Electronics Forum | Thu Feb 11 14:36:42 EST 1999 | Evelyn York
Hey, has anybody experienced problems with solder balls falling off BGA's? I have not been able to identify a contaminant nor any physical problems that would cause this. On packages with 'good' adhesion I have not observed any intermetallic form
Electronics Forum | Thu Jul 05 10:45:01 EDT 2001 | dougie
Steven, There is a load of info on this if you check through the archives. Quick pointer though are: Solder balls are caused by paste creeping under the component at placement. The part is placed and the paste is squashed under the component, when t
Electronics Forum | Mon Jul 16 15:49:33 EDT 2001 | Steve
The solder balls you are talking about are caused by too much paste. Reduce the size of the stencil aperatures. Concerning removing the solder balls, the first thing you need to ask yourself is, do I need to remove them. IPC-610, 12.4.10 states, "Ac
Electronics Forum | Fri Jul 06 04:02:28 EDT 2001 | eliishee
Thanks guys for all the input. i'm still struggling to find out the main cause. at time being, urgently need a suggestion of a effective way to remove all these solder balls. THANKS AGAIN.
Electronics Forum | Mon Jul 16 21:29:03 EDT 2001 | davef
Cleaning RMA with water is bad news. It will turn your solder connections white and remove none of the RMA residues. There was a thread on removing RMA within the past two weeks on SMTnet. Check the fine SMTnet Archives. Additionally, look at M
Electronics Forum | Tue Jul 17 15:13:53 EDT 2001 | mparker
Dave - I agree that the U shape for QFP's sounds a bit whacked, for the reasons you state. It may work OK for larger pitchs but then again there are a myriad of fixes that work before resorting to U shapes. With the U shape removing paste from under
Electronics Forum | Wed Nov 01 09:01:55 EST 2000 | Thomas Ballhausen
Since your problem has been posted quite some time ago I am eager to know, if you have got any clue. One of my customers recently claimed our 313-PBGA causing problems, as one of its balls (randomly) is almost dewetting. So no evidence is found by x-
Electronics Forum | Mon Nov 02 17:45:46 EST 1998 | ChrisK
In my experience, solder balls are normally caused by only a few things. In order of likelyhood: 1) Water based fluxes (VOC-Free)not having the water carrier completely dried from the board before going into the solder. I.E, too fast conveyor spee
Electronics Forum | Thu Oct 30 19:59:05 EDT 2008 | gregoryyork
solder ball was caused by hasl process not reflow. seen before many times, look around wells of smt on bare boards should be more of them
Electronics Forum | Thu Jun 24 14:34:13 EDT 2004 | tjensen
There are many factors that can lead to solder balls. Since you have just recently seen this start to occur, it is obvious something has changed in the product or your process. Since we don't have a lot of details about your process, I would sugges
