New Equipment | Education/Training
Get Ahead... Smart decisions and top-notch quality are critical to success — particularly in the highly competitive, ever-changing electronic interconnection industry. Training alone may help with your quality initiatives, but when key employees act
Electronics Forum | Wed Nov 18 14:42:22 EST 1998 | Dave F
| I heard somewhere that SMEMA has joined IPC, and that the association has decided to boycott Nepcon from | year 2000. Can anyone tell me if this is true | Nick: SMEMA and IPC are talking about merging (EP&P, 11/98, p 18). Below is a news release
Electronics Forum | Mon Jun 08 15:29:17 EDT 1998 | Gary Simbulan
| Earl, et al, | Boy things get old and cold around here fast. I promised more detail on my capactior problem and I thought I could drop something completely different in the same message and tell a tale of solder balls. | First the caps. We stil
Industry News | 2012-12-14 06:50:53.0
e IPC APEX EXPO® Technical Conference will cover two dozen technical topics in the areas of board fabrication, design and electronics assembly.
Industry News | 2013-11-01 16:09:44.0
Eric Chason, Ph.D., professor of engineering at Brown University, will present his tin whisker research at the 7th International Tin Whiskers Symposium, November 12–13 in Costa Mesa, Calif., hosted by IPC with academic partner CALCE.
Technical Library | 2017-10-16 15:03:32.0
The miniaturization and advancement of electronic devices have been the driving force of design, research and development, and manufacturing in the electronic industry. However, there are some issues occurred associated with the miniaturization, for examples, warpage and reliability issues. In order to resolve these issues, a lot of research and development have been conducted in the industry and university with the target of moderate melting temperature solder alloys such as m.p. 280°C. These moderate temperature alloys have not resolve these issues yet due to the various limitations. YINCAE has been working on research and development of the materials with lower temperature soldering for higher temperature application. To meet this demand, YINCAE has developed solder joint encapsulant paste to enhance solder joint strength resulting in improving drop and thermal cycling performance to eliminate underfilling, edge bonding or corner bonding process in the board level assembly process. This solder joint encapsulant paste can be used in typical lead-free profile and after reflow the application temperature can be up to over 300C, therefore it also eliminates red glue for double side reflow process. In this paper, we will discuss the reliability such as strength of solder joints, drop test performance and thermal cycling performance using this solder joint encapsulant paste in detail.
Technical Library | 2022-12-19 18:59:51.0
Material and Process Characterization studies can be used to quantify the harmful effects that might arise from solder flux and other process residues left on external surfaces after soldering. Residues present on an electronic assembly can cause unwanted electrochemical reactions leading to intermittent performance and total failure. Components with terminations that extend underneath the package can trap flux residue. These bottom terminated components are flush with the bottom of the device and can have small solderable terminations located along the perimeter sides of the package. The clearance between power and ground render high electrical forces, which can propagate electrochemical interactions when exposed to atmospheric moisture (harsh environments). The purpose of this research is to predict and understand the functional performance of residues present under single row QFN component packages. The objective of the research study is to develop and collect a set of guidelines for understanding the relationship between ionic contamination and electrical performance of a BTC component when exposed to atmospheric moisture and the trade-offs between electrical, ionic contamination levels, and cleanliness. Utilizing the knowledge gained from undertaking the testing of QFN components and associated DOE, the team will establish a reference Test Suite and Test Spec for cleanliness.
Events Calendar | Wed Apr 21 00:00:00 EDT 2021 - Wed Apr 21 00:00:00 EDT 2021 | ,
Oregon Chapter Tutorial: How Clean is Clean and How Do You Know for Sure?
Career Center | Beaumont, Michigan, Minnesota, Canada USA | Engineering
Infrared camera electronics design and camera design engineer. Manage electronic design, research and development, optimize current design, manage prototype design, fabrication and testing. Some optical design experience is preferred, but not not nec
Career Center | Grand Rapids, Michigan USA | Engineering,Maintenance,Management,Production,Research and Development,Technical Support
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Surface Mount Technology Association (SMTA) | https://www.smta.org/counterfeit/workshops.cfm
. Instructors deliver focused, in-depth presentations on topics of timely importance, based on their research and industry experience. PDC1: Training Course on Implementation of SAE AS6171 General Requirements and Associated Test Methods for Detection of Counterfeit Electronic Parts Michael H
| https://www.eptac.com/blog/industry-growth-means-more-soldering-jobs-in-electrical-and-electronics-manufacturing
Maximize Market Research , the global electronic contract manufacturing and design services market was valued at $375 billion in 2017, and by 2026 it is expected to reach $665.32 billion
