Industry Directory | Manufacturer
Global supplier of advanced thermal processing equipment and processes to the electronics assembly market.
New Equipment | Curing Equipment
Heller 788 In-line, Continuous Cure, Vertical Format Oven This elevator format oven utilizes vertical space to accomodate curing applications of up to 4 hours while only occupying 96" (2.5m) of floorspace. Perfect for underfill and encapsulant.
1809 MK5 - Heller Advanced In-Line Vacuum Reflow Oven Nitrogen System with Balanced Flow Technology 9 Top And Bottom Heated Zones - highest zone count per linear foot in the industry! 100" Heated Length - for super throughput! 2 Internal C
Electronics Forum | Wed Aug 14 16:30:55 EDT 2002 | sleech
Dan: Until I got deep into development of a vacuum assisted moisture removal process, I always thought that the bake process would be saddled by the lack of atmosphere in the chamber. I later learned that the conduction of temperature at reduced atm
Electronics Forum | Tue Jun 25 07:12:46 EDT 2002 | Daan Terstegge
Because BGA's are so hard to rework, you'll want the maximum process window for your reflow equipment, and this includes an inert atmosphere. But as long as solderability and temperature profile are well controlled you can have perfect results with a
Used SMT Equipment | Soldering - Reflow
Heating zones: 5 Cooling zones: 2 Total heating length: 66 in. Total cooling length: 26 in. Total process length: 127 in. Total on /off load length: 11 in. Overall system length: 138.5 in. Overall system width: 52 in. Overall system height: 5
Used SMT Equipment | Soldering - Reflow
Production Overview: The 1700 reflow soldering oven models support high mix / medium volume throughput… at speeds up to 24 inches (60 centimeters) per minute, while conserving valuable factory floor space. Rapid response times and precis
Industry News | 2003-05-06 08:21:44.0
Will address key issues in the
Industry News | 2009-12-08 15:08:44.0
Reinhausen Plasma will be presenting the first ever cold-active plasma tools at the productronica – the Plasmabrush, Piezobrush and Plasmadust. The innovative Plasmabrush and Piezobrush open up a whole range of new application fields with regard to the pre-treatment and activation of substrate surfaces.
Technical Library | 2019-06-11 09:36:13.0
An experiment was recently performed ACI Technologies for a customer that was interested in comparing the wetting of lead-free solders with varying temperature profiles and atmospheric conditions. In order to deliver an objective measurement of solder wetting (in addition to subjective inspection analysis), a simple wetting indicator pattern was added to the solder stencil in an area on the test vehicle that had exposed and unused copper.
Technical Library | 2007-11-08 17:35:46.0
A continuous furnace is ideal for processes requiring high production volumes, process consistency, and precision control. This overview discusses some of the newer temperature and atmosphere capabilities of continuous furnaces and addresses the various components that make up a continuous furnace.
This elevator format oven utilizes vertical space to accomodate curing applications of up to 4 hours while only occupying 96" (2.5m) of floorspace. Perfect for underfill and encapsulant.
1809 MK5 - Heller Advanced In-Line Vacuum Reflow Oven Nitrogen System with Balanced Flow Technology 9 Top And Bottom Heated Zones - highest zone count per linear foot in the industry! 100" Heated Length - for super throughput! 2 Internal C
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Article Return to Front Page A Low Temperature Alte
Article Return to Front Page A Low Temperature Alte
| https://www.smtfactory.com/I-C-T-LV733-LV-Series-Vacuum-Reflow-Oven-Machine-pd44543571.html
I.C.T LV Series Vacuum reflow oven unparalleled heating performance and temperature control system meets the requirements of various welding processes. PCB Width
