm • Sliding with st

A-Tek Systems Group LLC

Express Newsletter: ag plating (214)

SnAgCuBi and SnAgCuBiSb solder joint properties investigations

SnAgCuBi and SnAgCuBiSb solder joint properties investigations SnAgCuBi and SnAgCuBiSb solder joint properties investigations This study investigates the technological properties of quaternary or quinary alloys made by addition Bi or Bi and Sb

Partner Websites: ag plating (19)


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