New Equipment | Assembly Services
PCB Assembly Equipment, PCB Machine, SMD/SMT Assembly, SMT assembly line, SMT plaeement line, automatic production line Semi-automatic SMT production lines ETA Electronic equipment Co., Ltd. To provide professional SMT automatic production line sol
New Equipment | Assembly Services
KULICKE & SOFFA 1419-3- WIRE BONDER PART MACHINE
Spec. : Al wedge wire bonder, Fine wire 25 to 50 micron meter diameter, Rotation head, 60kHz Ultrasonic, Bonding area 104x104 mm Remarks : Manual
For Wire Bonding (Wedge and Ball Bonding)
Dicer/ Wire Bonder/ Die Attached/ Prober/ Tester/ SEM/ Handler....etc.
The Bondjet BJ931 High Speed Fully Automatic Dual-Head Wedge Bonder meets the latest technology and flexibility demands for automotive and power electronics applications, handling thin and heavy aluminum, copper and gold wire and ribbon on two specia
3D Printers Rapid Prototyping Equipment Semiconductor Equipment - Rework Stations - Wire Bonders - Palomars, Orthodyne, Delvotec
New Equipment | Assembly Services
Suitable for wire bonder OEM service available.Factory price. Contact: yoyogong@yehengdz.com
New Equipment | Assembly Services
Packaging System for Semiconductor and Electronic Device Flip Chip Bonder is an equipment used in the semiconductor packaging process. It is a method of connecting individual chips of wafers so that the bumps on the chip and electrodes of the substr
New Equipment | Assembly Services
Suitable for OE 360C,360CH,360CHD bonders. Specification: 0.6/0.8mm 38/43° OEM service available.Factory price. Contact: yoyogong@yehengdz.com
