New SMT Equipment: comb test (30)

AB Allen Bradley 1746-NIO4I Analog Current Comb Module SLC 500

AB Allen Bradley 1746-NIO4I Analog Current Comb Module SLC 500

New Equipment | Industrial Automation

Contact Cherish Zhang  Email: sales6@cambia.cn Wechat/skype/Mobile: +86 18030270289 (If  you need ,don’t hesitate to contact us) Our services  Packing & Delivery 1)100% full New! - Original Factory Seal ! 2)Warrant

Cambia Automation Limited

HONEYWELL 621-2100RC OUTPUT MODULE

HONEYWELL 621-2100RC OUTPUT MODULE

New Equipment | Industrial Automation

  Sandy.[mailto:unity@mvme.cn]    Sandy.[WhatsApp/Skype/Mobile:+8618020776786]     Sandy.[Quote to you within the shortest possible time with our best price]   Warranty: up to 12 months Shipping: fast delivery is available NEW+ORIGINAL+IN STOCK+ONE

XIAMEN YUEHANG COMPUTER ENGINEERING CO.LTD.

Electronics Forum: comb test (19)

No-Clean Solder

Electronics Forum | Mon Mar 05 15:29:50 EST 2007 | ck_the_flip

When no-clean flux and no-clean soldering first came out in the late 80's / early 90's, there were lots of White Papers written about conformal coating adhesion and no-clean flux. I'm pretty sure all CC's will adhere to today's chemistries. To be o

SIR Testing

Electronics Forum | Tue Jul 04 02:31:55 EDT 2006 | Mustang

Calling for an input from the Experts our there. Our customer is questioning the cleanliness of the no-clean product that we produced for them. We were asked to clean the board (localised cleaning) after rework (IC need to be changed due to an up re

Used SMT Equipment: comb test (3)

Anritsu See Below

Used SMT Equipment | In-Circuit Testers

 Anristu systems available: -Anritsu MD8470A Signaling Tester -Anritsu MF6900A Fading Simulator - LTE -Anritsu MD8430A LTE Signaling Tester -Anritsu MN4763B RF Combiner -Anritsu MN7484B RF Interface Unit -Anritsu MN7462A RF Interface -Anritsu

R-1 Source, Inc. dba World Equipment Source

Anritsu See Below

Used SMT Equipment | In-Circuit Testers

Anristu systems available: -Anritsu MD8470A Signaling Tester -Anritsu MF6900A Fading Simulator - LTE -Anritsu MD8430A LTE Signaling Tester -Anritsu MN4763B RF Combiner -Anritsu MN7484B RF Interface Unit -Anritsu MN7462A RF Interface -Anritsu M

R-1 Source, Inc. dba World Equipment Source

Industry News: comb test (3)

Saelig Introduces TekBox TBCGx Comb Generators For EMC Testing

Industry News | 2017-07-14 13:24:26.0

Saelig Company announces the availability of two new TekBox TBCGx Comb Generators for EMC testing. The TBCG1 is a radiating comb generator with an internal dipole antenna and a base frequency of 100MHz. It radiates a comb spectrum that is characterized up to 6GHz. The comb generator is intended as a quick reference for testing radiated noise measurements in anechoic chambers, TEM/GTEM cells, shielded chambers, or to gauge the effectiveness of cable shielding and other shielding materials.

Saelig Co. Inc.

Gen3 Systems to Present SIR Intercomparison to Validate the use of a Fine Pitch Pattern

Industry News | 2017-02-09 08:35:06.0

FARNBOROUGH, UK ― February 2017 ― Gen3 Systems Limited, a specialist British manufacturer and distributor, is pleased to announce that its Chief Technology Officer Dr Chris Hunt will present the paper titled “SIR intercomparison to validate the use of fine pitch pattern” at the upcoming IPC APEX EXPO. The presentation will be held during the session titled “SIR/Flux Reliability” on Tuesday the 14th February between 15:30 – 17:00pm in location 4.

