Industry News | 2013-09-12 15:39:02.0
Subject-matter experts will provide insights into electronics reliability challenges during the IPC Conference on Solder and Reliability in Costa Mesa, Calif., November 13–14.
Industry News | 2013-10-01 18:21:25.0
IPC — Association Connecting Electronics Industries® and its educational partner, CALCE® (Center for Advanced Life Cycle Engineering) at the University of Maryland, will host the 7th International Symposium on Tin Whiskers, November 12–13, 2013, in Costa Mesa, Calif.
Industry News | 2013-10-28 16:31:54.0
IPC Conference on Solder and Reliability: Materials, Processes and Tests, November 13–14 in Costa Mesa, Calif.
Industry News | 2013-11-01 16:09:44.0
Eric Chason, Ph.D., professor of engineering at Brown University, will present his tin whisker research at the 7th International Tin Whiskers Symposium, November 12–13 in Costa Mesa, Calif., hosted by IPC with academic partner CALCE.
Industry News | 2012-07-04 17:23:11.0
— IPC — Association Connecting Electronics Industries® invites experts to submit abstracts for the IPC Symposium on Lean for the Electronics Assembly Industry: Putting Theory to Practice.
Industry News | 2013-05-15 11:48:55.0
IPC – Association Connecting Electronics Industries® and the Center for Advanced Life Cycle Engineering (CALCE) at the University of Maryland have issued a call for papers for the 7th International Symposium on Tin Whiskers.
Industry News | 2012-10-18 16:35:40.0
IPC — Association Connecting Electronics Industries®, the event brings participants face-to-face with electronics industry experts who have successfully executed lean practices within their own organizations.
Industry News | 2023-06-07 19:51:18.0
Funds would help ensure success of the CHIPS Act and Biden's "Presidential Determination" on PCBs
Industry News | 2003-02-21 08:45:28.0
The Costa Mesa facility has achieved the highest level of qualification for line width (2 mils) and spacing (3 mils) to date.
Industry News | 2013-11-08 18:26:23.0
AIM Solder announces today that Carlos Tafoya, International Technical Application Manager, is to present "Alternative Lead-Free Alloys for SMT Assembly" at the IPC Conference on Solder and Reliability: Materials, Processes and Tests, held November 13-14th, 2013 in Costa Mesa, CA. The presentation is scheduled on Wednesday, November 13 at 3:00 pm.
