Industry News | 2015-05-07 19:28:29.0
MIRTEC announce a new strategic cooperation that will empower yield improvement in the electronics manufacturing industry.
Industry News | 2024-03-11 15:00:03.0
Connect with our experts and see plasma and dispensing equipment for microelectronics manufacturing in booth 3645
Industry News | 2012-03-30 18:48:18.0
Engineered Material Systems, a leading global supplier of electronic materials for circuit assembly applications, debuts its 357-348 Wire Bond Encapsulant and Flexible Circuit Bonding Adhesive for printer head and circuit assembly applications.
Industry News | 2014-09-05 13:53:06.0
AI Technology, Inc (AIT) Develops Temporary Bonding Wax for Precision Wafer and Substrate Back-grinding and Thinning Applications. AI Technology, Inc. (AIT) has recently developed a series of temporary wax-like media that has been proven to be useful in many of these thinning applications.
Industry News | 2013-06-12 18:03:39.0
Engineered Material Systems, announces the debut of its 357-284 Wire Bond Encapsulant and Flexible Circuit Bonding Adhesive for printer head and circuit assembly applications.
Industry News | 2021-04-09 02:12:31.0
The reaction between the plasma surface treatment machine and the surface of the material is both physical and chemical. Through the reaction, the surface of the material will become rough, and at the same time, the oxide can be reduced, making the surface of the material hydrophilic and cohesive. Dyeability, biocompatibility and electrical properties have been greatly improved.
Industry News | 2014-11-07 10:35:14.0
AI Technology is proud to announce that it will be attending two conferences this November. The first conference AIT will be attending is the International Wafer-Level Packaging Conference (IWLPC), November 11-12 at the Double Tree Hotel in San Jose, CA. This year, AIT's own Dr. Frederick Lo will be presenting his paper, Recent Advances in Die Attach Film.
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Industry News | 2021-12-15 20:08:31.0
Siemens pressure transmitter is a kind of equipment which converts pressure into pneumatic signal or electric signal for control and remote transmission. It can convert the physical pressure parameters such as gas and liquid sensed by the load cell sensor into standard electrical signals (such as 4 ~ 20mADC), which can be supplied to the secondary instruments such as indicating alarm instrument, recorder and regulator for measurement, indication and process adjustment.
Industry News | 2021-01-17 17:50:26.0
The Assembly Division of MacDermid Alpha Electronics Solutions announces the release of ALPHA HiTechUnderfills and Cornerfills with high Transition Glass Temperature (Tg), Low Coefficient Thermal Expansion (CTE), and excellent thermal cycling (TCT) performance. The attributes provide formulation flexibility to enhance product performance in various applications.
