Industry Directory | Consultant / Service Provider / Manufacturer
Specializing in electronic circuit board assembly services. Various capabilities include engineering, assembly, designing, prototyping,supply chain management, testing, documentation, rework, repair and soldering. On-time delivery
New Equipment | Cable & Wire Harness Equipment
Application: Aluminum tube NTC thermistor temperature sensor probe assembly for coffee maker, cookie maker, bread maker, roaster, toaster and other food processing, especially for coffee maker heating tray, bake tray. Resistance @200C R
New Equipment | Cable & Wire Harness Equipment
Meat probe is used to measure the temperature of cooking food. Application includes home appliance and microwave oven, etc. Meat probe features: Stainless steel housing with sharpen tip for easily penetration into the food. Optional for straight st
Electronics Forum | Thu Mar 24 09:53:03 EST 2005 | aj
Doug, We are getting ready to do some trials at the moment. I have profiled the oven and achieved the Required Temps. that would be desirable. I dont envisage any problems what so ever aslong as who ever is doing the profile fully understands the
Electronics Forum | Sat Oct 03 20:01:32 EDT 1998 | Peter
We've had our SigmaPrint 500 machine since March 98. After two months of what seemed like being a beta site, SMTech (at that time) took care of all our issues (software) and now we are very happy with the machine. We haven't had a problem with it s
Industry News | 2014-02-18 17:19:16.0
EVS Internationalwill debut the newest system in its award-winning EVS series, the EVS 500 in Booth #2434 at the IPC APEX EXPO, scheduled to take place March 25-27, 2014 at the Mandalay Bay Resort & Convention Center in Las Vegas, Nevada.
Industry News | 2014-10-07 11:55:29.0
EVS International announces that its distributor, ITEC IBERICA KLD, will showcase the EVS 500 in Stand 4D08 at MATALEC, scheduled to take place Oct. 28-31, 2014 in Madrid, Spain.
TI New and Original TMP435ADGSR in Stock IC MSOP-10 , 22+ package TMP435ADGSR Multi-address remote and local temperature sensors with automatic beta, N-factor and series resistance correction Today's Hot Deals： SI3050-E1-FTR TSSOP20 SILICON
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
data fit Primary: Beta = 7.57, N63 = 830 Secondary: Beta = 0.84, N63 = 23, fraction = 18.4% Figure 14. Mixed Mode Weibull Fit for BGA56 Data with Voids The data for the assembly with typical voids (i.e. a void range of 1-10% of X-ray image area