Gen3 Systems

Parts & Supplies: comb test (4)

Juki ORIGINAL SMT MACHINE SPARE PARTS JUKI 40044557 1070 1080 2070 2080 XY RELAY PCB

Juki ORIGINAL SMT MACHINE SPARE PARTS JUKI 40044557 1070 1080 2070 2080 XY RELAY PCB

Parts & Supplies | SMT Equipment

ORIGINAL SMT MACHINE SPARE PARTS JUKI 40044557 1070 1080 2070 2080 XY RELAY PCB JUKI Nozzle Specifications: Brand Name JUKI XY RELAY PCB Part Number 40044557 Model Number Ensure Tested buy juki Guarantee 1 month usage for machine KE2070

KingFei SMT Tech

Panasonic Panasonic CM402 602 Mounter accessories 24 32MM Feeder bird's beak pawl COMB KXFA1PT1A02

Panasonic Panasonic CM402 602 Mounter accessories 24 32MM Feeder bird's beak pawl COMB KXFA1PT1A02

Parts & Supplies | Assembly Accessories

Panasonic CM402 602 Mounter accessories 24 32MM Feeder bird's beak pawl COMB KXFA1PT1A02 Panasonic CM402 602 Mounter accessories 24 32MM Feeder bird's beak pawl COMB KXFA1PT1A02 Ms:Mandy Email:info@smtlinemachine.com Mb/whatsapp/wechat:

CNSMT CO.LTD

Technical Library: comb test (32)

The Risk And Solution For No-Clean Flux Not Fully Dried Under Component Terminations the Risk And Solution For No-Clean Flux Not Fully Dried Under Component Terminations

Technical Library | 2020-11-24 23:01:04.0

The miniaturization trend is driving industry to adopting low standoff components or components in cavity. The cost reduction pressure is pushing telecommunication industry to combine assembly of components and electromagnetic shield in one single reflow process. As a result, the flux outgassing/drying is getting very difficult for devices due to poor venting channel. This resulted in insufficiently dried/burnt-off flux residue. For a properly formulated flux, the remaining flux activity posed no issue in a dried flux residue for no-clean process. However, when venting channel is blocked, not only solvents remain, but also activators could not be burnt off. The presence of solvents allows mobility of active ingredients and the associated corrosion, thus poses a major threat to the reliability. In this work, a new halogen-free no-clean SnAgCu solder paste, 33-76-1, has been developed. This solder paste exhibited SIR value above the IPC spec 100 MΩ without any dendrite formation, even with a wet flux residue on the comb pattern. The wet flux residue was caused by covering the comb pattern with 10 mm × 10 mm glass slide during reflow and SIR testing in order to mimic the poorly vented low standoff components. The paste 33-76-1 also showed very good SMT assembly performance, including voiding of QFN and HIP resistance. The wetting ability of paste 33-76-1 was very good under nitrogen. For air reflow, 33-76-1 still matched paste C which is widely accepted by industry for air reflow process. The above good performance on both non-corrosivity with wet flux residue and robust SMT process can only be accomplished through a breakthrough in flux technology.

Indium Corporation

The Risk And Solution For No-Clean Flux Not Fully Dried Under Component Terminations the Risk And Solution For No-Clean Flux Not Fully Dried Under Component Terminations

Technical Library | 2020-11-24 23:01:04.0

The miniaturization trend is driving industry to adopting low standoff components or components in cavity. The cost reduction pressure is pushing telecommunication industry to combine assembly of components and electromagnetic shield in one single reflow process. As a result, the flux outgassing/drying is getting very difficult for devices due to poor venting channel. This resulted in insufficiently dried/burnt-off flux residue. For a properly formulated flux, the remaining flux activity posed no issue in a dried flux residue for no-clean process. However, when venting channel is blocked, not only solvents remain, but also activators could not be burnt off. The presence of solvents allows mobility of active ingredients and the associated corrosion, thus poses a major threat to the reliability. In this work, a new halogen-free no-clean SnAgCu solder paste, 33-76-1, has been developed. This solder paste exhibited SIR value above the IPC spec 100 MΩ without any dendrite formation, even with a wet flux residue on the comb pattern. The wet flux residue was caused by covering the comb pattern with 10 mm × 10 mm glass slide during reflow and SIR testing in order to mimic the poorly vented low standoff components. The paste 33-76-1 also showed very good SMT assembly performance, including voiding of QFN and HIP resistance. The wetting ability of paste 33-76-1 was very good under nitrogen. For air reflow, 33-76-1 still matched paste C which is widely accepted by industry for air reflow process. The above good performance on both non-corrosivity with wet flux residue and robust SMT process can only be accomplished through a breakthrough in flux technology.

Indium Corporation

Express Newsletter: comb test (757)


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